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CEITEC ePassport Module, CTC21001, v1.0 (supporting EAC)
SERTIT-080 		P73N2M0B0.200
ANSSI-CC-2018/08
name CEITEC ePassport Module, CTC21001, v1.0 (supporting EAC) P73N2M0B0.200
scheme NO FR
not_valid_after 17.01.2022 16.02.2023
not_valid_before 17.01.2017 16.02.2018
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/20170117%20S-080%20CR%20Ceitec%20EAC.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2018_08fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[STlite-EAC]%20CEITECSA%205.410.052%20-%20ST-Lite%20ePassport%20Module%20EAC%202.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-2018_08en.pdf
manufacturer CEITEC S.A. NXP Semiconductors
manufacturer_web https://www.ceitec-sa.com https://www.nxp.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ADV_IMP.2, ALC_FLR.1, ALC_CMC.5, EAL5+, AVA_VAN.5, ATE_COV.3, ALC_TAT.3, ASE_TSS.2, ATE_FUN.2, ADV_TDS.5, ADV_INT.3, ALC_DVS.2
dgst 8856518b423e12c4 308fc228c8cdeea7
heuristics/cert_id SERTIT-080 ANSSI-CC-2018/08
heuristics/cert_lab [] SERMA
heuristics/extracted_sars ASE_INT.1, ALC_DVS.2, ADV_FSP.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, ASE_SPD.1, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.4, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.3, ATE_DPT.1, ASE_REQ.2, ATE_IND.2, ASE_CCL.1 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ADV_CMC.5, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ALC_COV.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3
heuristics/extracted_versions 1.0 0.200
heuristics/report_references/directly_referenced_by {} ANSSI-CC-2018/60, ANSSI-CC-2018/52, ANSSI-CC-2018/19, NSCIB-CC-111441-CR
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-235750-CR, NSCIB-CC-2300149-01-CR, ANSSI-CC-2018/60, ANSSI-CC-2018/52, NSCIB-CC-111441-CR, ANSSI-CC-2018/55, ANSSI-CC-2018/19, ANSSI-CC-2019/62
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 17.01.2017
  • developer: CEITEC S.A.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-080
    • certification_date: 17.01.2017
    • description: The TOE is an electronic module for machine readable travel documents (MRTDs) based on the requirements of the International Civil Aviation Organization, as defined in ICAO Doc 9303. The TOE is developed and produced by CEITEC and delivered to the passport manufacturer as micro modules. The TOE contains at the physical level: Integrated circuit chip; IC Software; data necessary to enable the MRTD personalization; the associated guidance documentation. The TOE also provides the security functions: integrity and confidentiality of personal data; access control, identification and authentication; protection against abuse of functionality, information leakage, physical tampering, malfunctions.
    • developer: CEITEC S.A.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135163-1607953148/SERTIT/Sertifikater/2017/80/20170117%20Sertit-080%20C.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135166-1607953151/SERTIT/Sertifikater/2017/80/%5BSTlite-EAC%5D%20CEITECSA%205.410.052%20-%20ST-Lite%20ePassport%20Module%20EAC%202.0.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135160-1607953146/SERTIT/Sertifikater/2017/80/20170117%20S-080%20CR%20Ceitec%20EAC.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • level: EAL 4, ALC_DVS.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: 1.0
    • protection_profile: BSI-CC-PP-0056, "Machine Readable Travel Document with 'ICAO Application', Extended Access Control"
    • sponsor: CEITEC S.A.
  • product: CEITEC ePassport Module CTC21001
  • url: https://sertit.no/certified-products/product-archive/ceitec-epassport-module-ctc21001
heuristics/st_references/directly_referenced_by {} NSCIB-CC-111441-CR
heuristics/st_references/indirectly_referenced_by {} NSCIB-CC-111441-CR
heuristics/protection_profiles a33327d40f253f46 {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0056_V2b_pdf.pdf {}
pdf_data/report_filename 20170117 S-080 CR Ceitec EAC.pdf anssi-cc-2018_08fr.pdf
pdf_data/report_frontpage
  • FR:
  • FR:
    • cc_security_level: EAL 5 augmenté ADV_IMP.2, ADV_INT.3, ADV_TDS.5, ALC_CMC.5, ALC_DVS.2, ALC_FLR.1, ALC_TAT.3, ATE_COV.3, ATE_FUN.2, AVA_VAN.5, ASE_TSS.2
    • cc_version: Critères Communs version 3.1 révision 4
    • cert_id: ANSSI-CC-2018/08
    • cert_item: P73N2M0B0.200
    • cert_item_version: B0.200
    • cert_lab: Serma Safety & Security 14 rue Galilée, CS 10055, 33615 Pessac Cedex, France
    • developer: NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne Commanditaire NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014
pdf_data/report_keywords/cc_cert_id
  • NO:
    • SERTIT-080: 19
  • FR:
    • ANSSI-CC-2018/08: 16
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0056: 1
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 2
    • EAL 4+: 19
    • EAL1: 1
    • EAL4: 1
    • EAL7: 1
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 3
    • EAL 7: 1
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_TDS: 1
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_FLR.1: 2
    • ALC_LCD: 1
    • ALC_TAT: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
    • ASE_TSS.2: 2
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_FUN.2: 2
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_CKM.1: 1
    • FCS_CKM.4: 1
    • FCS_COP: 4
    • FCS_RND.1: 4
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACF.1: 1
    • FDP_UCT.1: 1
    • FDP_UIT.1: 1
  • FIA:
    • FIA_API.1: 4
    • FIA_UAU.1: 1
    • FIA_UAU.4: 1
    • FIA_UAU.5: 1
    • FIA_UAU.6: 1
    • FIA_UID.1: 1
  • FMT:
    • FMT_LIM.1: 4
    • FMT_LIM.2: 4
    • FMT_MTD: 8
    • FMT_MTD.3: 1
    • FMT_SMF.1: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_PHP.3: 1
    • FPT_TST.1: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 24
    • NXP Semiconductors: 2
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
  • Serma:
    • SERMA: 2
    • Serma Safety & Security: 1
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • other:
    • JIL: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ICAO:
    • ICAO: 4
  • ISO:
    • ISO/IEC 15408: 2
  • BSI:
    • AIS 31: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
pdf_data/report_metadata
  • /AAPL:Keywords: ['ugradert']
  • /Author: Kjaertan
  • /CreationDate: D:20170118113117Z00'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ugradert
  • /ModDate: D:20170118113117Z00'00'
  • /Producer: Mac OS X 10.12.2 Quartz PDFContext
  • /Title: tittel
  • pdf_file_size_bytes: 650258
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
  • /Category:
  • /Comments: NXP Semiconductors
  • /Company: SGDSN/ANSSI
  • /CreationDate: D:20180221170250+01'00'
  • /Creator: Acrobat PDFMaker 11 pour Word
  • /Keywords: ANSSI-CC-CER-F-07.026
  • /ModDate: D:20180223104827+01'00'
  • /Producer: Adobe PDF Library 11.0
  • /SourceModified: D:20180221160246
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 248919
  • pdf_hyperlinks: http://www.ssi.gouv.fr/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 15
pdf_data/st_filename [STlite-EAC] CEITECSA 5.410.052 - ST-Lite ePassport Module EAC 2.0.pdf ANSSI-cible-2018_08en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0056: 7
    • BSI-PP-0056: 1
    • BSI-PP-CC-0056: 1
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 8
    • EAL4 augmented: 2
  • EAL:
    • EAL4: 4
    • EAL4 augmented: 2
    • EAL5: 5
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP.2: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_DVS.2: 5
  • APE:
    • APE_SRE: 1
  • AVA:
    • AVA_VAN.5: 5
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 2
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 3
    • ADV_IMP.2: 5
    • ADV_INT.3: 2
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 4
    • ALC_CMC.5: 4
    • ALC_CMS: 1
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_COV.2: 2
    • ALC_COV.3: 2
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 4
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT.3: 1
    • ATE_FUN.2: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 6
    • FAU_SAS.1: 11
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 26
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 22
    • FCS_CKM.4.1: 1
    • FCS_COP: 36
    • FCS_COP.1: 7
    • FCS_RND: 7
    • FCS_RND.1: 11
    • FCS_RND.1.1: 2
  • FDP:
    • FDP_ACC.1: 20
    • FDP_ACC.1.1: 1
    • FDP_ACF: 1
    • FDP_ACF.1: 13
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 4
    • FDP_ITC: 1
    • FDP_ITC.1: 10
    • FDP_ITC.2: 10
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 7
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 6
    • FIA_API.1: 10
    • FIA_API.1.1: 2
    • FIA_SOS.2: 1
    • FIA_UAU.1: 9
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UAU.4: 8
    • FIA_UAU.4.1: 1
    • FIA_UAU.5: 9
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UAU.6: 10
    • FIA_UAU.6.1: 1
    • FIA_UID.1: 15
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
  • FMT:
    • FMT_LIM: 7
    • FMT_LIM.1: 21
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 18
    • FMT_LIM.2.1: 2
    • FMT_MSA.1: 1
    • FMT_MSA.3: 3
    • FMT_MTD: 46
    • FMT_MTD.1: 11
    • FMT_MTD.3: 4
    • FMT_MTD.3.1: 1
    • FMT_SMF.1: 34
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 38
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS.1: 9
    • FPT_FLS.1.1: 1
    • FPT_PHP.3: 10
    • FPT_PHP.3.1: 1
    • FPT_TST: 1
    • FPT_TST.1: 9
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FTP:
    • FTP_ITC.1: 5
    • FTP_TRP.1: 5
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 13
    • FCS_CKM.1: 13
    • FCS_CKM.4: 14
    • FCS_COP: 31
    • FCS_COP.1: 8
    • FCS_RNG: 5
    • FCS_RNG.1: 5
    • FCS_SDI.2: 1
  • FDP:
    • FDP_ACC: 12
    • FDP_ACC.1: 14
    • FDP_ACF: 12
    • FDP_ACF.1: 10
    • FDP_IFC.1: 13
    • FDP_ITC.1: 13
    • FDP_ITC.2: 13
    • FDP_ITT.1: 8
    • FDP_MSA: 8
    • FDP_SDC: 1
    • FDP_SDC.1: 7
    • FDP_SDI: 13
    • FDP_SDI.1: 2
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 6
    • FDP_SMF.1: 4
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 5
    • FMT_LIM.2: 4
    • FMT_MAS.1: 1
    • FMT_MSA: 20
    • FMT_MSA.1: 9
    • FMT_MSA.3: 12
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 9
  • FPT:
    • FPT_FLS.1: 10
    • FPT_ITT.1: 8
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 10
  • FTP:
    • FTP_FLS.1: 1
pdf_data/st_keywords/cc_claims
  • OE:
    • OE.BAC-PP: 2
    • OE.BAC_PP: 1
    • OE.MRTD_: 2
  • O:
    • O.AES: 7
    • O.CRC: 8
    • O.FLASH-: 1
    • O.FLASH-INTEGRITY: 6
    • O.GCM-SUPPORT: 8
    • O.MEM-ACCESS: 8
    • O.RND: 3
    • O.SFR-ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 49
    • NXP Semiconductors: 29
    • NXP Semiconductors N.V: 58
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • 3DES:
      • 3DES: 1
      • Triple-DES: 2
    • DES:
      • DES: 2
  • AES_competition:
    • AES:
      • AES: 37
  • DES:
    • 3DES:
      • TDEA: 2
      • TDES: 17
      • Triple-DES: 9
    • DES:
      • DES: 9
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECDH:
      • ECDH: 1
  • FF:
    • DH:
      • Diffie-Hellman: 5
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 4
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CBC:
    • CBC: 6
  • CFB:
    • CFB: 5
  • CTR:
    • CTR: 5
  • ECB:
    • ECB: 2
  • GCM:
    • GCM: 21
  • OFB:
    • OFB: 5
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • Physical Tampering: 7
    • Physical tampering: 1
    • fault injection: 1
    • malfunction: 6
    • physical tampering: 5
  • SCA:
    • DPA: 3
    • SPA: 2
    • physical probing: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 1
  • FI:
    • Malfunction: 6
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 2
pdf_data/st_keywords/ic_data_group
  • EF:
    • EF.COM: 10
    • EF.DG1: 20
    • EF.DG13: 2
    • EF.DG14: 7
    • EF.DG16: 17
    • EF.DG2: 7
    • EF.DG3: 20
    • EF.DG4: 18
    • EF.DG5: 5
    • EF.SOD: 10
pdf_data/st_keywords/standard_id
  • FIPS:
    • FIPS 180-2: 1
    • FIPS 180-411: 1
  • ICAO:
    • ICAO: 9
  • PKCS:
    • PKCS#3: 2
    • PKCS#34: 1
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS 140-2: 1
  • ISO:
    • ISO/IEC 7816: 6
  • NIST:
    • NIST SP 800-38A: 4
    • NIST SP 800-38D: 2
    • NIST SP 800-67: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • allows NXP to develop sales products composed of P73N2M0B0.200 and Services Software, which are out of scope of this Security Target. NXP Semiconductors P73N2M0B0.200 Security Target Lite P73N2M0B0.200 All: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: Marcos Kordyas Dossa
  • /CreationDate: D:20161212160233-02'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20161212160233-02'00'
  • /Producer: Microsoft® Word 2010
  • pdf_file_size_bytes: 1330959
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 71
  • /CreationDate: D:20180111222204+01'00'
  • /Creator: DITA Open Toolkit
  • /Keywords:
  • /ModDate: D:20180223101605+01'00'
  • /PDFVersion: 1.4
  • /Producer: Apache FOP Version 1.1
  • pdf_file_size_bytes: 334967
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 59
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