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HiRDB / Single Server Version 7 07-03
JISEC-CC-CRP-C0065 		Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
BSI-DSZ-CC-0719-V2-2016
name HiRDB / Single Server Version 7 07-03 Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
category Databases ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme JP DE
not_valid_after 07.10.2013 12.08.2021
not_valid_before 22.11.2006 12.08.2016
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/c0065_ecvr.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0719V2b_pdf.pdf
manufacturer Hitachi, Ltd. Samsung Electronics Co., Ltd.
manufacturer_web https://www.hitachi.com/ https://www.samsung.com
security_level EAL1 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 6b0ce7e3167a63fb 2c5ab136ccfdeb16
heuristics/cert_id JISEC-CC-CRP-C0065 BSI-DSZ-CC-0719-V2-2016
heuristics/cert_lab [] BSI
heuristics/extracted_sars {} ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, APE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, APE_REQ.2, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, APE_CCL.1, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, APE_INT.1, APE_SPD.1, ATE_IND.2, APE_OBJ.2, ASE_CCL.1, ADV_SPM.1
heuristics/extracted_versions 7, 07, 03 1.0
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0719-2011
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0719-2011, BSI-DSZ-CC-0639-2010, BSI-DSZ-CC-0547-2009
heuristics/scheme_data
  • cert_id: JISEC-CC-CRP-C0098
  • certification_date:
  • claim: EAL1
  • enhanced:
    • assurance_level: EAL1
    • description: PRODUCT DESCRIPTION This TOE(HiRDB / Single Server Version 8) is a software product for Relational Database Management System(RDBMS). The TOE acts as a database server and provides access to the information stored in the database. Users generally access to the information stored in the database by requests for SQL execution at HiRDB server from HiRDB clients. The TOE provides functions that work for various and efficient data manipulation to meet the needs of users. And it also provides security functions that restrict access to user data to authorized users. Security functions of the TOE include the following. - Audit - Discretionary Access Control - Identification and Authentication - Security Management
    • evaluation_facility: Electronic Commerce Security Technology Laboratory Inc. Evaluation Center
    • product: HiRDB / Single Server Version 8
    • product_type: IT Product (Data Base Management System)
    • toe_version: 08-01
    • vendor: Hitachi, Ltd.
  • expiration_date: 01.10.2013
  • supplier: Hitachi, Ltd.
  • toe_japan_link: https://www.ipa.go.jp/en/security/jisec/software/certified-cert/c0098_it7133.html
  • toe_japan_name: HiRDB / Single Server Version 8 08-01
  • toe_overseas_link: None
  • toe_overseas_name: -----
heuristics/protection_profiles {} f6d23054061d72ba
protection_profile_links {} https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/report_filename c0065_ecvr.pdf 0719V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5 SOGIS Recognition Agreement
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0719-V2-2016
    • cert_item: Samsung S3CT9KA / S3CT9K7 / S3CT9K3 16-bit RISC Microcontroller for Smart Card, Revision 1 with optional Secure RSA/ECC Library Version 1.0 including specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Samsung Electronics
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • JP:
    • Certification No. C0065: 1
  • DE:
    • BSI-DSZ-CC-0719-2011: 3
    • BSI-DSZ-CC-0719-V2-2016: 22
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0035-2007: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL1: 1
  • EAL:
    • EAL 1: 7
    • EAL 2: 4
    • EAL 3: 4
    • EAL 4: 9
    • EAL 5: 12
    • EAL 5 augmented: 3
    • EAL 5+: 1
    • EAL 6: 4
    • EAL 7: 4
    • EAL5: 2
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 2
    • ALC_CMC.5: 1
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_FLR: 3
    • ALC_FLR.1: 1
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
    • ALC_TAT.3: 1
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_DPT.4: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 1
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 6
pdf_data/report_keywords/vendor
  • Samsung:
    • Samsung: 28
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 4
  • DES:
    • 3DES:
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 4
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 5
    • ECDH:
      • ECDH: 2
    • ECDSA:
      • ECDSA: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA2:
      • SHA224: 1
      • SHA256: 1
      • SHA384: 1
      • SHA512: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
pdf_data/report_keywords/randomness
  • TRNG:
    • TRNG: 8
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 1
pdf_data/report_keywords/ecc_curve
  • NIST:
    • P-192: 4
    • P-224: 6
    • P-256: 6
    • P-384: 6
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 1
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 2
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 38: 1
    • AIS20: 2
    • AIS31: 2
  • FIPS:
    • FIPS PUB 180-3: 1
    • FIPS PUB 186-3: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC14888-: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007 [9: 1
    • Evaluation Technical Report For Composite Evaluation (ETR COMP), TÜV Informationstechnik GmbH (confidential document) [11] Security Application Note S3CT9KA_K7_K3_PC_PA_P7_P3_AC_AA_A7, Version 1.6, 2016-05-03: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • optional Secure RSA and ECC Library including specific IC Dedicated Software, Samsung Electronics (confidential document) [7] Evaluation Technical Report, Version 6, 2016-07-27, Evaluation Ttechnical Report Summary (ETR: 1
pdf_data/report_metadata
  • /CreationDate: D:20061122204438+09'00'
  • /ModDate: D:20061122204438+09'00'
  • /Producer: Acrobat Distiller 6.0 (Windows)
  • /Title: untitled
  • pdf_file_size_bytes: 20053
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/st_filename 0719V2b_pdf.pdf
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 5
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL5: 6
    • EAL5 augmented: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 7
    • ADV_ARV: 1
    • ADV_FSP: 2
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_VAN: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 2
    • AGD_PRE: 1
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 13
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 2
    • FAU_GEN.1: 1
    • FAU_SAS: 8
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM: 4
    • FCS_CKM.1: 21
    • FCS_CKM.2: 2
    • FCS_CKM.4: 11
    • FCS_COP: 19
    • FCS_COP.1: 23
    • FCS_RNG: 11
    • FCS_RNG.1: 19
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 2
    • FDP_ACC.1: 13
    • FDP_ACC.1.1: 1
    • FDP_ACF: 2
    • FDP_ACF.1: 9
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC: 1
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 10
    • FDP_ITC.2: 10
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 24
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 28
    • FMT_LIM.2.1: 2
    • FMT_MSA: 2
    • FMT_MSA.1: 9
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 10
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 6
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 21
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 3
    • FPT_PHP.3: 20
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 17
pdf_data/st_keywords/cc_claims
  • O:
    • O.RND: 5
  • T:
    • T.RND: 5
pdf_data/st_keywords/vendor
  • Samsung:
    • Samsung: 3
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 14
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 1
    • DES:
      • DES: 9
  • constructions:
    • MAC:
      • HMAC: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 27
    • ECDH:
      • ECDH: 16
    • ECDSA:
      • ECDSA: 15
  • FF:
    • DH:
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-CRT: 1
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 2
    • SHA2:
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 2
      • SHA224: 6
      • SHA256: 6
      • SHA384: 6
      • SHA512: 2
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 10
    • RNG: 1
  • TRNG:
    • DTRNG: 2
    • TRNG: 16
pdf_data/st_keywords/cipher_mode
  • ECB:
    • ECB: 3
pdf_data/st_keywords/ecc_curve
  • Brainpool:
    • brainpoolP192r1: 4
    • brainpoolP192t1: 4
    • brainpoolP224r1: 4
    • brainpoolP224t1: 4
    • brainpoolP256r1: 4
    • brainpoolP256t1: 4
    • brainpoolP320r1: 4
    • brainpoolP320t1: 4
    • brainpoolP384r1: 4
    • brainpoolP384t1: 4
    • brainpoolP512r1: 4
    • brainpoolP512t1: 4
  • NIST:
    • P-192: 8
    • P-224: 8
    • P-256: 8
    • P-384: 8
    • secp192k1: 4
    • secp192r1: 4
    • secp224k1: 4
    • secp224r1: 4
    • secp256k1: 4
    • secp256r1: 4
    • secp384r1: 4
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 1
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 24
    • fault injection: 2
    • malfunction: 11
    • physical tampering: 2
  • SCA:
    • DPA: 12
    • Leak-Inherent: 21
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 10
    • physical probing: 9
    • side channel: 2
    • side-channel: 4
    • timing attack: 5
    • timing attacks: 1
  • other:
    • reverse engineering: 5
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 31: 2
    • AIS20: 3
    • AIS31: 2
  • CC:
    • CCMB-2009-07-001: 3
    • CCMB-2009-07-002: 3
    • CCMB-2009-07-003: 3
    • CCMB-2009-07-004: 3
  • FIPS:
    • FIPS 197: 1
    • FIPS PUB 180-3: 6
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata
  • /Author: KyungSuk YI
  • /Baustein: SLE66C82P/SLE66C42P
  • /BausteinVersion: a15
  • /Classification: Public
  • /Company:
  • /CreationDate: D:20160725163316+09'00'
  • /Creator: Word용 Acrobat PDFMaker 10.1
  • /Datum: 23-10-2003
  • /Dokument: Security Target
  • /EEPROM: 8 kBytes
  • /Jahr: 2003
  • /Keywords:
  • /ModDate: D:20160725163322+09'00'
  • /PP_Augmentations: Smartcard Integrated Circuit Platform Augmentations V0.98
  • /PP_Date: July 2001
  • /PP_Short: BSI-PP-0002; Version 1.0, July 2001
  • /PP_Version: 1.0
  • /Producer: Adobe PDF Library 10.0
  • /Protection Profile: Smartcard IC Platform Protection Profile
  • /ROM: 64 kBytes
  • /SourceModified: D:20160725073301
  • /Subject:
  • /Technologie: 0,22 µm
  • /Title: Security Target
  • /Version: 1.2
  • /XRAM: 2 kBytes
  • /m-Nummer: m1474/m1495
  • pdf_file_size_bytes: 1168031
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 66
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/convert_ok False True
state/st/download_ok False True
state/st/extract_ok False True
state/st/pdf_hash Different Different
state/st/txt_hash Different Different