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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Kinibi v311A on Exynos 7870 Référence t-base-EXYNOS64-Android-311A-V004-20160527_225213_11082_38854
ANSSI-CC-2017/03
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Kinibi v311A on Exynos 7870 Référence t-base-EXYNOS64-Android-311A-V004-20160527_225213_11082_38854
category Other Devices and Systems Trusted Computing
scheme DE FR
not_valid_after 07.05.2024 17.02.2022
not_valid_before 08.05.2019 17.02.2017
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2017-03.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI_CC-2017_03%20Cible%20publique.pdf
manufacturer Qualcomm Technologies Inc. TRUSTONIC
manufacturer_web https://www.qualcomm.com https://www.trustonic.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL2+
dgst 2e8cbf6ce18d4c6f f7b39b6793294fa8
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2017/03
heuristics/cert_lab BSI THALES
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, AVA_VAN.2, AVA_TEE.2, ADV_FSP.2, ASE_ECD.1, ASE_TSS.1, ASE_SPD.1, ALC_DEL.1, AGD_OPE.1, AGD_PRE.1, ALC_CMS.2, ADV_TDS.1, ATE_FUN.1, ATE_COV.1, ADV_ARC.1, ASE_OBJ.2, ASE_REQ.2, ALC_CMC.2, ASE_CCL.1
heuristics/extracted_versions - 7870
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2017-03.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL 2 augmenté AVA_TEE.2
    • cc_version: Critères Communs version 3.1 révision 4
    • cert_id: ANSSI-CC-2017/03
    • cert_item: Kinibi v311A on Exynos 7870
    • cert_item_version: Référence t-base-EXYNOS64-Android-311A-V004- 20160527_225213_11082_38854, Version 311A
    • cert_lab: THALES (TCS – CNES) 18 avenue Edouard Belin, BPI1414, 31401 Toulouse Cedex 9 France
    • developer: Trustonic 20 Station Road Cambridge BD1 2ID United Kingdom Commanditaire Trustonic 20 Station Road Cambridge BD1 2ID United Kingdom
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur\\(s\\)(.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Néant
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2017/03: 19
    • ANSSI-CC-PP-2014/01: 1
    • ANSSI-CC-PP-2014/01-M01: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • ANSSI:
    • ANSSI-CC-PP-2014/01: 1
    • ANSSI-CC-PP-2014/01-M01: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 3: 1
    • EAL 5: 1
    • EAL 7: 1
    • EAL2: 3
    • EAL4: 1
  • ITSEC:
    • ITSEC E3 Elémentaire: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 2
    • AGD_PRE: 2
  • ALC:
    • ALC_CMC: 2
    • ALC_CMC_CMS: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_TEE: 2
    • AVA_TEE.2: 5
    • AVA_VAN: 1
    • AVA_VAN.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
  • OE:
    • OE.CONFIGURATION: 1
    • OE.INITIALIZATION: 1
    • OE.INTEGRATION_CONFIGURATION: 1
    • OE.PROTECTION_AFTER_DELIVERY: 1
    • OE.RNG: 1
    • OE.ROLLBACK: 1
    • OE.SECRETS: 1
    • OE.TA_DEVELOPMENT: 1
    • OE.TA_MANAGEMENT: 1
    • OE.TRUSTED_FIRMWARE: 1
    • OE.TRUSTED_HARDWARE: 1
    • OE.UNIQUE_TEE_ID: 1
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
  • FF:
    • DSA:
      • DSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/tee_name
  • other:
    • Kinibi: 31
    • TEE: 33
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • NIST:
    • NIST SP 800-90A: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author:
  • /CreationDate:
  • /Creator: PDFCreator Version 1.2.1
  • /Keywords:
  • /ModDate:
  • /Producer: GPL Ghostscript 9.02
  • /Subject:
  • /Title: ANSSI-CC-2017-03
  • pdf_file_size_bytes: 589101
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 18
pdf_data/st_filename 1045b_pdf.pdf ANSSI_CC-2017_03 Cible publique.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 2: 4
    • EAL2: 3
    • EAL2 augmented: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 14
    • ADV_TDS.1: 9
  • AGD:
    • AGD_OPE: 2
    • AGD_OPE.1: 8
    • AGD_PRE: 1
    • AGD_PRE.1: 8
  • ALC:
    • ALC_CMC.2: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_DEL.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 4
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 5
    • ATE_FUN.1: 4
  • AVA:
    • AVA_TEE: 5
    • AVA_TEE.2: 22
    • AVA_VAN: 2
    • AVA_VAN.2: 8
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_ARP.1: 13
    • FAU_ARP.1.1: 1
    • FAU_GEN.1: 4
    • FAU_SAA.1: 2
    • FAU_SAR.1: 11
    • FAU_SAR.1.1: 1
    • FAU_SAR.1.2: 1
    • FAU_STG.1: 10
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
  • FCS:
    • FCS_CKM.1: 12
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 10
    • FCS_CKM.4.1: 1
    • FCS_COP.1: 20
    • FCS_COP.1.1: 1
    • FCS_RNG: 4
    • FCS_RNG.1: 15
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 18
    • FDP_ACC.1: 6
    • FDP_ACF: 16
    • FDP_ACF.1: 6
    • FDP_IFC: 21
    • FDP_IFC.1: 4
    • FDP_IFC.2: 3
    • FDP_IFF: 19
    • FDP_IFF.1: 8
    • FDP_ITC.1: 2
    • FDP_ITC.2: 2
    • FDP_ITT: 3
    • FDP_RIP: 9
    • FDP_RIP.1: 2
    • FDP_ROL: 10
    • FDP_ROL.1: 3
    • FDP_SDI.2: 17
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FIA:
    • FIA_ATD.1: 13
    • FIA_ATD.1.1: 1
    • FIA_UID.1: 1
    • FIA_UID.2: 13
    • FIA_UID.2.1: 1
    • FIA_USB.1: 8
    • FIA_USB.1.1: 1
    • FIA_USB.1.2: 1
    • FIA_USB.1.3: 1
  • FMT:
    • FMT_MSA: 68
    • FMT_MSA.1: 5
    • FMT_MSA.3: 9
    • FMT_MTD.1: 1
    • FMT_SMF.1: 17
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 17
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS.1: 17
    • FPT_FLS.1.1: 1
    • FPT_INI: 3
    • FPT_INI.1: 15
    • FPT_INI.1.1: 2
    • FPT_INI.1.2: 2
    • FPT_INI.1.3: 2
    • FPT_ITT: 14
    • FPT_ITT.1: 2
    • FPT_STM: 6
    • FPT_STM.1: 2
    • FPT_TEE.1: 8
    • FPT_TEE.1.1: 1
    • FPT_TEE.1.2: 1
  • FTP:
    • FTP_TEE.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.CONNECT: 5
    • A.PEER: 12
    • A.PROTECTION_AFTER_D: 1
    • A.PROTECTION_AFTER_DELIVERY: 4
    • A.RNG: 6
    • A.ROLLBACK: 5
    • A.TA_DEVELOPMENT: 5
  • O:
    • O.CA_TA_IDENTIFICATIO: 1
    • O.CA_TA_IDENTIFICATION: 10
    • O.INITIALIZATION: 3
    • O.INSTANCE_TIME: 9
    • O.KEYS_USAGE: 1
    • O.OPERATION: 25
    • O.RNG: 11
    • O.RUNTIME_CONFIDENTI: 1
    • O.RUNTIME_CONFIDENTIALITY: 25
    • O.RUNTIME_INTEGRITY: 24
    • O.TA_AUTHENTICITY: 14
    • O.TA_ISOLATION: 21
    • O.TEE_DATA_PROTECTIO: 1
    • O.TEE_DATA_PROTECTION: 17
    • O.TEE_FIRMWARE_UPGRA: 1
    • O.TEE_ID: 12
    • O.TEE_ISOLATION: 18
    • O.TRUSTED_STORAGE: 24
  • OE:
    • OE.CRYPTOGRAPHY: 1
    • OE.DEBUG: 1
    • OE.INITIALIZATION: 17
    • OE.INTEGRATION_CONFI: 1
    • OE.INTEGRATION_CONFIGURATION: 8
    • OE.PROTECTION_AFTER_: 1
    • OE.PROTECTION_AFTER_DELIVERY: 7
    • OE.RNG: 6
    • OE.ROLLBACK: 8
    • OE.SECRETS: 7
    • OE.TA_DEVELOPMENT: 7
    • OE.TA_MANAGEMENT: 9
    • OE.TEE_FIRMWARE_UPGR: 1
    • OE.TEE_FIRMWARE_UPGRADE: 1
    • OE.TRUSTED_FIRMWARE: 5
    • OE.TRUSTED_HARDWARE: 11
    • OE.UNIQUE_TEE_ID: 8
  • OP:
    • OP.LOAD: 4
    • OP.STORE: 5
  • OSP:
    • OSP.INTEGRATION_CONFI: 1
    • OSP.INTEGRATION_CONFIGURATION: 4
    • OSP.SECRETS: 5
    • OSP.TA_MANAGEMENT: 4
    • OSP.TEE_FIRMWARE_UPG: 1
    • OSP.TEE_ID: 7
  • T:
    • T.ABUSE_FUNCT: 11
    • T.CLONE: 11
    • T.FLASH_DUMP: 5
    • T.IMPERSONATION: 7
    • T.PERTURBATION: 13
    • T.RAM: 9
    • T.RNG: 8
    • T.ROGUE_CODE_EXECUTI: 1
    • T.ROGUE_CODE_EXECUTION: 11
    • T.SPY: 8
    • T.STORAGE_CORRUPTION: 8
    • T.TEE_FIRMWARE_ROLLB: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Samsung:
    • Samsung: 3
  • Thales:
    • Thales: 3
pdf_data/st_keywords/eval_facility
  • TrustedLabs:
    • Trusted Labs: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 7
  • DES:
    • 3DES:
      • Triple-DES: 1
    • DES:
      • DES: 5
  • constructions:
    • MAC:
      • HMAC: 1
pdf_data/st_keywords/asymmetric_crypto
  • FF:
    • DSA:
      • DSA: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 3
pdf_data/st_keywords/crypto_protocol
  • IPsec:
    • IPsec: 2
  • TLS:
    • SSL:
      • SSL: 1
    • TLS:
      • TLS: 1
  • VPN:
    • VPN: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • PRNG: 1
  • RNG:
    • RNG: 48
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • SCA:
    • side-channels: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • ARM:
    • ARM TrustZone: 3
    • TrustZone: 1
  • other:
    • Kinibi: 110
    • TEE: 341
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS PUB 180-4: 1
    • FIPS PUB 197: 1
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 15408:2005: 2
  • NIST:
    • NIST SP 800-90A: 6
  • PKCS:
    • PKCS5: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • 1.4 2016-06-01 Updated to PP 1.2; aligned most SFR to the PP 1.5 2016-06-07 Mention TA management (out of scope); reference crypto algorithms document 1.6 2016-08-29 Added the file name of the ATE cover sheet: 1
    • Informative — out of scope for ALC: 1
    • Service Provider TAs and Installed TAs). Such components are out of scope of the TOE: 1
    • Storage Upgrade Service, to convert secure storage from previous versions of Kinibi. Upgrade is out of scope of the present Security Target. SPT2 ‹ Secure Storage Proxy, a communication relay between the: 1
    • System TAs) provided by the integrator (SiP or OEM). Such components are out of scope of the TOE: 1
    • The silicon vendor designs the ROM code and the secure portion of the TEE chipset. This phase is out of scope for this security target since it only concerns the preparation of the hardware which not part of: 1
    • Version of Chipset EVT0_REV0.0 Note that the TOE consists of software only. The chipset is out of scope of the evaluation. Kinibi Security Target ST PUBLIC 10 1.3 Diffusion List Trustonic employees : 1
    • and Installed TAs). Such components are out of scope of the TOE. The TOE components are as follows (Table 4): Kinibi Component Descriptions MTK: 1
    • and Trusted Applications (System TAs) provided by the integrator (SiP or OEM). Such components are out of scope of the TOE. Additional trusted applications installed via Content Management (Service Provider: 1
    • out of scope: 10
    • proxy, a communication relay between STH2 and a rollb ack-protected storage driver (which is out of scope of the present Security Target). Table 4 TOE Architecture 4.3 TOE Environment: Required: 1
    • space of its callers. Additional Trusted Applications provided by Trustonic. Such components are out of scope of the TOE. o Content Management Trusted Application (version 3.6) (System TA responsible for: 1
    • the exact version string to the TOE description. 1.7 2016-11-22 Lifecycle: note that phase 0 is out of scope. TOE overview: mention all embedded TAs, and TAs outside the TOE. List all known TAs/drivers and: 1
    • to other entities provided the overall security level is met. Phases Actors (Informative — out of scope for ALC) Phase 0: Firmware/Hardware design, REE development The TEE hardware designer is in charge: 1
    • which is out of scope of the present Security Target: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: [email protected]
  • /CreationDate: D:20170110164007+01'00'
  • /Creator: Microsoft® Word 2010 Subscription
  • /ModDate: D:20170110164007+01'00'
  • /Producer: Microsoft® Word 2010 Subscription
  • /Title: Kinibi v311A Security Target
  • pdf_file_size_bytes: 1581958
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 93
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