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	CZ6 production line on the NEC site in Yamaguchi, Japan ANSSI-CC-2001/11	Qualcomm Secure Processor Unit SPU230 in SDM855 SoC BSI-DSZ-CC-1045-2019
name	CZ6 production line on the NEC site in Yamaguchi, Japan	Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
category	Other Devices and Systems	Other Devices and Systems
scheme	FR	DE
status	archived	archived
not_valid_after	01.09.2019	07.05.2024
not_valid_before	01.01.2001	08.05.2019
cert_link		https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2001_11.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf
st_link	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/cible2001_11.pdf	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf
manufacturer	NEC Yamaguchi Ltd, NEC SCAC	Qualcomm Technologies Inc.
manufacturer_web	https://www.nec.com/	https://www.qualcomm.com
security_level	AVA_VLA.2, EAL1+	EAL4+, ALC_DVS.2, AVA_VAN.5
dgst	49d7db5e734754ff	2e8cbf6ce18d4c6f
heuristics/cert_id	ANSSI-CC-2001/11	BSI-DSZ-CC-1045-2019
heuristics/cert_lab	[]	BSI
heuristics/cpe_matches	{}	{}
heuristics/verified_cpe_matches	{}	{}
heuristics/related_cves	{}	{}
heuristics/direct_transitive_cves	{}	{}
heuristics/indirect_transitive_cves	{}	{}
heuristics/extracted_sars	ASE_ENV.1, ADV_RCR.1, ADV_FSP.1, AVA_VLA.2, ASE_INT.1, ASE_SRE.1, ADV_HLD.2, ASE_TSS.1, ASE_OBJ.1, AGD_USR.1, ATE_IND.1, ADV_LLD.1, ALC_DVS.2, AGD_ADM.1, ASE_REQ.1, ASE_PPC.1, ASE_DES.1, ADV_IMP.1	ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4
heuristics/extracted_versions	-	-
heuristics/prev_certificates	{}	{}
heuristics/next_certificates	{}	{}
heuristics/report_references/directly_referenced_by	{}	BSI-DSZ-CC-1045-V2-2023
heuristics/report_references/directly_referencing	{}	{}
heuristics/report_references/indirectly_referenced_by	{}	BSI-DSZ-CC-1045-V2-2023
heuristics/report_references/indirectly_referencing	{}	{}
heuristics/scheme_data
heuristics/st_references/directly_referenced_by	{}	{}
heuristics/st_references/directly_referencing	{}	{}
heuristics/st_references/indirectly_referenced_by	{}	{}
heuristics/st_references/indirectly_referencing	{}	{}
heuristics/protection_profiles	{}	cf0f01bcd7be3e9c
maintenance_updates
protection_profiles
protection_profile_links	{}	https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf
pdf_data/cert_filename		1045c_pdf.pdf
pdf_data/cert_frontpage
pdf_data/cert_keywords/cc_cert_id		DE: BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id		BSI: BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level		EAL: EAL 2: 1 EAL 4: 1 EAL 4 augmented: 1 EAL 5: 1
pdf_data/cert_keywords/cc_sar		ALC: ALC_DVS.2: 1 AVA: AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor		Qualcomm: Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id		ISO: ISO/IEC 15408: 2 ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata		/Author: Bundesamt für Sicherheit in der Informationstechnik /CreationDate: D:20200129140240+01'00' /Creator: Writer /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor /ModDate: D:20200129140509+01'00' /Producer: LibreOffice 6.2 /Subject: Common Criteria Certification /Title: Certificate BSI-DSZ-CC-1045-2019 pdf_file_size_bytes: 898760 pdf_hyperlinks: {} pdf_is_encrypted: False pdf_number_of_pages: 1
pdf_data/report_filename	2001_11.pdf	1045a_pdf.pdf
pdf_data/report_frontpage	FR: DE:	FR: DE: cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2 cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant cert_id: BSI-DSZ-CC-1045-2019 cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC cert_lab: BSI developer: Qualcomm Technologies Inc match_rules: *['(BSI-DSZ-CC-.+?) (?:for\|For) (.+?) from (.)'] ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014**
pdf_data/report_keywords/cc_cert_id	FR: Rapport de certification 2001/11: 22 NL: CC-1: 1 CC-2: 1 CC-3: 1	DE: BSI-DSZ-CC-1045-2019: 15
pdf_data/report_keywords/cc_protection_profile_id		BSI: BSI-CC-PP-0084-: 1 BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level	EAL: EAL1: 7	EAL: EAL 1: 1 EAL 2: 3 EAL 4: 5 EAL 4 augmented: 3 EAL 5: 4
pdf_data/report_keywords/cc_sar	ACM: ACM_CAP.1: 2 ADO: ADO_DEL.2: 1 ADO_IGS.1: 2 ADV: ADV_FSP.1: 2 ADV_RCR.1: 2 AGD: AGD_ADM.1: 2 AGD_USR.1: 2 ALC: ALC_DVS.2: 1 ASE: ASE_DES.1: 1 ASE_ENV.1: 1 ASE_INT.1: 1 ASE_OBJ.1: 1 ASE_PPC.1: 1 ASE_REQ.1: 1 ASE_SRE.1: 1 ASE_TSS.1: 1 ATE: ATE_IND.1: 2 AVA: AVA_VLA.2: 9	ALC: ALC_CMC.4: 1 ALC_CMS.4: 1 ALC_DEL: 1 ALC_DEL.1: 1 ALC_DVS: 1 ALC_DVS.2: 5 ALC_FLR: 1 ALC_LCD.1: 1 ALC_TAT.1: 1 ATE: ATE_FUN: 1 ATE_IND: 1 AVA: AVA_VAN: 1 AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
pdf_data/report_keywords/cc_claims		O: O.C: 5 R: R.O: 5
pdf_data/report_keywords/vendor		Qualcomm: Qualcomm: 29
pdf_data/report_keywords/eval_facility	CESTI: CESTI: 1	TSystems: T-Systems International: 3 atsec: atsec: 2
pdf_data/report_keywords/symmetric_crypto	DES: DES: DES: 1	AES_competition: AES: AES: 3
pdf_data/report_keywords/asymmetric_crypto
pdf_data/report_keywords/pq_crypto
pdf_data/report_keywords/hash_function		SHA: SHA1: SHA1: 2
pdf_data/report_keywords/crypto_scheme
pdf_data/report_keywords/crypto_protocol
pdf_data/report_keywords/randomness		RNG: RNG: 1
pdf_data/report_keywords/cipher_mode
pdf_data/report_keywords/ecc_curve
pdf_data/report_keywords/crypto_engine
pdf_data/report_keywords/tls_cipher_suite
pdf_data/report_keywords/crypto_library
pdf_data/report_keywords/vulnerability
pdf_data/report_keywords/side_channel_analysis		FI: fault injection: 1 SCA: Side-channel: 1 physical probing: 1 other: JIL: 3
pdf_data/report_keywords/technical_report_id		BSI: BSI 7148: 1
pdf_data/report_keywords/device_model
pdf_data/report_keywords/tee_name
pdf_data/report_keywords/os_name
pdf_data/report_keywords/cplc_data
pdf_data/report_keywords/ic_data_group
pdf_data/report_keywords/standard_id	CC: CCIMB-99-031: 1 CCIMB-99-032: 1 CCIMB-99-033: 1	BSI: AIS 20: 1 AIS 25: 2 AIS 26: 3 AIS 31: 3 AIS 32: 1 AIS 34: 1 AIS 35: 2 AIS 36: 1 AIS 37: 1 ISO: ISO/IEC 15408: 4 ISO/IEC 17065: 2 ISO/IEC 18045: 4
pdf_data/report_keywords/javacard_version
pdf_data/report_keywords/javacard_api_const
pdf_data/report_keywords/javacard_packages
pdf_data/report_keywords/certification_process		ConfidentialDocument: List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1 Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1 T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1 being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata	/Author: bousson /CreationDate: D:20010614140910 /Creator: FrameMaker 6.0 /ModDate: D:20010614142829+02'00' /Producer: Acrobat Distiller 4.05 for Windows /Title: 2001_11.book pdf_file_size_bytes: 149480 pdf_hyperlinks: {} pdf_is_encrypted: False pdf_number_of_pages: 28	/Author: Bundesamt für Sicherheit in der Informationstechnik /CreationDate: D:20200128144340+01'00' /Creator: Writer /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor /ModDate: D:20200129135949+01'00' /Producer: LibreOffice 6.2 /Subject: Common Criteria Certification /Title: Certification Report BSI-DSZ-CC-1045-2019 pdf_file_size_bytes: 1375836 pdf_hyperlinks: http://www.commoncriteriaportal.org/cc/, https://www.bsi.bund.de/AIS, http://www.sogisportal.eu/, http://www.commoncriteriaportal.org/, https://www.bsi.bund.de/zertifizierung, https://www.bsi.bund.de/zertifizierungsreporte, https://www.bsi.bund.de/ pdf_is_encrypted: False pdf_number_of_pages: 25
pdf_data/st_filename	cible2001_11.pdf	1045b_pdf.pdf
pdf_data/st_frontpage
pdf_data/st_keywords/cc_cert_id
pdf_data/st_keywords/cc_protection_profile_id		BSI: BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level	EAL: EAL1: 11 EAL1 augmented: 2 EAL1+: 2 EAL4: 5 EAL4 augmented: 3	EAL: EAL4: 1 EAL4 augmented: 1
pdf_data/st_keywords/cc_sar	ACM: ACM_CAP: 1 ACM_CAP.1: 11 ADO: ADO_IGS: 1 ADO_IGS.1: 10 ADV: ADV_FSP: 1 ADV_FSP.1: 25 ADV_HLD.2: 4 ADV_IMP.1: 4 ADV_LLD.1: 4 ADV_RCR: 1 ADV_RCR.1: 10 AGD: AGD_ADM: 1 AGD_ADM.1: 31 AGD_USR: 1 AGD_USR.1: 23 ATE: ATE_IND: 1 ATE_IND.1: 12 AVA: AVA_VLA: 1 AVA_VLA.2: 24	ALC: ALC_DEL: 1 ALC_DVS: 1 ALC_DVS.2: 1 AVA: AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr	FAU: FAU_ARP: 1 FAU_ARP.1: 8 FAU_GEN: 1 FAU_GEN.1: 11 FAU_SAA: 1 FAU_SAA.1: 9 FDP: FDP_ACC: 1 FDP_ACC.1: 14 FDP_ACC.2: 24 FDP_ACF: 1 FDP_ACF.1: 22 FDP_IFC.1: 2 FIA: FIA_ATD: 1 FIA_ATD.1: 11 FIA_UAU: 1 FIA_UAU.1: 1 FIA_UAU.2: 10 FIA_UID: 1 FIA_UID.1: 9 FIA_UID.2: 13 FMT: FMT_MOF: 1 FMT_MOF.1: 16 FMT_MSA: 1 FMT_MSA.1: 20 FMT_MSA.3: 6 FMT_SMR: 1 FMT_SMR.1: 20 FPT: FPT_STM: 1 FPT_STM.1: 10	FAU: FAU_GEN: 1 FAU_SAS.1: 4 FAU_SAS.1.1: 1 FCS: FCS_CKM: 30 FCS_CKM.1: 7 FCS_CKM.2: 2 FCS_CKM.4: 7 FCS_COP: 17 FCS_COP.1: 5 FCS_ITC.1: 5 FCS_ITC.2: 5 FCS_RNG.1: 3 FCS_RNG.1.1: 1 FCS_RNG.1.2: 1 FDP: FDP_ACC: 4 FDP_ACC.1: 2 FDP_ACC.2: 3 FDP_ACC.2.1: 1 FDP_ACC.2.2: 1 FDP_ACF: 3 FDP_ACF.1: 4 FDP_ACF.1.1: 1 FDP_ACF.1.2: 1 FDP_ACF.1.3: 1 FDP_ACF.1.4: 1 FDP_ICT.1: 1 FDP_IFC.1: 5 FDP_IFC.1.1: 2 FDP_IFF.1: 1 FDP_ITC.1: 8 FDP_ITC.1.1: 1 FDP_ITC.1.2: 1 FDP_ITC.1.3: 1 FDP_ITT.1: 3 FDP_ITT.1.1: 1 FDP_RIP: 10 FDP_RIP.1: 2 FDP_SDA: 7 FDP_SDA.1: 8 FDP_SDA.1.1: 2 FDP_SDC.1: 11 FDP_SDC.1.1: 2 FDP_SDI: 2 FDP_SDI.2: 18 FDP_SDI.2.1: 3 FDP_SDI.2.2: 3 FDP_SDR: 7 FDP_SDR.1: 8 FDP_SDR.1.1: 2 FMT: FMT_CMT: 2 FMT_CMT.1: 35 FMT_CMT.1.1: 7 FMT_LIM.1: 5 FMT_LIM.1.1: 1 FMT_LIM.2: 5 FMT_LIM.2.1: 1 FMT_MSA: 5 FMT_MSA.1: 2 FMT_MSA.3: 5 FMT_MSA.3.1: 1 FMT_MSA.3.2: 1 FMT_SMR.1: 1 FPT: FPT_FLS.1: 5 FPT_FLS.1.1: 1 FPT_ITT.1: 3 FPT_ITT.1.1: 1 FPT_PHP.3: 3 FPT_PHP.3.1: 1 FRU: FRU_FLT.2: 4 FRU_FLT.2.1: 1
pdf_data/st_keywords/cc_claims	A: A.SEC_DEL: 2 A.SKL_PERSONNEL: 3 A.TRUST_PHOTOMAS: 1 A.TRUST_PHOTOMASKS: 1 A.TRUST_TPROG: 2 O: O.ACS_PRT: 2 O.AREA_PRT: 14 O.IC_DLV: 1 O.IC_PRT: 6 O.ISSUE_INFO: 4 O.PHOTOMASK_PRT: 4 O.PHOTOMASK_TRACK: 5 O.PRODUCT_TRACK: 5 O.SEC_DEL: 1 O.TDATA_PRT: 7 O.TPROG_PRT: 6 O.TPROG_TRACK: 5 O.TRACE: 4 O.TRUST_PHOTOMASK: 2 O.TRUST_TPROG: 1 T: T.CLON: 1 T.DIS_DESIGN: 1 T.DIS_PHOTOMASK: 1 T.DIS_SOFT: 2 T.DIS_TDATA: 3 T.DIS_TOOLS: 1 T.DIS_TPROG: 4 T.MOD_DESIGN: 1 T.MOD_DSOFT: 1 T.MOD_PHOTOMASK: 1 T.MOD_SOFT: 1 T.MOD_TDATA: 2 T.MOD_TPROG: 5 T.MOD_TRACEDATA: 9 T.T_PHOTOMASK: 6 T.T_PRODUCT: 10 T.T_TDATA: 2 T.T_TPROG: 5	O: O.AES: 3 O.KDF: 5 O.RND: 1 O.SHA: 4 T: T.AUTH-APPLI-DATA: 3 T.AUTH-TSF-DATA: 3 T.CONFID-APPLI-DATA: 5 T.CONFID-TSF-CODE: 3 T.CONFID-TSF-DATA: 4 T.INTEG-: 1 T.INTEG-APPLI-CODE: 3 T.INTEG-APPLI-DATA: 5 T.INTEG-TSF-CODE: 3 T.INTEG-TSF-DATA: 3 T.RBP-APPLI-DATA: 3 T.RBP-TSF-DATA: 3 T.RND: 1
pdf_data/st_keywords/vendor		Qualcomm: Qualcomm: 19
pdf_data/st_keywords/eval_facility
pdf_data/st_keywords/symmetric_crypto		AES_competition: AES: AES: 34 AES-256: 2 constructions: MAC: CMAC: 17 HMAC: 3
pdf_data/st_keywords/asymmetric_crypto
pdf_data/st_keywords/pq_crypto
pdf_data/st_keywords/hash_function		SHA: SHA1: SHA-1: 5 SHA1: 1 SHA2: SHA-256: 10 SHA-384: 3 SHA-512: 4
pdf_data/st_keywords/crypto_scheme		MAC: MAC: 1
pdf_data/st_keywords/crypto_protocol
pdf_data/st_keywords/randomness		PRNG: DRBG: 1 RNG: RND: 2 RNG: 12
pdf_data/st_keywords/cipher_mode		CBC: CBC: 2 CCM: CCM: 4 CTR: CTR: 2 ECB: ECB: 2
pdf_data/st_keywords/ecc_curve
pdf_data/st_keywords/crypto_engine
pdf_data/st_keywords/tls_cipher_suite
pdf_data/st_keywords/crypto_library
pdf_data/st_keywords/vulnerability
pdf_data/st_keywords/side_channel_analysis		FI: Malfunction: 3 fault injection: 2 malfunction: 3 SCA: Leak-Inherent: 3 Physical Probing: 2 Side-channel: 1 physical probing: 4 side channels: 1 side-channel: 2 other: cold boot: 4
pdf_data/st_keywords/technical_report_id
pdf_data/st_keywords/device_model
pdf_data/st_keywords/tee_name		ARM: ARM TrustZone: 1
pdf_data/st_keywords/os_name
pdf_data/st_keywords/cplc_data
pdf_data/st_keywords/ic_data_group
pdf_data/st_keywords/standard_id		CC: CCMB-2017-04-001: 1 CCMB-2017-04-002: 1 CCMB-2017-04-003: 1 FIPS: FIPS 180-4: 3 FIPS 186-4: 1 FIPS 197: 5 FIPS 198-1: 2 FIPS PUB 180-4: 3 FIPS PUB 186-4: 1 FIPS PUB 197: 3 FIPS PUB 198-1: 2 NIST: NIST SP 800-108: 3 NIST SP 800-38A: 2 NIST SP 800-38B: 2 NIST SP 800-38C: 1 NIST SP 800-90A: 1 PKCS: PKCS#1: 1 RFC: RFC3447: 1
pdf_data/st_keywords/javacard_version
pdf_data/st_keywords/javacard_api_const
pdf_data/st_keywords/javacard_packages
pdf_data/st_keywords/certification_process
pdf_data/st_metadata	/CreationDate: D:20010705142414 /Creator: /ModDate: D:20010705142716+02'00' /Producer: Acrobat Distiller 4.05 for Windows /Title: SmartCard Application Center pdf_file_size_bytes: 549791 pdf_hyperlinks: {} pdf_is_encrypted: False pdf_number_of_pages: 101	/Author: QTI /CreationDate: D:20190503125434-07'00' /Creator: Microsoft® Word for Office 365 /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230 /ModDate: D:20190503125649-07'00' /Producer: Microsoft® Word for Office 365 /Subject: 80-NU430-6 Rev. B /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite pdf_file_size_bytes: 723737 pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected] pdf_is_encrypted: False pdf_number_of_pages: 54
state/cert/convert_garbage	False	False
state/cert/convert_ok	False	True
state/cert/download_ok	False	True
state/cert/extract_ok	False	True
state/cert/pdf_hash	Different	Different
state/cert/txt_hash	Different	Different
state/report/convert_garbage	False	False
state/report/convert_ok	True	True
state/report/download_ok	True	True
state/report/extract_ok	True	True
state/report/pdf_hash	Different	Different
state/report/txt_hash	Different	Different
state/st/convert_garbage	False	False
state/st/convert_ok	True	True
state/st/download_ok	True	True
state/st/extract_ok	True	True
state/st/pdf_hash	Different	Different
state/st/txt_hash	Different	Different