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ST19 platform (0.6æ technology) : ST19SF04A Integrated circuit
ANSSI-CC-2001/18 		T-TeleSec Signet, Version 1.6.0.4
BSI-DSZ-CC-0275-2004
name ST19 platform (0.6æ technology) : ST19SF04A Integrated circuit T-TeleSec Signet, Version 1.6.0.4
category ICs, Smart Cards and Smart Card-Related Devices and Systems Products for Digital Signatures
scheme FR DE
not_valid_before 01.01.2001 22.07.2004
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2001_18.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0275.pdf
manufacturer STMicroelectronics T-Systems International GMBH
manufacturer_web https://www.st.com/ https://www.t-systems.de/
security_level ADV_IMP.2, ALC_FLR.1, AVA_VLA.4, EAL4+, ALC_DVS.2 AVA_VLA.4, AVA_MSU.3, ADV_LLD.1, ALC_TAT.1, ADV_IMP.1, EAL3+
dgst 4c2248dd71e6c457 eadf9594eed31aa5
heuristics/cert_id ANSSI-CC-2001/18 BSI-DSZ-CC-0275-2004
heuristics/cert_lab [] BSI
heuristics/extracted_sars ASE_ENV.1, ADV_RCR.1, ASE_INT.1, ADV_HLD.2, AGD_USR.1, ALC_DVS.2, ASE_REQ.1, ASE_PPC.1, ASE_DES.1, ADV_FSP.2, AVA_SOF.1, ATE_COV.2, ALC_FLR.1, ALC_TAT.1, AVA_MSU.2, ASE_TSS.1, AGD_ADM.1, ALC_LCD.1, ATE_FUN.1, ADV_IMP.2, ATE_DPT.1, AVA_VLA.4, ASE_SRE.1, ASE_OBJ.1, ATE_IND.2, ADV_LLD.1, ADV_SPM.1 AVA_VLA.4, ALC_TAT.1, ADV_LLD.1, AVA_MSU.3, ADV_IMP.1
heuristics/extracted_versions 0.6 1.6.0.4
heuristics/report_references/directly_referencing ANSSI-CC-2000/12 {}
heuristics/report_references/indirectly_referencing ANSSI-CC-2000/12 {}
maintenance_updates
pdf_data/report_filename 2001_18.pdf 0275.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
  • FR:
  • DE:
    • cert_id: BSI-DSZ-CC-0275-2004
    • cert_item: T-TeleSec Signet, Version 1.6.0.4
    • cert_lab: BSI
    • developer: T-Systems International GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) zu (.+?) der (.*)']
pdf_data/report_keywords/cc_cert_id
  • FR:
    • Rapport de certification 2000/12: 1
    • Rapport de certification 2001/18: 3
  • NL:
    • CC-3: 1
  • DE:
    • BSI-DSZ-CC-0275-2004: 20
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL4: 3
  • EAL:
    • EAL 3: 1
    • EAL 4: 2
    • EAL1: 5
    • EAL2: 3
    • EAL3: 6
    • EAL3+: 1
    • EAL4: 5
    • EAL5: 6
    • EAL6: 3
    • EAL7: 5
pdf_data/report_keywords/cc_sar
  • ACM:
    • ACM_AUT.1: 1
    • ACM_CAP.4: 1
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL.2: 1
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP.2: 1
    • ADV_HLD.2: 1
    • ADV_IMP.2: 3
    • ADV_LLD.1: 1
    • ADV_RCR.1: 1
    • ADV_SPM.1: 1
  • AGD:
    • AGD_ADM.1: 1
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS.2: 3
    • ALC_FLR.1: 3
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • AMA:
    • AMA_AMP.1: 1
    • AMA_CAT.1: 1
    • AMA_EVD.1: 1
    • AMA_SIA.2: 1
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU.2: 1
    • AVA_SOF.1: 1
    • AVA_VLA.4: 4
  • ACM:
    • ACM_AUT: 2
    • ACM_CAP: 3
    • ACM_SCP: 3
  • ADO:
    • ADO_DEL: 3
    • ADO_IGS: 3
  • ADV:
    • ADV_FSP: 3
    • ADV_HLD: 3
    • ADV_IMP: 3
    • ADV_IMP.1: 3
    • ADV_INT: 2
    • ADV_LLD: 3
    • ADV_LLD.1: 3
    • ADV_RCR: 3
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 3
    • AGD_USR: 3
  • ALC:
    • ALC_DVS: 3
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_TAT: 3
    • ALC_TAT.1: 3
  • ATE:
    • ATE_COV: 3
    • ATE_DPT: 3
    • ATE_FUN: 3
    • ATE_IND: 3
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 3
    • AVA_MSU.3: 3
    • AVA_SOF: 5
    • AVA_VLA: 5
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 4
pdf_data/report_keywords/cc_claims
  • OE:
    • OE.SIG_DAT: 1
  • OT:
    • OT.NACH_SIG: 1
    • OT.SIG_DAT: 1
    • OT.VOR_SIG: 1
  • T:
    • T.DAT: 2
    • T.NACH_SIG: 1
    • T.SIG_DAT: 1
    • T.VOR_SIG: 1
pdf_data/report_keywords/vendor
  • STMicroelectronics:
    • STMicroelectronics: 18
  • Microsoft:
    • Microsoft: 14
pdf_data/report_keywords/eval_facility
  • Serma:
    • Serma Technologies: 4
  • TSystems:
    • T-Systems International: 5
pdf_data/report_keywords/hash_function
  • RIPEMD:
    • RIPEMD-160: 2
  • SHA:
    • SHA1:
      • SHA-1: 3
      • SHA1: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 3
pdf_data/report_keywords/standard_id
  • CC:
    • CCIMB-99-031: 1
    • CCIMB-99-032: 1
    • CCIMB-99-033: 1
  • BSI:
    • AIS 32: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
pdf_data/report_metadata
  • /Author: blad
  • /CreationDate: D:20011122113214
  • /Creator: FrameMaker 6.0
  • /ModDate: D:20011122114539+01'00'
  • /Producer: Acrobat Distiller 4.05 for Windows
  • /Title: RapportCertification.book
  • pdf_file_size_bytes: 107607
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20041005140052+02'00'
  • /Creator: AdobePS5.dll Version 5.2
  • /ModDate: D:20041007115222+02'00'
  • /Producer: Acrobat Distiller 5.0.5 (Windows)
  • /Title: Zertifizierungsreport T-TeleSec Signet, Version 1.6.0.4
  • pdf_file_size_bytes: 371374
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 40
state/report/pdf_hash Different Different
state/report/txt_hash Different Different