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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		P73N2M0B0.2C2/2C6 (B0.2C2 / B0.2C6) (ANSSI-CC-2019/62-R01)
ANSSI-CC-2019/62-R01
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC P73N2M0B0.2C2/2C6 (B0.2C2 / B0.2C6) (ANSSI-CC-2019/62-R01)
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
status archived active
not_valid_after 07.05.2024 14.06.2029
not_valid_before 08.05.2019 14.06.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certificat-CC-2019_62-R01.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2019_62-R01%20P73N2M0B0.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-CC-2019_62-R01%20IC.pdf
manufacturer Qualcomm Technologies Inc. NXP Semiconductors
manufacturer_web https://www.qualcomm.com https://www.nxp.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ADV_IMP.2, ALC_FLR.1, ALC_CMC.5, EAL5+, AVA_VAN.5, ATE_COV.3, ASE_TSS.2, ALC_TAT.3, ADV_TDS.5, ATE_FUN.2, ADV_INT.3, ALC_DVS.2
dgst 2e8cbf6ce18d4c6f faf124871d38f383
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2019/62-R01
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ATE_FUN.2, ALC_TAT.3, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ALC_CMC.5, ADV_CMC.5, ADV_IMP.2, ASE_OBJ.2, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ALC_COV.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3
heuristics/extracted_versions - 0.2
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
pdf_data/cert_filename 1045c_pdf.pdf Certificat-CC-2019_62-R01.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • FR:
    • ANSSI-CC-2019/62-R01: 2
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL2: 1
    • EAL5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_TDS.5: 1
  • ALC:
    • ALC_CMC.5: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 2
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV.3: 1
    • ATE_FUN.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • NXP:
    • NXP: 2
pdf_data/cert_keywords/eval_facility
  • Serma:
    • SERMA: 2
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /CreationDate: D:20240704092041+02'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords:
  • /ModDate: D:20240704092612+02'00'
  • /Producer: Adobe PDF Library 23.1.175
  • pdf_file_size_bytes: 170217
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2019_62-R01 P73N2M0B0.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2019/62-R01: 2
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL2: 2
    • EAL5: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_IMP.2: 1
    • ADV_INT.3: 1
    • ADV_TDS.5: 1
  • ALC:
    • ALC_CMC.5: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 1
    • ALC_FLR.1: 2
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 1
  • ATE:
    • ATE_COV.3: 1
    • ATE_FUN.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • NXP:
    • NXP: 3
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • CESTI:
    • CESTI: 1
  • Serma:
    • SERMA: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • TDES: 1
    • DES:
      • DES: 1
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA3:
      • SHA-3: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf ANSSI-cible-CC-2019_62-R01 IC.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL4: 4
    • EAL4 augmented: 2
    • EAL5: 5
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 2
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 3
    • ADV_IMP.2: 5
    • ADV_INT.3: 2
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 4
    • ALC_CMC.5: 4
    • ALC_CMS: 1
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_COV.2: 2
    • ALC_COV.3: 2
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 4
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT.3: 1
    • ATE_FUN.2: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 13
    • FCS_CKM.1: 13
    • FCS_CKM.4: 14
    • FCS_COP: 31
    • FCS_COP.1: 8
    • FCS_RNG: 5
    • FCS_RNG.1: 5
    • FCS_SDI.2: 1
  • FDP:
    • FDP_ACC: 12
    • FDP_ACC.1: 14
    • FDP_ACF: 12
    • FDP_ACF.1: 10
    • FDP_IFC.1: 13
    • FDP_ITC.1: 13
    • FDP_ITC.2: 13
    • FDP_ITT.1: 8
    • FDP_MSA: 8
    • FDP_SDC: 1
    • FDP_SDC.1: 7
    • FDP_SDI: 13
    • FDP_SDI.1: 2
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 6
    • FDP_SMF.1: 4
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 5
    • FMT_LIM.2: 4
    • FMT_MAS.1: 1
    • FMT_MSA: 20
    • FMT_MSA.1: 9
    • FMT_MSA.3: 12
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 9
  • FPT:
    • FPT_FLS.1: 10
    • FPT_ITT.1: 8
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 10
  • FTP:
    • FTP_FLS.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 7
    • O.C: 1
    • O.CRC: 8
    • O.FLASH-: 1
    • O.FLASH-INTEGRITY: 6
    • O.GCM-SUPPORT: 8
    • O.MEM-ACCESS: 8
    • O.RND: 3
    • O.SFR-ACCESS: 8
    • O.TDES: 7
  • R:
    • R.O: 1
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • NXP:
    • NXP: 56
    • NXP Semiconductors: 36
    • NXP Semiconductors N.V: 59
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 37
  • DES:
    • 3DES:
      • TDEA: 2
      • TDES: 17
      • Triple-DES: 9
    • DES:
      • DES: 9
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 5
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 6
  • CFB:
    • CFB: 5
  • CTR:
    • CTR: 5
  • ECB:
    • ECB: 2
  • GCM:
    • GCM: 21
  • OFB:
    • OFB: 5
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 6
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS 140-2: 1
  • ISO:
    • ISO/IEC 7816: 8
  • NIST:
    • NIST SP 800-38A: 4
    • NIST SP 800-38D: 2
    • NIST SP 800-67: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • allows NXP to develop sales products composed of P73N2M0B0.202 and Services Software, which are out of scope of this Security Target. NXP Semiconductors P73N2M0B0.202 Security Target Lite P73N2M0B0.202 All: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /CreationDate: D:20181104204050+01'00'
  • /Creator: DITA Open Toolkit
  • /Keywords: NXP, P73N2M0B0.202, Secure Microcontroller, Secure Processor, Common Criteria, Security Target Lite
  • /ModDate: D:20231205212054+01'00'
  • /PDFVersion: 1.4
  • /Producer: Apache FOP Version 1.1
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 972361
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 60
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different