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NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
BSI-DSZ-CC-0978-V3-2019
Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, PSL and with specific IC dedicated software
BSI-DSZ-CC-0827-V9-2024
name NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, PSL and with specific IC dedicated software
status archived active
not_valid_after 14.05.2024 07.07.2025
not_valid_before 14.05.2019 06.11.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V3c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V3a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0978V3b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0827V9b_pdf.pdf
manufacturer NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity Infineon Technologies AG
manufacturer_web https://www.nxp.com https://www.infineon.com/
security_level ASE_TSS.2, EAL6+, ALC_FLR.1 EAL5+, AVA_VAN.5, ALC_DVS.2
dgst 4379d4741cbe4444 4e1b46d48008d9c2
heuristics/cert_id BSI-DSZ-CC-0978-V3-2019 BSI-DSZ-CC-0827-V9-2024
heuristics/extracted_sars AVA_VAN.5, ATE_FUN.2, ASE_REQ.2, ASE_OBJ.2, ASE_ECD.1, ATE_DPT.3, ATE_IND.2, ADV_FSP.5, ALC_DVS.2, ALC_CMC.5, ADV_IMP.2, ASE_SPD.1, ALC_FLR.1, ADV_SPM.1, ADV_ARC.1, AGD_PRE.1, ADV_INT.3, ALC_TAT.3, ASE_INT.1, ALC_LCD.1, ALC_CMS.5, AGD_OPE.1, ALC_DEL.1, ATE_COV.3, ASE_TSS.2, ASE_CCL.1, ADV_TDS.5 AVA_VAN.5, ASE_REQ.2, ATE_FUN.1, ASE_OBJ.2, ASE_ECD.1, ATE_DPT.3, ATE_IND.2, ADV_INT.2, ADV_FSP.5, ALC_DVS.2, ALC_CMC.4, ALC_TAT.2, ASE_SPD.1, ADV_ARC.1, ADV_TDS.4, AGD_PRE.1, ASE_INT.1, ALC_LCD.1, ALC_CMS.5, ATE_COV.2, AGD_OPE.1, ASE_TSS.1, ALC_DEL.1, ADV_IMP.1, ASE_CCL.1
heuristics/report_references/directly_referencing BSI-DSZ-CC-0978-V2-2017 BSI-DSZ-CC-0827-V8-2020
heuristics/report_references/indirectly_referencing BSI-DSZ-CC-0978-2016, BSI-DSZ-CC-0978-V2-2017 BSI-DSZ-CC-0791-2012, BSI-DSZ-CC-0827-V5-2017, BSI-DSZ-CC-0827-V3-2015, BSI-DSZ-CC-0827-2013, BSI-DSZ-CC-0827-V6-2017, BSI-DSZ-CC-0827-V7-2018, BSI-DSZ-CC-0827-V8-2020, BSI-DSZ-CC-0827-V2-2014, BSI-DSZ-CC-0827-V4-2016
pdf_data/cert_filename 0978V3c_pdf.pdf 0827V9c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0978-V3-2019: 1
  • DE:
    • BSI-DSZ-CC-0827-V9-2024: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
  • ASE:
    • ASE_TSS.2: 1
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP: 1
    • NXP Semiconductors: 1
  • Infineon:
    • Infineon Technologies AG: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20190617074512+02'00'
  • /Creator: Writer
  • /Keywords: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
  • /ModDate: D:20190619092426+02'00'
  • /Producer: LibreOffice 5.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-0978-V3-2019
  • pdf_file_size_bytes: 351745
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Federal Office for Information Security
  • /Keywords: Common Criteria, Certification, Zertifizierung, Smartcard Controller, Infineon Technologies AG
  • /Subject: Common Criteria, Certification, Zertifizierung, Smartcard Controller, Infineon Technologies AG
  • /Title: Certificate BSI-DSZ-CC-0827-V9-2024
  • pdf_file_size_bytes: 234758
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 0978V3a_pdf.pdf 0827V9a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2, ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0978-V3-2019
    • cert_item: NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE with IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2, AVA_VAN.5 valid until: 6 July 2025 SOGIS Recognition Agreement
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0827-V9-2024
    • cert_item: Infineon Technologies Smart Card IC (Security Controller) M9900 A22, M9900 C22, M9900 D22, M9900 G11, M9905 A11, M9906 A11 with optional Software Libraries RSA2048, RSA4096, EC, Base, SCL, HCL, and PSL, and with specific IC dedicated software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP-0035-2007
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0978-: 1
    • BSI-DSZ-CC-0978-V2-2017: 3
    • BSI-DSZ-CC-0978-V3-2019: 17
  • DE:
    • BSI-DSZ-CC-0827-V8-2020: 3
    • BSI-DSZ-CC-0827-V9-2024: 20
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 3
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
    • EAL5: 1
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 8
    • EAL 5 augmented: 3
    • EAL5+: 1
    • EAL6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 4
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 41
    • NXP Semiconductors: 40
  • GD:
    • G&D: 2
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 6
    • Infineon Technologies: 8
    • Infineon Technologies AG: 8
pdf_data/report_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 4
    • TÜViT: 1
  • TUV:
    • TÜV Informationstechnik: 6
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 1
      • Triple-DES: 5
    • DES:
      • DES: 3
  • AES_competition:
    • AES:
      • AES: 14
  • DES:
    • 3DES:
      • 3DES: 6
      • TDEA: 1
      • Triple-DES: 2
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • CBC-MAC: 1
      • CMAC: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 8
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 4
  • RSA:
    • RSA2048: 10
    • RSA4096: 10
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 2
    • SHA2:
      • SHA-2: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 3
  • TRNG:
    • TRNG: 1
  • RNG:
    • RNG: 2
pdf_data/report_keywords/cipher_mode
  • ECB:
    • ECB: 4
  • CBC:
    • CBC: 2
  • CFB:
    • CFB: 2
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/report_keywords/ecc_curve
  • NIST:
    • B-163: 1
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX2: 16
pdf_data/report_keywords/crypto_library
  • Generic:
    • Crypto Library 2.01.011: 1
pdf_data/report_keywords/side_channel_analysis
  • SCA:
    • DPA: 1
    • SPA: 1
    • physical probing: 1
  • other:
    • JIL: 4
  • FI:
    • DFA: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 2
    • physical probing: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 23: 1
    • AIS 25: 2
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 7816: 2
  • NIST:
    • SP 800-38A: 2
    • SP 800-67: 1
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 25: 1
    • AIS 26: 1
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS31: 2
  • FIPS:
    • FIPS PUB 180-4: 1
    • FIPS PUB 186-4: 1
    • FIPS180-4: 3
    • FIPS186-4: 3
    • FIPS197: 8
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • PKCS:
    • PKCS #1: 3
  • RFC:
    • RFC 5639: 1
    • RFC5639: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • 3.1, 02 February 2012 (confidential document) [15] NXP Secure Smart Card Controller P60x144/080 VA/VE Information on Guidance and Operation, NXP: 1
    • 3.1, 1 October 2014 (confidential document) [19] Product data sheet addendum: SmartMX2 family Firmware Interface Specification (FIS), NXP: 1
    • Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE, NXP Semiconductors, Version 2.64, 12 December 2018 (confidential document) [7] Evaluation Technical Report P60x144/080yVA/VA(Y/B/X)/VE, BSI-DSZ-CC-0978- V3, TÜV: 1
    • GmbH, Version 2, 29 April 2019 (confidential document) [8] Security IC Platform Protection Profile, Version 1.0, 15 June 2007, BSI-CC-PP- 0035-2007 [9: 1
    • NXP Semiconductors, Version 3.2, 14 August 2015 (confidential document) [21] Smart MX2 family P60N144 VA, Wafer and delivery specification, Product data sheet addendum: 1
    • NXP Semiconductors, Version 5.4, 14 August 2015 (confidential document) [14] Instruction Set for the SmartMX2 family, Secure smart card controller, NXP Semiconductors: 1
    • Product data sheet addendum, NXP Semiconductors, Version 3.2, 4 February 2013 (confidential document) [18] Product data sheet addendum: SmartMX2 family Chip Health Mode (CHM), NXP Semiconductors: 1
    • Semiconductors, Version 3.2, 06 June 2015 (confidential document) [22] Order Entry Form, P60C144, NXP Semiconductors, Version 3.2, 06 October 2015 [23] Order Entry: 1
    • Version 2.7, 25 September 2015 (confidential document) 10 specifically • AIS 1, Version 14, Durchführung der Ortsbesichtigung in der Entwicklungsumgebung: 1
    • Version 2.9, 12 December 2018 (confidential document) [16] SmartMX2 family P60D080/144 VA/VE and P60C080/144 VA/VE, Wafer and delivery specification: 1
    • Version 4.2, 24 June 2015 (confidential document) [20] Product data sheet SmartMX2 family P60N144 VA/VE, Secure high-performance smart card: 1
    • Y/B/X)/VE, BSI-DSZ-CC-0978-V3, TÜV Informationstechnik GmbH, Version 2, 29 April 2019 (confidential document) [11] NXP Secure Smart Card Controller P60x144/080yVA/yVA(Y/B/X)/yVE Configuration List, NXP: 1
    • Y/B/X)/yVE Evaluation Reference List, NXP Semiconductors, Version 1.47, 9 January 2019 (confidential document) [13] Product data sheet SmartMX2 family P60x080/144 VA/VE, Secure high- performance smart card: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • data sheet addendum, NXP Semiconductors, Version 3.7, 21 May 2014 (confidential document) [17] SmartMX2 family Post Delivery Configuration (PDC), Secure high-performance smart card: 1
  • ConfidentialDocument:
    • REPORT SUMMARY (ETR SUMMARY)”, TÜV Informationstechnik GmbH, (confidential document) 7 See section 9.1 for a detailed list of used AIS and supporting documents 27 / 32 Certification: 1
    • Scope M9900, M9905, M9906 including optional Software Libraries RSA-EC-SCL- PSL”, Infineon (confidential document) [12] to [24]: See table 2 in section B.2. [25] SINGLE EVALUATION REPORT ADDENDUM to ETR-Part ASE: 1
    • Standards Compliance Verification, Version 1, 2024-09-25, TÜV Informationstechnik GmbH (confidential document) 28 / 32 BSI-DSZ-CC-0827-V9-2024 Certification Report C. Excerpts from the Criteria For the: 1
    • Target M9900, M9905, M9906 including optional Software Libraries RSA-EC-SCL-HCL-PSL”, Infineon (confidential document) [7] Evaluation Technical Report, BSI-DSZ-CC-0827-V9-2024 Version 1, 2024-09-25, “EVALUATION: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • “EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION (ETR COMP)”, TÜV Informationstechnik GmbH (confidential document) and: EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION ADDENDUM, (addendum to the ETR for: 1
pdf_data/report_metadata
pdf_data/st_filename 0978V3b_pdf.pdf 0827V9b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-PP-0035: 1
  • BSI:
    • BSI-CC-PP-0035-2007: 1
    • BSI-PP- 0035: 1
    • BSI-PP-0035: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL 6: 2
    • EAL4: 3
    • EAL4 augmented: 1
    • EAL4+: 1
    • EAL6: 36
    • EAL6 augmented: 3
    • EAL6+: 1
  • EAL:
    • EAL 5: 4
    • EAL 5 augmented: 3
    • EAL5: 7
    • EAL5 augmented: 3
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.4: 3
    • ADV_FSP.5: 11
    • ADV_IMP: 1
    • ADV_IMP.2: 4
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 2
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 4
    • ALC_CMC.4: 3
    • ALC_CMC.5: 4
    • ALC_CMS: 4
    • ALC_CMS.4: 3
    • ALC_CMS.5: 5
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 6
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 2
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_FSP.4: 1
    • ADV_FSP.5: 3
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 9
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL: 2
    • ASE_CCL.1: 1
    • ASE_ECD: 2
    • ASE_ECD.1: 1
    • ASE_INT: 2
    • ASE_INT.1: 1
    • ASE_OBJ: 2
    • ASE_OBJ.2: 1
    • ASE_REQ: 2
    • ASE_REQ.2: 1
    • ASE_SPD: 2
    • ASE_SPD.1: 1
    • ASE_TSS: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.2: 1
    • ATE_DPT.3: 4
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 11
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 8
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 5
    • FCS_CKM.4: 3
    • FCS_COP.1: 22
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 9
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 37
    • FDP_ACC.1.1: 2
    • FDP_ACF.1: 34
    • FDP_ACF.1.1: 2
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 2
    • FDP_ACF.1.4: 2
    • FDP_FLS.1: 1
    • FDP_IFC.1: 10
    • FDP_ITC.1: 5
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDI.1: 1
    • FDP_SDI.2: 8
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 5
    • FMT_MSA.1: 27
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 22
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 20
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 8
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 5
    • FAU_SAS.1: 10
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 11
    • FCS_CKM.1: 48
    • FCS_CKM.2: 3
    • FCS_CKM.4: 37
    • FCS_COP: 183
    • FCS_COP.1: 41
    • FCS_RNG: 29
    • FCS_RNG.1: 25
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 23
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 19
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 14
    • FDP_ITC.1: 33
    • FDP_ITC.2: 33
    • FDP_ITT.1: 11
    • FDP_PHP.3: 1
    • FDP_SDI.1: 17
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 14
    • FDP_SDI.2.1: 2
    • FDP_SDI.2.2: 2
  • FIA:
    • FIA_SOS.2: 3
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 2
  • FMT:
    • FMT_LIM: 3
    • FMT_LIM.1: 7
    • FMT_LIM.2: 8
    • FMT_MSA: 2
    • FMT_MSA.1: 16
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 18
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 14
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 18
    • FPT_ITT.1: 13
    • FPT_PHP.3: 14
    • FPT_TST: 5
    • FPT_TST.1: 12
    • FPT_TST.2: 34
    • FPT_TST.2.1: 2
  • FRU:
    • FRU_FLT.2: 8
pdf_data/st_keywords/cc_claims
  • O:
    • O.CUST_RECONFIG: 5
    • O.EEPROM_INTEGRITY: 5
    • O.FM_FW: 9
    • O.HW_AES: 7
    • O.MEM_ACCESS: 9
    • O.RND: 3
    • O.SFR_ACCESS: 9
  • T:
    • T.RND: 2
  • O:
    • O.RND: 1
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 141
    • NXP Semiconductors: 53
  • Infineon:
    • Infineon: 10
    • Infineon Technologies: 13
    • Infineon Technologies AG: 17
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 32
  • DES:
    • 3DES:
      • TDEA: 4
      • TDES: 1
      • Triple-DEA: 1
      • Triple-DES: 11
    • DES:
      • DEA: 1
      • DES: 16
  • AES_competition:
    • AES:
      • AES: 47
  • DES:
    • 3DES:
      • 3DES: 32
      • TDEA: 1
      • Triple-DES: 3
    • DES:
      • DES: 9
  • constructions:
    • MAC:
      • CMAC: 6
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
  • ECC:
    • ECC:
      • ECC: 48
    • ECDH:
      • ECDH: 6
    • ECDSA:
      • ECDSA: 14
  • FF:
    • DH:
      • Diffie-Hellman: 7
    • DSA:
      • DSA: 2
  • RSA:
    • RSA-2048: 1
    • RSA2048: 3
    • RSA4096: 1
pdf_data/st_keywords/hash_function
  • MD:
    • MD5:
      • MD5: 28
  • SHA:
    • SHA1:
      • SHA-1: 8
      • SHA1: 28
    • SHA2:
      • SHA-2: 4
      • SHA-224: 2
      • SHA-256: 2
      • SHA-384: 2
      • SHA-512: 1
      • SHA256: 28
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 3
  • MAC:
    • MAC: 20
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 14
  • TRNG:
    • TRNG: 1
  • RNG:
    • RND: 2
    • RNG: 16
  • TRNG:
    • TRNG: 14
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 17
  • CFB:
    • CFB: 6
  • CTR:
    • CTR: 8
  • ECB:
    • ECB: 12
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX: 1
    • SmartMX2: 24
pdf_data/st_keywords/crypto_library
  • Generic:
    • Crypto Library 2.02.010: 1
    • Crypto Library 2.04.003: 1
    • Crypto Library 39: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 10
    • fault injection: 3
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 13
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • timing attacks: 2
  • FI:
    • DFA: 7
    • Malfunction: 12
    • malfunction: 1
  • SCA:
    • DPA: 7
    • Leak-Inherent: 10
    • Physical Probing: 2
    • SPA: 8
    • Side-channel: 1
    • Timing Attack: 1
    • physical probing: 1
    • side channel: 6
    • template attacks: 3
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/tee_name
  • IBM:
    • SSC: 4
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS PUB 197: 3
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 14443: 16
    • ISO/IEC 18092: 2
    • ISO/IEC 7816: 22
  • BSI:
    • AIS31: 5
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 1
    • FIPS 32: 1
    • FIPS PUB 197: 1
  • ISO:
    • ISO/IEC 7816-3: 1
    • ISO/IEC14443-3: 1
  • RFC:
    • RFC 5639: 1
  • SCP:
    • SCP 16: 1
    • SCP 28: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • FTL) libraries are additionally supported software which 4 is out of scope of this certification: 1
    • Toolbox and Flash Translation Layer (FTL) libraries are additionally supported software which 4 is out of scope of this certification. 5 The Toolbox library does not provide cryptographic support or additional: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: NXP Semiconductors
  • /CreationDate: D:20190506143238+01'00'
  • /Creator: Microsoft® Word 2016
  • /Keywords: CC Security Evaluation, Security Target, Functional Requirements, Security Functionality, Assurance Level EAL6+, P60D144yVA, P60D080yVA, P60D144yVE, P60D080yVE
  • /ModDate: D:20190506143238+01'00'
  • /Producer: Microsoft® Word 2016
  • /Subject: P60x144/080yVA/yVA(Y/B/X)/yVE
  • /Title: Security Target Lite
  • pdf_file_size_bytes: 1288691
  • pdf_hyperlinks: http://www.nxp.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 89
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