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THN31 Secure Element version 1.0
2021-1-INF-4210 		NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
BSI-DSZ-CC-1072-V3-2019
name THN31 Secure Element version 1.0 NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
scheme ES DE
status active archived
not_valid_after 06.01.2029 03.12.2024
not_valid_before 06.01.2024 03.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-01_Certificado.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-01_INF-4210.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2021-01_ST_lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1072V3b_pdf.pdf
manufacturer Beijing TsingTeng MicroSystem Co.,Ltd. NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
manufacturer_web https://www.tsingtengms.com/sy https://www.nxp.com
security_level EAL5+, ALC_DVS.2, AVA_VAN.5 EAL6+, ALC_FLR.1, ASE_TSS.2
dgst 90e5b81740b63970 5fb51bc20f02913c
heuristics/cert_id 2021-1-INF-4210 BSI-DSZ-CC-1072-V3-2019
heuristics/cert_lab [] BSI
heuristics/extracted_sars ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.4, ALC_TAT.2, ASE_REQ.2, ATE_IND.2, ASE_CCL.1 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/extracted_versions 1.0 -
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-1072-V4-2021
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1072-V2-2019
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-23-66030-CR, BSI-DSZ-CC-1072-V4-2021, BSI-DSZ-CC-1072-V5-2022
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0955-2016, BSI-DSZ-CC-1072-2018, BSI-DSZ-CC-0955-V2-2016, BSI-DSZ-CC-1072-V2-2019
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 06.01.2024
  • enhanced:
  • manufacturer: BEIJING TSINGTENG MICROSYSTEM CO.,LTD.
  • product: THN31 Secure Element version 1.0
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/1002-thn31-secure-element-version-1-0
pdf_data/cert_filename 2021-01_Certificado.pdf 1072V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072-V3-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
  • ASE:
    • ASE_TSS.2: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP: 1
    • NXP Semiconductors: 1
pdf_data/cert_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 894051
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20191205125022+01'00'
  • /Creator: Writer
  • /Keywords: NXP, Secure Smart Card Controller, P6021y VB*, NXP Semiconductors Germany GmbH
  • /ModDate: D:20200108095848+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated SoftwarefromNXP Semiconductors Germany GmbH
  • /Title: Certificate BSI-DSZ-CC-1072-V3-2019
  • pdf_file_size_bytes: 296536
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 2021-01_INF-4210.pdf 1072V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1072-V3-2019
    • cert_item: NXP Secure Smart Card Controller P6021y VB* including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-S-0201-2022: 1
  • ES:
    • 2021-1-INF-4210- v2: 1
  • DE:
    • BSI-DSZ-CC-1072-V2-2019: 2
    • BSI-DSZ-CC-1072-V3-2019: 19
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 2
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 1
    • EAL2: 2
    • EAL4: 2
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 4
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_COP.1: 2
    • FCS_RNG.1: 1
  • FDP:
    • FDP_ITT.1: 1
    • FDP_SDC.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 7
  • R:
    • R.O: 7
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 27
    • NXP Semiconductors: 28
pdf_data/report_keywords/eval_facility
  • Applus:
    • Applus Laboratories: 6
  • TUV:
    • TÜV Informationstechnik: 8
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • TDES: 3
  • AES_competition:
    • AES:
      • AES: 9
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 1
      • Triple-DES: 4
    • DES:
      • DES: 3
  • constructions:
    • MAC:
      • CBC-MAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • RSA:
    • RSA-CRT: 4
pdf_data/report_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 3
pdf_data/report_keywords/crypto_scheme
  • PKE:
    • PKE: 1
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • TRNG:
    • TRNG: 2
  • RNG:
    • RNG: 4
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 5
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 8
pdf_data/report_keywords/crypto_library
  • Generic:
    • Crypto Library 2.1.0: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • malfunction: 1
  • other:
    • JIL: 1
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 1
pdf_data/report_keywords/standard_id
  • ISO:
    • ISO/IEC 7816: 4
  • PKCS:
    • PKCS #1: 1
  • BSI:
    • AIS 1: 1
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • Card Controller P6021y VB Evaluation Reference List, Version 2.5, 2019-11-20, NXP Semiconductors (confidential document) [19] NXP Secure Smart Card Controller P6021y VB Configuration List, Version 1.5, 2019-08-09, NXP: 1
    • Corp, Hsinchu, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [23] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Production), Systems on: 1
    • Corporation, Hsinchu, Version 1, 2019-09-02, TÜV Informationstechnik GmbH (confidential document) [21] SITE TECHNICAL AUDIT REPORT (STAR), Production (Data Prep, Mask Temp Storage), Photronics: 1
    • Evaluation (ETR COMP) for the P6021y VB, version 3, 2019-11-21, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX2 family P6021y VB Secure high-performance smart card controller, Objective data sheet: 1
    • GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Manufacturing Co. Pte. Ltd., Singapore, Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) 25 / 31 Certification Report BSI-DSZ-CC-1072-V3-2019 C. Excerpts from the Criteria For the: 1
    • Smart Card Controller P6021y VB – Security Target, Version 1.11, 2019-08-23, NXP Semiconductors (confidential document) [7] Evaluation Technical Report BSI-DSZ-CC-1072-V3-2019, Version 2, 2019-11-21, TÜV: 1
    • Version 1, 2019-09-13, TÜV Informationstechnik GmbH (confidential document) [22] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Mask Production), Photronics DNP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [20] SITE TECHNICAL AUDIT REPORT (STAR), Production Environment (Wafer Bumbing), Chipbond: 1
pdf_data/report_metadata
pdf_data/st_filename 2021-01_ST_lite.pdf 1072V3b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1072: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL5: 4
    • EAL5 augmented: 2
    • EAL5+: 31
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
    • EAL4+: 2
    • EAL6: 44
    • EAL6 augmented: 5
    • EAL6+: 11
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 3
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 6
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 6
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 3
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 3
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 3
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 3
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 6
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 3
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 5
    • FCS_COP.1: 17
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 7
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_IFC.1: 5
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 7
    • FDP_SDC.1: 6
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 4
    • FMT_LIM.2: 4
  • FPT:
    • FPT_FLS.1: 7
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 7
    • FPT_PHP.3: 7
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 8
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 17
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 46
    • FCS_CKM.4.1: 3
    • FCS_COP.1: 45
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 37
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 34
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 10
    • FDP_ITC.1: 14
    • FDP_ITC.2: 16
    • FDP_ITT.1: 6
    • FDP_ROL.1: 1
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI.1: 5
    • FDP_SDI.2: 36
    • FDP_SDI.2.1: 5
    • FDP_SDI.2.2: 5
  • FIA:
    • FIA_UAU.2: 2
    • FIA_UAU.5: 2
    • FIA_UID.2: 2
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 28
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 24
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 22
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
    • FPT_RPL.1: 2
    • FPT_TDC.1: 2
  • FRU:
    • FRU_FLT.2: 8
  • FTP:
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 3
    • O.RSA-CRT: 6
    • O.TDES: 8
  • T:
    • T.RND: 2
  • O:
    • O.AES: 7
    • O.CUST_RECONF_PLAIN: 6
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.MEM_ACCESS: 10
    • O.PUF: 6
    • O.RND: 3
    • O.SFR_: 1
    • O.SFR_ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 204
    • NXP Semiconductors: 35
    • NXP Semiconductors N.V: 1
pdf_data/st_keywords/symmetric_crypto
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 29
      • Triple-DES: 4
    • DES:
      • DES: 1
  • AES_competition:
    • AES:
      • AES: 82
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 45
      • Triple-DES: 19
    • DES:
      • DEA: 1
      • DES: 8
  • constructions:
    • MAC:
      • CBC-MAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • RSA:
    • RSA-CRT: 30
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/st_keywords/crypto_scheme
  • PKE:
    • PKE: 1
  • MAC:
    • MAC: 8
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 6
  • TRNG:
    • TRNG: 3
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 4
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 6
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 10
pdf_data/st_keywords/crypto_library
  • Generic:
    • Crypto Library 2.1.0: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 7
    • malfunction: 3
    • physical tampering: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 4
  • FI:
    • Malfunction: 10
    • fault injection: 2
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 11
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
pdf_data/st_keywords/tee_name
  • IBM:
    • SE: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 7816: 6
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 197: 3
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 20
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 24
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-38A: 3
    • NIST SP 800-67: 4
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • on a single die. The THN31 secure element is in the scope of the TOE while the NFC controller is out of scope of the TOE. THN31 secure element (TOE) NFC controller The TOE is a secure element with two crypto: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 754154
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 29
  • /Author: NXP B.V.
  • /CreationDate: D:20190823113338+01'00'
  • /Creator: DITA Open Toolkit
  • /Keywords: CC Security Evaluation, Security Target Lite, Functional Requirements, Security Functionality, Assurance Level 5+/6+, P6021y VB, P6021P VB, P6021M VB, P6021D VB, P6021J VB
  • /Producer: Apache FOP Version 1.1
  • /Subject: NXP Secure Smart Card Controller P6021y VB
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 727760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 97
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