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NXP MIFARE DESFire EV1 MF3ICD81
BSI-DSZ-CC-0712-2011 		S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
BSI-DSZ-CC-0882-2013
name NXP MIFARE DESFire EV1 MF3ICD81 S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
not_valid_before 12.07.2011 04.12.2013
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0712a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0712b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0882b_pdf.pdf
manufacturer NXP Semiconductors Germany GmbH Business Line Identification Samsung Electronics Co., Ltd.
manufacturer_web https://www.nxp.com https://www.samsung.com
security_level ADV_IMP.2, AVA_VLA.4, AVA_MSU.3, EAL4+, ALC_DVS.2 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 76f792d08ecf5f58 db89c868db0d272f
heuristics/cert_id BSI-DSZ-CC-0712-2011 BSI-DSZ-CC-0882-2013
heuristics/extracted_sars ATE_COV.2, ADV_RCR.1, ALC_TAT.1, AVA_VLA.4, ADV_HLD.2, ATE_FUN.1, AGD_USR.1, AVA_SOF.1, ATE_IND.2, AGD_ADM.1, ADV_LLD.1, ALC_DVS.2, ALC_LCD.1, ADV_IMP.2, ATE_DPT.1, ADV_FSP.2, ADV_SPM.1, AVA_MSU.3 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, APE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, APE_REQ.2, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, APE_INT.1, APE_SPD.1, ATE_IND.2, APE_OBJ.2, ASE_CCL.1, ADV_SPM.1
heuristics/extracted_versions - 0, 32
heuristics/report_references/directly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/directly_referencing BSI-DSZ-CC-0487-2009 BSI-DSZ-CC-0801-2012
heuristics/report_references/indirectly_referenced_by {} BSI-DSZ-CC-0882-V2-2019
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0487-2009 BSI-DSZ-CC-0720-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009, BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0801-2012
heuristics/protection_profiles 62c62b4b4210800e f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/ssvgpp01.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/report_filename 0712a_pdf.pdf 0882a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cert_id: BSI-DSZ-CC-0712-2011
    • cert_item: NXP MIFARE DESFire EV1 MF3ICD81
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
  • DE:
    • cert_id: BSI-DSZ-CC-0882-2013
    • cert_item: S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0487-2009: 3
    • BSI-DSZ-CC-0712-2011: 19
  • NL:
    • CC-0487-2009: 1
  • DE:
    • BSI-DSZ-CC-0801-2012: 3
    • BSI-DSZ-CC-0882: 1
    • BSI-DSZ-CC-0882-2013: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002-2001: 3
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 4: 9
    • EAL 4 augmented: 3
    • EAL1: 6
    • EAL2: 3
    • EAL3: 4
    • EAL4: 9
    • EAL5: 6
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
  • EAL:
    • EAL 4: 2
    • EAL 5: 7
    • EAL 5 augmented: 3
    • EAL1: 7
    • EAL2: 3
    • EAL3: 4
    • EAL4: 7
    • EAL5: 7
    • EAL5+: 1
    • EAL6: 4
    • EAL7: 4
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 1
    • ACM_CAP: 2
    • ACM_CAP.4: 1
    • ACM_SCP: 2
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 1
    • ADO_IGS: 2
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 5
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 6
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 1
    • ALC_TAT: 2
    • ALC_TAT.1: 1
  • APE:
    • APE_DES: 1
    • APE_ENV: 1
    • APE_INT: 1
    • APE_OBJ: 1
    • APE_REQ: 1
    • APE_SRE: 1
  • ASE:
    • ASE_DES: 1
    • ASE_ENV: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_PPC: 1
    • ASE_REQ: 1
    • ASE_SRE: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 3
    • AVA_VLA: 3
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 2
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 2
  • R:
    • R.O: 2
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 17
    • NXP Semiconductors: 17
  • Samsung:
    • Samsung: 24
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • Triple-DES: 3
    • DES:
      • DES: 3
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 2
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 2
  • TRNG:
    • DTRNG: 12
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • physical tampering: 1
  • SCA:
    • physical probing: 1
  • other:
    • JIL: 4
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
    • BSI TR-02102: 1
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 25: 3
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 4
    • AIS 35: 3
    • AIS 36: 1
    • AIS 37: 1
    • AIS 38: 1
  • FIPS:
    • FIPS PUB 197: 1
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 15408:2005: 3
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS 46: 1
    • AIS31: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 2011, T-Systems GEI GmbH (confidential document) [8] MIFARE DESFire EV1 MF3ICD81 Configuration List, NXP Semiconductors, Rev. 1.6, 10. May 2011: 1
    • DESFire EV1 MF3ICD81 Secure Smart Card Controller, NXP Semiconductors, Rev. 2.1, 10 May 2011 (confidential document) [7] Evaluation Technical Report, NXP MIFARE DESFire EV1 MF3ICD81, BSI-DSZ-CC- 0712 Version 1.5, 24: 1
    • DESFire EV1 MF3ICDH81 Configuration List, NXP Semiconductors, Rev. 1.6, 10. May 2011 (confidential documents) [9] Security Target Lite, MIFARE DESFire EV 1 MF3ICD81, NXP Semiconductors, Rev. 1.5, 10 May 2011: 1
  • ConfidentialDocument:
    • 2013-11-27, TÜViT (confidential document) [11] Project < Kansa > Life Cycle Definition (Class ALC_CMC.4/CMS.5), Version 1.4, 2013-10-21: 1
    • Electronics (confidential document) [12] S3CS9AB 32-Bit CMOS Microcontroller for Smart Card User’s manual, Version 1.00, April 2013: 1
    • Report Summary (ETR Summary), BSI-DSZ-CC-0882, S3CS9AB Revision 0, Version 3, 2013-11-27, TÜViT (confidential document) [10] ETR for composite evaluation according to AIS 36 for the Product S3CS9AB Revision 0, Version: 1
    • Software (Project Kansa), BSI-DSZ-CC-0882-2013, Version 1.9, 2013-10-21, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [8: 1
pdf_data/report_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20110812112628+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, Secure Smart Card Controller with Smartcard Embedded SoftwareNXP MIFARE DESFire EV1 MF3ICD81, NXP Semiconductors Germany GmbH"
  • /ModDate: D:20110812115539+02'00'
  • /Producer: OpenOffice.org 3.2
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0712-2011
  • pdf_file_size_bytes: 871412
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 36
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20140205100058+01'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, S3CS9AB 32-Bit RISC Microcontroller for Smart Cards, Revision 0 with specific IC Dedicated Software, Samsung Electronics"
  • /ModDate: D:20140206085959+01'00'
  • /Producer: LibreOffice 3.6
  • /Subject: Common Criteria Certification
  • /Title: Certification Report BSI-DSZ-CC-0882-2013
  • pdf_file_size_bytes: 996795
  • pdf_hyperlinks: https://www.bsi.bund.de/zertifizierung, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 38
pdf_data/st_filename 0712b_pdf.pdf 0882b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0712: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0002-2001: 3
  • BSI:
    • BSI-PP-0035: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 4
    • EAL 4 augmented: 2
    • EAL4: 6
    • EAL4 augmented: 1
    • EAL4+: 2
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ACM:
    • ACM_AUT: 1
    • ACM_AUT.1: 1
    • ACM_CAP: 1
    • ACM_CAP.4: 2
    • ACM_SCP: 1
    • ACM_SCP.2: 2
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 2
    • ADV_HLD: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 2
    • ADV_LLD: 1
    • ADV_LLD.1: 1
    • ADV_RCR: 4
    • ADV_RCR.1: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 2
    • AGD_USR: 2
    • AGD_USR.1: 2
  • ALC:
    • ALC_DVS: 1
    • ALC_DVS.2: 3
    • ALC_LCD: 1
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_COV.2: 2
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU: 2
    • AVA_MSU.3: 2
    • AVA_SOF.1: 2
    • AVA_VLA.4: 4
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 11
    • FCS_CKM.4.1: 1
    • FCS_COP.1: 22
    • FCS_COP.1.1: 2
    • FCS_RND.1: 5
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 11
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 6
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 11
    • FDP_ITC.1: 6
    • FDP_ITC.2: 15
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 6
    • FDP_ROL.1: 6
    • FDP_ROL.1.1: 1
    • FDP_ROL.1.2: 1
    • FDP_SDI.1: 1
  • FIA:
    • FIA_UAU.1: 1
    • FIA_UAU.2: 5
    • FIA_UAU.2.1: 1
    • FIA_UAU.5: 7
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UID.1: 4
    • FIA_UID.2: 8
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 3
    • FMT_MSA.1: 6
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 16
    • FMT_MSA.3: 8
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MTD.1: 6
    • FMT_MTD.1.1: 1
    • FMT_SMF.1: 8
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 12
    • FMT_SMR.1.1: 2
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNL.1: 6
    • FPR_UNL.1.1: 1
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS.1: 7
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
    • FPT_RPL.1: 8
    • FPT_RPL.1.1: 1
    • FPT_RPL.1.2: 1
    • FPT_SEP.1: 6
    • FPT_TDC.1: 8
    • FPT_TDC.1.1: 1
    • FPT_TDC.1.2: 1
  • FRU:
    • FRU_FLT.2: 7
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 3
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 4
    • FCS_COP: 8
    • FCS_COP.1: 9
    • FCS_RNG: 6
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 4
    • FDP_ITC.2: 4
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 3
  • T:
    • T.RND: 2
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 71
    • NXP Semiconductors: 14
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 8
    • DES:
      • DEA: 1
      • DES: 24
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 8
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 4
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
  • TRNG:
    • TRNG: 1
  • RNG:
    • RND: 10
  • TRNG:
    • DTRNG: 18
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 3
  • ECB:
    • ECB: 4
  • OFB:
    • OFB: 2
pdf_data/st_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 9
    • fault injection: 2
    • malfunction: 2
  • SCA:
    • Leak-Inherent: 8
    • Physical Probing: 2
    • physical probing: 1
    • timing attacks: 1
  • FI:
    • Malfunction: 24
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 2
    • physical probing: 9
    • side-channel: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2005-08-001: 2
    • CCMB-2005-08-002: 2
    • CCMB-2005-08-003: 2
    • CCMB-2005-08-004: 2
  • FIPS:
    • FIPS PUB 197: 3
    • FIPS PUB 46-3: 3
  • BSI:
    • AIS 31: 2
    • AIS31: 1
    • BSI-AIS31: 3
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • TSF shall ensure that only secure values are accepted for security attributes.” This is clearly out of scope for the TOE. The design concept of the TOE and the systems in which the TOE is used is based on the: 2
    • out of scope: 2
pdf_data/st_metadata
  • /Author: NXP Semiconductors
  • /CreationDate: D:20110512120932+02'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /Keywords: Security Target Lite; MF3ICD81; NXP; DES; AES; EAL4+;AVA_VLA.4
  • /ModDate: D:20110512134152+02'00'
  • /Producer: Acrobat Distiller 9.4.0 (Windows)
  • /Subject: Common Criteria Evaluation of MF3ICD81 Smart Card Controller
  • /Title: Security Target Lite - MF3ICD81
  • pdf_file_size_bytes: 279896
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 63
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company: Samsung Electronics
  • /CreationDate: D:20131021190305+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /ModDate: D:20140206090253+01'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20131021100233
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1315207
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 57
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