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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Microcontrôleurs sécurisés SC23Z018, SC23ZD12, SC23ZD08, SC23ZD04, SB23ZD18, SB23ZD12, SB23ZD08 et SB23ZD04 incluant optionnellement la librairie cryptographique NesLib révision 3.1
ANSSI-CC-2014/60
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Microcontrôleurs sécurisés SC23Z018, SC23ZD12, SC23ZD08, SC23ZD04, SB23ZD18, SB23ZD12, SB23ZD08 et SB23ZD04 incluant optionnellement la librairie cryptographique NesLib révision 3.1
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
not_valid_after 07.05.2024 21.10.2019
not_valid_before 08.05.2019 21.10.2014
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2014_60en.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI_cible2014_27_LITE.pdf
manufacturer Qualcomm Technologies Inc. STMicroelectronics
manufacturer_web https://www.qualcomm.com https://www.st.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f f89ed74b6c577fe6
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2014/60
heuristics/cert_lab BSI SERMA
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AGD_PRE.1, ATE_COV.2, ALC_TAT.2, ALC_CMS.5, ATE_FUN.1, AVA_VAN.5, ALC_DEL.1, ATE_DPT.3, ATE_IND.2, ADV_TDS.4, ALC_LCD.1, ALC_DVS.2, ADV_ARC.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, ALC_CMC.4, ADV_IMP.1
heuristics/extracted_versions - 3.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} ANSSI-CC-2013/61
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} ANSSI-CC-2013/61
heuristics/protection_profiles cf0f01bcd7be3e9c f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2014_60en.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL5 Augmented ALC_DVS.2, AVA_VAN.5
    • cc_version: Common criteria version 3.1 revision 4
    • cert_id: ANSSI-CC-2014/60
    • cert_item: SC23Z018, SC23ZD12, SC23ZD08, SC23ZD04, SB23ZD18, SB23ZD12, SB23ZD08 and SB23ZD04 Secure microcontrollers with optional cryptographic library NesLib revision 3.1
    • cert_item_version: /version Maskset reference K390A, internal revision H
    • cert_lab: Serma Technologies 14 rue Galilée, CS 10055, 33615 Pessac Cedex, France
    • developer: STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, 13106 Rousset, France Sponsor STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, 13106 Rousset, France
    • match_rules: ['Certification report reference(.+)Product name(.+)Product reference(.+)Protection profile conformity(.+)Evaluation criteria and version(.+)Evaluation level(.+)Developer (.+)Evaluation facility(.+)Mutual Recognition Agreements']
    • ref_protection_profiles: BSI_PP_0035-2007], version v1.0 Security IC Platform Protection Profile
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2013/61: 2
    • ANSSI-CC-2014/60: 20
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035-2007: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
    • EAL 7: 1
    • EAL4: 2
    • EAL5: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevated: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • STMicroelectronics:
    • STMicroelectronics: 22
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • Serma:
    • SERMA: 2
    • Serma Technologies: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 1
pdf_data/report_keywords/crypto_library
  • Neslib:
    • NESLIB 3.1: 1
    • NesLib 3.1: 2
    • NesLib v3.1: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • Physical tampering: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 31: 2
    • AIS31: 3
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: Duquesnoy
  • /CreationDate: D:20150209153210+01'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ANSSI-CC-CER-F-07.014
  • /ModDate: D:20150209153210+01'00'
  • /Producer: Microsoft® Word 2010
  • /Subject: SC23Z018, SC23ZD12, SC23ZD08, SC23ZD04, SB23ZD18, SB23ZD12, SB23ZD08 and SB23ZD04 Secure microcontrollers with optional cryptographic library NesLib revision 3.1
  • /Title: ANSSI-CC-2014/60
  • pdf_file_size_bytes: 563511
  • pdf_hyperlinks: http://www.ssi.gouv.fr/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 19
pdf_data/st_filename 1045b_pdf.pdf ANSSI_cible2014_27_LITE.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035: 55
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL4: 1
    • EAL5: 17
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADO:
    • ADO_DEL: 1
  • ADV:
    • ADV_ARC: 2
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ATE:
    • ATE_COV: 3
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 3
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
  • FCS:
    • FCS_CKM.1: 24
    • FCS_CKM.4: 5
    • FCS_COP.1: 26
    • FCS_RNG: 1
    • FCS_RNG.1: 6
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACC.2: 12
    • FDP_ACF.1: 11
    • FDP_CKM.2: 1
    • FDP_IFC.1: 9
    • FDP_ITC.1: 2
    • FDP_ITC.2: 2
    • FDP_ITT.1: 7
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 8
    • FMT_LIM.2: 9
    • FMT_MSA.1: 6
    • FMT_MSA.2: 1
    • FMT_MSA.3: 10
    • FMT_SMF.1: 10
    • FMT_SMR.1: 2
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 8
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 3
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
  • STMicroelectronics:
    • STMicroelectronics: 9
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 11
  • DES:
    • 3DES:
      • 3DES: 5
    • DES:
      • DES: 18
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 5
    • SHA2:
      • SHA-2: 1
      • SHA-224: 4
      • SHA-256: 3
      • SHA-384: 4
      • SHA-512: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 6
  • TRNG:
    • TRNG: 2
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 2
pdf_data/st_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 7
    • Nescrypt: 2
pdf_data/st_keywords/crypto_library
  • Neslib:
    • NESLIB 3.1: 2
    • NesLib 3.1: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 9
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 5
    • Leak-Inherent: 8
    • Physical Probing: 4
    • SPA: 1
    • physical probing: 3
    • side channel: 5
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 3
    • BSI-AIS31: 3
  • CC:
    • CCMB-2012-09-001: 3
    • CCMB-2012-09-002: 11
    • CCMB-2012-09-003: 2
  • FIPS:
    • FIPS PUB 140-2: 9
    • FIPS PUB 180-1: 3
    • FIPS PUB 180-2: 2
    • FIPS PUB 186: 3
    • FIPS PUB 197: 3
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 10116: 5
    • ISO/IEC 10118-: 2
    • ISO/IEC 14888: 2
    • ISO/IEC 9796: 1
    • ISO/IEC 9796-2: 5
    • ISO/IEC 9797: 1
    • ISO/IEC 9797-1: 2
  • PKCS:
    • PKCS #1: 9
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • 33 The Security IC Embedded Software (ES) is in User ROM. The ES is not part of the TOE and is out of scope of the evaluation, except Neslib when it is embedded. 34 The SC23Zxxx optionally comprises a: 1
    • ES) is in User ROM. The ES is not part of the TOE and is out of scope of the evaluation, except Neslib when it is embedded: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: Christiane DROULERS
  • /CreationDate: D:20140828154417Z
  • /Creator: FrameMaker 7.2
  • /ModDate: D:20140828154624Z
  • /Producer: Acrobat Distiller 9.0.0 (Windows)
  • /Title: SMD_SC23Z018_V1_7.book
  • pdf_file_size_bytes: 348939
  • pdf_hyperlinks: http://www.st.com
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 55
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state/cert/extract_ok True False
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