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System Software for e-STUDIO202L/232/282 V1.0
JISEC-CC-CRP-C0043 		P73N2M0B0.200
ANSSI-CC-2018/08
name System Software for e-STUDIO202L/232/282 V1.0 P73N2M0B0.200
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme JP FR
not_valid_after 10.12.2010 16.02.2023
not_valid_before 29.03.2006 16.02.2018
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/c0043_erpt.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2018_08fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/c0043_est.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-2018_08en.pdf
manufacturer Toshiba TEC Corporation NXP Semiconductors
manufacturer_web https://www.toshibatec.co.jp/en/ https://www.nxp.com/
security_level EAL3 ADV_IMP.2, ALC_FLR.1, ALC_CMC.5, EAL5+, AVA_VAN.5, ATE_COV.3, ALC_TAT.3, ASE_TSS.2, ATE_FUN.2, ADV_TDS.5, ADV_INT.3, ALC_DVS.2
dgst 79cf3cf36c8217af 308fc228c8cdeea7
heuristics/cert_id JISEC-CC-CRP-C0043 ANSSI-CC-2018/08
heuristics/cert_lab [] SERMA
heuristics/extracted_sars ALC_DVS.1, ATE_COV.2, ADV_RCR.1, ADV_FSP.1, ADV_HLD.2, ATE_FUN.1, AGD_USR.1, AVA_VLA.1, ATE_IND.2, AGD_ADM.1, AVA_MSU.1, ATE_DPT.1, AVA_SOF.1 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ADV_CMC.5, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ALC_COV.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3
heuristics/extracted_versions 1.0 0.200
heuristics/report_references/directly_referenced_by {} ANSSI-CC-2018/60, ANSSI-CC-2018/52, ANSSI-CC-2018/19, NSCIB-CC-111441-CR
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-235750-CR, NSCIB-CC-2300149-01-CR, ANSSI-CC-2018/60, ANSSI-CC-2018/52, NSCIB-CC-111441-CR, ANSSI-CC-2018/55, ANSSI-CC-2018/19, ANSSI-CC-2019/62
heuristics/scheme_data
  • cert_id: JISEC-CC-CRP-C0043
  • certification_date: 01.03.2006
  • claim: EAL3
  • enhanced:
    • assurance_level: EAL3
    • cert_link: https://www.ipa.go.jp/en/security/c0043_eimg.pdf
    • description: PRODUCT DESCRIPTION The TOE is the system software of the digital multi function device “ e-STUDIO202L/232/282 ” manufactured by TOSHIBA TEC CORPORATION. The system software provides general functions as a digital multifunction device as well as the function of data overwrite and complete deletion on the user document data deleted from the e-STUDIO202L/232/282 HDD. The function of data overwrite and complete deletion includes the function to collectively and completely delete all user document data from the HDD before the HDD is disposed or replaced. This function also prevents unauthorized restore of data.
    • evaluation_facility: Electronic Commerce Security Technology Laboratory Inc.
    • product: System Software for e-STUDIO202L/232/282
    • product_type: IT Product ( data protection function in Multi Function Device )
    • report_link: https://www.ipa.go.jp/en/security/c0043_erpt.pdf
    • target_link: https://www.ipa.go.jp/en/security/c0043_est.pdf
    • toe_version: V1.0
    • vendor: TOSHIBA TEC CORPORATION
  • expiration_date: 01.01.2011
  • supplier: TOSHIBA TEC CORPORATION
  • toe_japan_name: System Software for e-STUDIO202L/232/282 V1.0
  • toe_overseas_link: https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0043_it5057.html
  • toe_overseas_name: System Software for e-STUDIO 202L/232/282 V1.0
heuristics/st_references/directly_referenced_by {} NSCIB-CC-111441-CR
heuristics/st_references/indirectly_referenced_by {} NSCIB-CC-111441-CR
pdf_data/report_filename c0043_erpt.pdf anssi-cc-2018_08fr.pdf
pdf_data/report_frontpage
  • FR:
  • FR:
    • cc_security_level: EAL 5 augmenté ADV_IMP.2, ADV_INT.3, ADV_TDS.5, ALC_CMC.5, ALC_DVS.2, ALC_FLR.1, ALC_TAT.3, ATE_COV.3, ATE_FUN.2, AVA_VAN.5, ASE_TSS.2
    • cc_version: Critères Communs version 3.1 révision 4
    • cert_id: ANSSI-CC-2018/08
    • cert_item: P73N2M0B0.200
    • cert_item_version: B0.200
    • cert_lab: Serma Safety & Security 14 rue Galilée, CS 10055, 33615 Pessac Cedex, France
    • developer: NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne Commanditaire NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014
pdf_data/report_keywords/cc_cert_id
  • JP:
    • CRP-C0043-01: 1
    • Certification No. C0043: 1
  • FR:
    • ANSSI-CC-2018/08: 16
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL3: 3
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 3
    • EAL 7: 1
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_TDS: 1
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_FLR.1: 2
    • ALC_LCD: 1
    • ALC_TAT: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
    • ASE_TSS.2: 2
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_FUN.2: 2
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_claims
  • T:
    • T.STOREDATA_ACCESS: 1
    • T.TEMPDATA_ACCESS: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 24
    • NXP Semiconductors: 2
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • Serma:
    • SERMA: 2
    • Serma Safety & Security: 1
pdf_data/report_keywords/symmetric_crypto
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/side_channel_analysis
  • other:
    • reverse engineering: 1
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 2
    • CCIMB-99-033: 2
  • ISO:
    • ISO/IEC 15408:1999: 1
  • BSI:
    • AIS 31: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate: D:20060515142139+09'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20060515142342+09'00'
  • /Producer: Acrobat Distiller 6.0 (Windows)
  • /Title:
  • pdf_file_size_bytes: 546561
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 19
  • /Category:
  • /Comments: NXP Semiconductors
  • /Company: SGDSN/ANSSI
  • /CreationDate: D:20180221170250+01'00'
  • /Creator: Acrobat PDFMaker 11 pour Word
  • /Keywords: ANSSI-CC-CER-F-07.026
  • /ModDate: D:20180223104827+01'00'
  • /Producer: Adobe PDF Library 11.0
  • /SourceModified: D:20180221160246
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 248919
  • pdf_hyperlinks: http://www.ssi.gouv.fr/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 15
pdf_data/st_filename c0043_est.pdf ANSSI-cible-2018_08en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 3: 1
    • EAL3: 4
  • EAL:
    • EAL4: 4
    • EAL4 augmented: 2
    • EAL5: 5
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_CAP.3: 3
    • ACM_SCP.1: 1
  • ADO:
    • ADO_DEL.1: 3
    • ADO_IGS.1: 3
  • ADV:
    • ADV_FSP.1: 3
    • ADV_HLD.2: 1
    • ADV_RCR.1: 3
  • AGD:
    • AGD_ADM.1: 3
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS.1: 3
  • ATE:
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_FUN.1: 3
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU.1: 3
    • AVA_SOF.1: 2
    • AVA_VLA.1: 3
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 2
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 3
    • ADV_IMP.2: 5
    • ADV_INT.3: 2
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 4
    • ALC_CMC.5: 4
    • ALC_CMS: 1
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_COV.2: 2
    • ALC_COV.3: 2
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 4
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT.3: 1
    • ATE_FUN.2: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FDP:
    • FDP_RIP.1: 11
    • FDP_RIP.1.1: 1
    • FDP_RIP.2: 8
  • FPT:
    • FPT_RVM.1: 12
    • FPT_RVM.1.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 13
    • FCS_CKM.1: 13
    • FCS_CKM.4: 14
    • FCS_COP: 31
    • FCS_COP.1: 8
    • FCS_RNG: 5
    • FCS_RNG.1: 5
    • FCS_SDI.2: 1
  • FDP:
    • FDP_ACC: 12
    • FDP_ACC.1: 14
    • FDP_ACF: 12
    • FDP_ACF.1: 10
    • FDP_IFC.1: 13
    • FDP_ITC.1: 13
    • FDP_ITC.2: 13
    • FDP_ITT.1: 8
    • FDP_MSA: 8
    • FDP_SDC: 1
    • FDP_SDC.1: 7
    • FDP_SDI: 13
    • FDP_SDI.1: 2
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 6
    • FDP_SMF.1: 4
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 5
    • FMT_LIM.2: 4
    • FMT_MAS.1: 1
    • FMT_MSA: 20
    • FMT_MSA.1: 9
    • FMT_MSA.3: 12
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 9
  • FPT:
    • FPT_FLS.1: 10
    • FPT_ITT.1: 8
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 10
  • FTP:
    • FTP_FLS.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.STOREDATA_OVERWRITE: 4
    • O.TEMPDATA_OVERWRITE: 6
  • OE:
    • OE.HDD_ERASE: 3
    • OE.OVERWRITE_COMPLETE: 3
  • T:
    • T.STOREDATA_ACCESS: 3
    • T.TEMPDATA_ACCESS: 4
  • O:
    • O.AES: 7
    • O.CRC: 8
    • O.FLASH-: 1
    • O.FLASH-INTEGRITY: 6
    • O.GCM-SUPPORT: 8
    • O.MEM-ACCESS: 8
    • O.RND: 3
    • O.SFR-ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 49
    • NXP Semiconductors: 29
    • NXP Semiconductors N.V: 58
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 37
  • DES:
    • 3DES:
      • TDEA: 2
      • TDES: 17
      • Triple-DES: 9
    • DES:
      • DES: 9
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 6
  • CFB:
    • CFB: 5
  • CTR:
    • CTR: 5
  • ECB:
    • ECB: 2
  • GCM:
    • GCM: 21
  • OFB:
    • OFB: 5
pdf_data/st_keywords/side_channel_analysis
  • other:
    • reverse engineering: 2
  • FI:
    • Malfunction: 6
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 2
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS 140-2: 1
  • ISO:
    • ISO/IEC 7816: 6
  • NIST:
    • NIST SP 800-38A: 4
    • NIST SP 800-38D: 2
    • NIST SP 800-67: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • allows NXP to develop sales products composed of P73N2M0B0.200 and Services Software, which are out of scope of this Security Target. NXP Semiconductors P73N2M0B0.200 Security Target Lite P73N2M0B0.200 All: 1
    • out of scope: 1
pdf_data/st_metadata
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  • pdf_number_of_pages: 59
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