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Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software
BSI-DSZ-CC-0945-V2-2018
NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
BSI-DSZ-CC-0978-V2-2017
name Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
not_valid_after 20.04.2023 27.09.2022
not_valid_before 20.04.2018 27.09.2017
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0945V2b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V2b_pdf.pdf
manufacturer Infineon Technologies AG NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity
manufacturer_web https://www.infineon.com/ https://www.nxp.com
security_level EAL6+, ALC_FLR.1 EAL6+, ALC_FLR.1, ASE_TSS.2
dgst 495bf1a11037cde1 5e878dec3caea712
heuristics/cert_id BSI-DSZ-CC-0945-V2-2018 BSI-DSZ-CC-0978-V2-2017
heuristics/extracted_sars ALC_CMC.5, ALC_CMS.5, ADV_CMC.5, ASE_INT.1, ADV_SPM.1, ATE_DPT.3, ALC_FLR.1, ASE_TSS.1, ADV_IMP.2, ATE_FUN.2, AGD_PRE.1, ASE_CCL.1, ALC_DVS.2, ATE_IND.2, ADV_INT.3, AVA_VAN.5, ASE_SPD.1, ASE_OBJ.2, ASE_REQ.2, ADV_FSP.5, ADV_ARC.1, ADV_TDS.5, ALC_DEL.1, ATE_COV.3, AGD_OPE.1, ALC_LCD.1, ASE_ECD.1, ALC_TAT.3 ALC_CMC.5, ALC_CMS.5, APE_REQ.2, ASE_INT.1, APE_INT.1, ADV_SPM.1, ATE_DPT.3, ASE_TSS.2, ALC_FLR.1, ADV_IMP.2, APE_SPD.1, APE_ECD.1, ATE_FUN.2, AGD_PRE.1, ASE_CCL.1, ALC_DVS.2, ATE_IND.2, ADV_INT.3, AVA_VAN.5, ASE_SPD.1, ASE_OBJ.2, ASE_REQ.2, ADV_FSP.5, ADV_ARC.1, ADV_TDS.5, ALC_DEL.1, ATE_COV.3, APE_OBJ.2, ALC_LCD.1, AGD_OPE.1, APE_CCL.1, ASE_ECD.1, ALC_TAT.3
heuristics/extracted_versions 01.22.4346, 02.02.3389, 02.03.3446, 2.06.003, 2.07.003, 2.0.0002, 2.02.010, 02.01.6634 -
heuristics/prev_certificates BSI-DSZ-CC-0945-2017 BSI-DSZ-CC-0978-2016
heuristics/next_certificates BSI-DSZ-CC-0945-V3-2018 BSI-DSZ-CC-0978-V3-2019
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-0976-V2-2018, BSI-DSZ-CC-0945-V3-2018 BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0978-V3-2019, BSI-DSZ-CC-0809-V3-2017
heuristics/report_references/directly_referencing BSI-DSZ-CC-0891-V2-2016, BSI-DSZ-CC-0945-2017 BSI-DSZ-CC-0978-2016
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1176-2023, BSI-DSZ-CC-0945-V3-2018, ANSSI-CC-2020/88-R01, BSI-DSZ-CC-1162-V2-2023, BSI-DSZ-CC-1076-2020, ANSSI-CC-2022/65, ANSSI-CC-2019/57-R01, ANSSI-CC-2020/64, BSI-DSZ-CC-0976-V2-2018, NSCIB-CC-0286907-CR, ANSSI-CC-2022/64, ANSSI-CC-2020/59, ANSSI-CC-2019/57, ANSSI-CC-2019/56-R01, ANSSI-CC-2020/57, ANSSI-CC-2022/07, NSCIB-CC-0075541-CR2, ANSSI-CC-2020/87-R01, BSI-DSZ-CC-1110-V2-2019, ANSSI-CC-2020/58, BSI-DSZ-CC-1077-2020, BSI-DSZ-CC-1110-2019, BSI-DSZ-CC-1110-V5-2022, BSI-DSZ-CC-1110-V3-2020, BSI-DSZ-CC-1098-2020, ANSSI-CC-2020/87, NSCIB-CC-175887-CR3, BSI-DSZ-CC-1110-V4-2021, ANSSI-CC-2022/19, ANSSI-CC-2020/63, ANSSI-CC-2020/88, ANSSI-CC-2022/68, ANSSI-CC-2019/56, ANSSI-CC-2020/07, ANSSI-CC-2020/61, BSI-DSZ-CC-1172-2022, KECS-ISIS-1031-2020, ANSSI-CC-2019/58, BSI-DSZ-CC-1110-V6-2023, ANSSI-CC-2022/33, NSCIB-CC-0299278-CR, BSI-DSZ-CC-1077-V2-2024, NSCIB-CC-0299277-CR, BSI-DSZ-CC-0976-V4-2021, BSI-DSZ-CC-1162-2021, ANSSI-CC-2019/58-R01, NSCIB-CC-22-0286910-CR, ANSSI-CC-2020/60, ANSSI-CC-2020/08, ANSSI-CC-2020/56, BSI-DSZ-CC-1243-2024, ANSSI-CC-2019/55-R01, ANSSI-CC-2022/67, BSI-DSZ-CC-0976-V3-2019, BSI-DSZ-CC-1110-V7-2024, ANSSI-CC-2020/55, ANSSI-CC-2022/08, ANSSI-CC-2019/55, ANSSI-CC-2020/62, ANSSI-CC-2022/20 BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0978-V3-2019, BSI-DSZ-CC-0809-V3-2017
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0891-V2-2016, BSI-DSZ-CC-0891-2015, BSI-DSZ-CC-0782-2012, BSI-DSZ-CC-0945-2017 BSI-DSZ-CC-0978-2016
heuristics/st_references/directly_referenced_by NSCIB-CC-200736-CR, NSCIB-CC-200689-CR, NSCIB-CC-200716-CR2, BSI-DSZ-CC-0976-V2-2018, NSCIB-CC-200833-CR, NSCIB-CC-200270-CR BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0809-V3-2017
heuristics/st_references/indirectly_referenced_by NSCIB-CC-200736-CR, NSCIB-CC-200689-CR, NSCIB-CC-200716-CR2, BSI-DSZ-CC-0976-V2-2018, NSCIB-CC-200833-CR, NSCIB-CC-200270-CR BSI-DSZ-CC-0808-V3-2017, BSI-DSZ-CC-1035-2017, BSI-DSZ-CC-0809-V3-2017
maintenance_updates
protection_profiles
pdf_data/cert_filename 0945V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0945-V2-2018: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Infineon:
    • Infineon: 1
    • Infineon Technologies AG: 1
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20180511123101+02'00'
  • /Creator: Writer
  • /Keywords: "Common Criteria, Certification, Zertifizierung, 0945-V2, SmartCard, Security IC, Infineon, PP-0084"
  • /ModDate: D:20180524130830+02'00'
  • /Producer: LibreOffice 5.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-0945-V2-2018
  • pdf_file_size_bytes: 347840
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 0945V2a_pdf.pdf 0978V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0945-V2-2018
    • cert_item: Infineon smart card IC (Security Controller) IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022Dh, design step H13 with optional libraries CCL V2.0.0002, RSA2048/4096 V2.07.003 / V2.06.003, EC V2.07.003 / V2.06.003, Toolbox V2.07.003 / V2.06.003, HSL V02.01.6634 / V01.22.4346, MCS V02.02.3389 / V02.03.3446, SCL V2.02.010 and with specific IC dedicated software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2 and ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0978-V2-2017
    • cert_item: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0891-V2-2016: 1
    • BSI-DSZ-CC-0945-2017: 3
    • BSI-DSZ-CC-0945-V2-2018: 19
  • DE:
    • BSI-DSZ-CC-0978-: 1
    • BSI-DSZ-CC-0978-2016: 2
    • BSI-DSZ-CC-0978-V2-2017: 21
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
  • BSI:
    • BSI-CC-PP- 0035-2007: 1
    • BSI-CC-PP-0035-2007: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL5+: 1
  • EAL:
    • EAL 1: 7
    • EAL 2: 6
    • EAL 3: 4
    • EAL 4: 5
    • EAL 5: 9
    • EAL 5+: 1
    • EAL 6: 8
    • EAL 6 augmented: 3
    • EAL 7: 4
    • EAL5: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 1
    • ADV_FSP.1: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 1
    • ADV_FSP.6: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_IMP.2: 1
    • ADV_INT: 1
    • ADV_INT.1: 1
    • ADV_INT.2: 1
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 1
    • ADV_TDS: 1
    • ADV_TDS.1: 1
    • ADV_TDS.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
    • ADV_TDS.5: 1
    • ADV_TDS.6: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.1: 1
    • ALC_CMC.2: 1
    • ALC_CMC.3: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_CMS.3: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 2
    • ALC_DEL: 1
    • ALC_DEL.1: 2
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 4
    • ALC_FLR.1: 6
    • ALC_FLR.2: 1
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_LCD.2: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 1
    • ALC_TAT.3: 2
  • APE:
    • APE_CCL.1: 1
    • APE_ECD.1: 1
    • APE_INT.1: 1
    • APE_OBJ.1: 1
    • APE_OBJ.2: 1
    • APE_REQ.1: 1
    • APE_REQ.2: 1
    • APE_SPD.1: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_CCL.1: 1
    • ASE_ECD: 1
    • ASE_ECD.1: 1
    • ASE_INT: 1
    • ASE_INT.1: 1
    • ASE_OBJ: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ: 1
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD: 1
    • ASE_SPD.1: 1
    • ASE_TSS: 1
    • ASE_TSS.1: 1
    • ASE_TSS.2: 5
  • ATE:
    • ATE_COV: 1
    • ATE_COV.1: 1
    • ATE_COV.2: 1
    • ATE_COV.3: 1
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 1
    • ATE_DPT.4: 1
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_FUN.2: 1
    • ATE_IND: 2
    • ATE_IND.1: 1
    • ATE_IND.2: 1
    • ATE_IND.3: 1
  • AVA:
    • AVA_VAN: 3
    • AVA_VAN.1: 1
    • AVA_VAN.2: 1
    • AVA_VAN.3: 1
    • AVA_VAN.4: 1
    • AVA_VAN.5: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 6
  • R:
    • R.O: 6
pdf_data/report_keywords/vendor
  • GD:
    • G&D: 1
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 21
    • Infineon Technologies AG: 19
  • NXP:
    • NXP: 35
    • NXP Semiconductors: 53
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • TUV:
    • TÜV Informationstechnik: 4
    • TÜViT: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • Triple-DES: 3
    • DES:
      • DES: 2
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDES: 3
      • Triple-DES: 5
    • DES:
      • DES: 4
pdf_data/report_keywords/asymmetric_crypto
  • FF:
    • DH:
      • Diffie-Hellman: 1
    • DSA:
      • DSA: 1
  • RSA:
    • RSA2048: 3
    • RSA4096: 1
pdf_data/report_keywords/crypto_scheme
  • KEX:
    • Key Exchange: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 2
  • RNG:
    • RNG: 3
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 16
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • DFA: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 2
    • physical probing: 1
  • other:
    • JIL: 5
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 31: 1
    • AIS 34: 1
    • AIS 35: 1
    • AIS 36: 1
    • AIS1: 1
    • AIS14: 1
    • AIS19: 1
    • AIS20: 2
    • AIS25: 2
    • AIS26: 1
    • AIS31: 3
    • AIS32: 1
    • AIS34: 1
    • AIS35: 1
    • AIS36: 2
    • AIS38: 2
    • AIS39: 2
    • AIS46: 4
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS31: 1
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • IFX_CCI_00001Dh, IFX_CCI_000021h, IFX_CCI_000022h design step H13”, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report for the Product BSI-DSZ-CC-0945-V2-2018, 2.02, 04.04.2018: 1
    • Technical Report - Summary”, T-Systems International GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Version 2.03, 04.04.2018, ETR for composite evaluation (EFC), T- Systems International GmbH (confidential document) 7 specifically • AIS1, Durchführung der Ortsbesichtigung in der Entwicklungsumgebung des: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE, NXP Semiconductors, Version 2.62, 14 September 2017 (confidential document) [7] Evaluation Technical Report, NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE: 1
    • Document Number 2250** ,NXP Semiconductors, Version 3.2, 04 February 2013 (confidential document) [18] Product data sheet addendum: SmartMX2 family Chip Health Mode (CHM), NXP Semiconductors: 1
    • Document Number 2333**, NXP Semiconductors, Version 4.2, 24 June 2015 (confidential document) [20] Product data sheet SmartMX2 family P60N144 VA, Secure high-performance smart card controller: 1
    • NXP Semiconductors Document Number 1658**, NXP Semiconductors, Version 5.4, 14 August 2015 (confidential document) [14] Instruction Set for the SmartMX2 family, Secure smart card controller, NXP Semiconductors: 1
    • NXP Semiconductors, Document Number 1569**, NXP Semiconductors, Version 3.7, 21 May 2014 (confidential document) [17] Product data sheet addendum: SmartMX2 family Post Delivery Configuration (PDC), NXP: 1
    • Number 1478**, NXP Semiconductors, Version 3.1, 02 February 2012 (confidential document) [15] Information on Guidance and Operation, NXP Secure Smart Card Controller P60x080/144P VA/VE: 1
    • Number 2244**, NXP Semiconductors, Version 3.1, 01 October 2014 (confidential document) [19] Product data sheet addendum: SmartMX2 family Firmware Interface Specification (FIS), NXP: 1
    • Report Software, BSI-DSZ-CC-0978-V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [11] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Configuration List,NXP: 1
    • Semiconductors, Document Number 2408**, NXP Semiconductors, Version 3.2, 14 August 2014 (confidential document) [21] Product data sheet addendum: SmartMX2 family P60N144 VA/VE, Wafer and delivery specification: 1
    • Semiconductors, Document Number 2414**, NXP Semiconductors, Version 3.2, 06 June 2015 (confidential document) [22] Order Entry Form, P60C144, NXP Semiconductors, Version 3.2, 06 October 2015 [23] Order Entry: 1
    • Semiconductors, NXP Semiconductors, Version 2.8, 07 July 2017 (confidential document) [16] Product data sheet addendum: SmartMX2 family P60D080/144 VA/VE and P60C080/144 VA/VE: 1
    • Software, BSI-DSZ-CC-0978- V2, TÜV Informationstechnik GmbH, Version 2, 14 September 2017 (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [9: 1
    • Version 1.44, 14 September 2017 (confidential document) [13] Product data sheet SmartMX2 family P60x080/144 VA/VE, Secure high- performance smart card: 1
    • Version 2.7, 25 September 2015 (confidential document) [12] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Evaluation Reference List, NXP: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 0945V2b_pdf.pdf 0978V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 4
  • BSI:
    • BSI-PP-0035: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL6: 149
    • EAL6 augmented: 145
    • EAL6+: 145
  • EAL:
    • EAL 6: 2
    • EAL4: 3
    • EAL4 augmented: 1
    • EAL4+: 1
    • EAL6: 36
    • EAL6 augmented: 3
    • EAL6+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.2: 3
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_SPM.1: 6
    • ADV_TDS: 1
    • ADV_TDS.4: 2
    • ADV_TDS.5: 3
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 2
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 3
    • ALC_DVS.1: 2
    • ALC_DVS.2: 4
    • ALC_FLR.1: 10
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.2: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL: 8
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 19
    • ASE_INT.1: 1
    • ASE_OBJ: 11
    • ASE_OBJ.2: 1
    • ASE_REQ: 57
    • ASE_REQ.2: 1
    • ASE_SPD: 8
    • ASE_SPD.1: 1
    • ASE_TSS: 21
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 3
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 3
    • ATE_FUN.2: 3
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 4
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 4
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 4
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS: 3
    • FAU_SAS.1: 12
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 104
    • FCS_CKM.1: 33
    • FCS_CKM.2: 9
    • FCS_CKM.4: 46
    • FCS_COP: 124
    • FCS_COP.1: 35
    • FCS_RNG: 42
    • FCS_RNG.1: 16
  • FDP:
    • FDP_ACC: 15
    • FDP_ACC.1: 30
    • FDP_ACC.1.1: 1
    • FDP_ACF: 15
    • FDP_ACF.1: 27
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 20
    • FDP_ITC.1: 34
    • FDP_ITC.2: 34
    • FDP_ITT.1: 22
    • FDP_SDC: 1
    • FDP_SDC.1: 10
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 14
    • FDP_SDI.1.1: 2
    • FDP_SDI.2: 16
    • FDP_SDI.2.1: 2
    • FDP_SDI.2.2: 2
    • FDP_UCT.1: 12
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 12
    • FDP_UIT.1.1: 1
  • FIA:
    • FIA_API: 4
    • FIA_API.1: 14
    • FIA_API.1.1: 1
    • FIA_SOS.2: 2
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 1
  • FMT:
    • FMT_LIM: 35
    • FMT_LIM.1: 10
    • FMT_LIM.2: 9
    • FMT_MSA.1: 19
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 23
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 17
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 27
    • FPT_ITC.1: 4
    • FPT_ITT.1: 23
    • FPT_PHP.3: 30
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 31
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 9
  • FTP:
    • FTP_ACF: 1
    • FTP_ITC.1: 14
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 3
  • FAU:
    • FAU_SAS.1: 7
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 3
    • FCS_COP.1: 23
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 9
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 35
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 32
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_FLS.1: 1
    • FDP_IFC.1: 10
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDI.1: 1
    • FDP_SDI.2: 7
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 4
    • FMT_MSA.1: 25
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 19
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 7
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 7
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 9
    • O.RND: 4
    • O.TDES: 7
  • T:
    • T.RND: 1
  • O:
    • O.CUST_RECONFIG: 5
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.HW_AES: 7
    • O.MEM_ACCESS: 9
    • O.RND: 3
    • O.SFR_ACCESS: 9
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Infineon:
    • Infineon: 14
    • Infineon Technologies: 19
    • Infineon Technologies AG: 15
  • NXP:
    • NXP: 138
    • NXP Semiconductors: 49
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 83
      • AES-128: 3
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 4
      • TDES: 50
      • Triple-DES: 3
      • TripleDES: 2
    • DES:
      • DES: 33
  • constructions:
    • MAC:
      • CBC-MAC: 11
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 3
      • Triple-DEA: 1
      • Triple-DES: 9
    • DES:
      • DEA: 2
      • DES: 16
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 20
    • ECDH:
      • ECDH: 13
    • ECDSA:
      • ECDSA: 26
  • FF:
    • DH:
      • Diffie-Hellman: 12
    • DSA:
      • DSA: 2
  • RSA:
    • RSA2048: 1
    • RSA4096: 1
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 20
  • SHA:
    • SHA1:
      • SHA-1: 21
      • SHA1: 1
    • SHA2:
      • SHA-256: 19
      • SHA256: 1
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 3
    • Key agreement: 3
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • PRNG: 2
  • RNG:
    • RND: 5
    • RNG: 25
  • TRNG:
    • DTRNG: 1
    • TRNG: 4
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 18
  • CFB:
    • CFB: 10
  • CTR:
    • CTR: 10
  • ECB:
    • ECB: 21
pdf_data/st_keywords/ecc_curve
  • NIST:
    • K-163: 2
    • P-192: 4
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 21
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • DFA: 4
    • Malfunction: 12
    • fault induction: 1
    • fault injection: 3
    • malfunction: 2
  • SCA:
    • DPA: 3
    • Leak-Inherent: 12
    • Physical Probing: 2
    • SPA: 2
    • physical probing: 1
    • side channel: 17
  • other:
    • reverse engineering: 1
  • FI:
    • Malfunction: 10
    • fault injection: 3
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 13
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS 31: 2
    • AIS31: 24
    • AIS32: 10
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
  • FIPS:
    • FIPS 140-2: 2
    • FIPS 197: 3
    • FIPS PUB 186-4: 1
  • ISO:
    • ISO/IEC 11770-3: 1
    • ISO/IEC 14443-4: 3
    • ISO/IEC 14888-3: 1
    • ISO/IEC 18033: 2
    • ISO/IEC 18033-3: 4
    • ISO/IEC 18092: 2
    • ISO/IEC 9797-1: 5
    • ISO/IEC 9798-2: 2
  • NIST:
    • SP 800-38A: 12
    • SP 800-67: 2
  • PKCS:
    • PKCS #1: 4
    • PKCS#1: 1
  • RFC:
    • RFC 5639: 2
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS PUB 197: 3
    • FIPS PUB 46: 1
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 14443: 16
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 22
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • certification. The user operating system and further applications implemented on the TOE are also out of scope of this certification. To summarize, if used with the PCD software the certification view equals to: 1
    • is enabled to communicate via the selected interfaces. The surrounding environment is in both cases out of scope. The CIPURSE™ CL is delivered as object code and in this way integrated in the user software. The: 1
    • out of scope: 2
pdf_data/st_metadata
  • /Author: Buchmüller
  • /CreationDate: D:20180129133020+01'00'
  • /Creator: Microsof Word 2010
  • /Keywords: contactless, dual interface, high end Security Controller, integrity guard, robust, dual core, high attack
  • /ModDate: D:20180129133020+01'00'
  • /Producer: Microsoft® Word 2010
  • /Subject: Common Criteria
  • /Title: Security Target IFX_CCI_3h with Options
  • pdf_file_size_bytes: 2270754
  • pdf_hyperlinks: https://www.bsi.bund.de/, http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 144
  • /Alternative descriptive title: Security Target Lite
  • /Author: NXP Semiconductors
  • /CertificationID: BSI-DSZ-CC-0978-V2
  • /Company: NXP Semiconductors GmbH Germany
  • /Copyright date: 2015
  • /CreationDate: D:20170918092651+02'00'
  • /Creator: Acrobat PDFMaker 11 für Word
  • /Descriptive title: Security Target Lite
  • /Division: NXP Semiconductors
  • /Document identifier:
  • /Keywords: CC Security Evaluation, Security Target, Functional Requirements, Security Functionality, Assurance Level EAL6+, P60D144yVA, P60D080yVA, P60D144yVE, P60D080yVE
  • /ModDate: D:20170918092812+02'00'
  • /Modification date: 14 September 2017
  • /Producer: Adobe PDF Library 11.0
  • /Product name title: <not applicable>
  • /Revision: Rev. 2.62
  • /Security status: <Security status>
  • /SourceModified: D:20170918070724
  • /Specification status: Evaluation documentation PUBLIC
  • /Subject: P60x144/080yVA/yVA(Y/B/X)/yVE
  • /Template date: 29 January 2010
  • /Template version: 2.9.0
  • /Title: Security Target Lite
  • /docpath: file:///e|/idsmx21_p60/data/id_smx21_lib/id_smx21/DOCUMENTS/project_docu/Evaluation/Procedure_P60D144/ASE
  • /list_of_authors:
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  • /relBiblioPath: ..\Bibliography.doc
  • /test_sec_row_naming: manufacturer area
  • /text_cert_body_long: Bundesamt fuer Sicherheit in der Informationstechnik
  • /text_cert_body_short: BSI
  • /text_developer_long: NXP Semiconductors, Business Unit Security & Connectivity
  • /text_developer_short: NXP Semiconductors
  • /text_product_cfgC080: P60C080P
  • /text_product_cfgC144: P60C144P
  • /text_product_cfgD080: P60D080y
  • /text_product_cfgD144: P60D144y
  • /text_product_cfgD144_nameplate: 9050C
  • /text_product_letter: A
  • /text_product_long: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE
  • /text_product_minor: VA/VE
  • /text_product_short: NXP Secure Smart Card Controller P60x144/080y
  • /text_product_short_pa: P60x144/080yVA/VE
  • /text_product_short_pa_b: P60x144/080yVA(B)
  • /text_product_short_pa_y: P60x144/080yVA(Y)
  • /text_product_short_pe: P60x144/080yVE
  • /text_sponsor_long: NXP Semiconductors, Business Unit Security & Connectivity
  • /text_sponsor_short: NXP
  • pdf_file_size_bytes: 899610
  • pdf_hyperlinks: http://www.nxp.com/, mailto:[email protected]
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