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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Microcontrôleur sécurisé ST33G1M2 révision F, Firmware révision 9, incluant optionnellement la bibliothèque cryptographique Neslib 4.1 et la bibliothèque MIFARE® DESFire® EV1 révision 3.7 ou 3.8
ANSSI-CC-2014/46
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Microcontrôleur sécurisé ST33G1M2 révision F, Firmware révision 9, incluant optionnellement la bibliothèque cryptographique Neslib 4.1 et la bibliothèque MIFARE® DESFire® EV1 révision 3.7 ou 3.8
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
not_valid_after 07.05.2024 18.10.2024
not_valid_before 08.05.2019 21.07.2014
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/certificat%20ANSSI-CC-2014_46-S05.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2014-46.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ST33G1M2_SECURITY_TARGET_PUBLIC_SMD_ST33G_ST_13_002_v2_3.pdf
manufacturer Qualcomm Technologies Inc. STMicroelectronics S.A.
manufacturer_web https://www.qualcomm.com https://www.st.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f f2a284d2553d3565
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2014/46
heuristics/cert_lab BSI THALES
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AGD_PRE.1, ATE_COV.2, ALC_TAT.2, ALC_CMS.5, ATE_FUN.1, AVA_VAN.5, ALC_DEL.1, ATE_DPT.3, ATE_IND.2, ADV_TDS.4, ALC_LCD.1, ALC_DVS.2, ADV_ARC.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, ALC_CMC.4, ADV_IMP.1
heuristics/extracted_versions - 4.1, 3.8, 3.7
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/protection_profiles cf0f01bcd7be3e9c f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 1045c_pdf.pdf certificat ANSSI-CC-2014_46-S05.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • FR:
    • ANSSI-CC-2014/46-S05: 2
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP-0035-2007: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • STMicroelectronics:
    • STMicroelectronics: 2
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: jchuzel
  • /CreationDate: D:20210318180237+01'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20210318180237+01'00'
  • /Producer: GPL Ghostscript 9.50
  • /Title: Microsoft Word - certificat ANSSI-CC-2014_46-S05.docx
  • pdf_file_size_bytes: 1913229
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2014-46.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL5 Augmenté ALC_DVS.2 et AVA_VAN.5
    • cc_version: CC version 3.1 révision 4
    • cert_id: ANSSI-CC-2014/46
    • cert_item: Microcontrôleur sécurisé ST33G1M2 révision F, Firmware révision 9, incluant optionnellement la bibliothèque cryptographique Neslib 4.1 et la bibliothèque MIFARE® DESFire® EV1 révision 3.7 ou 3.8
    • cert_item_version: Référence maskset K8H0A, révision interne F, firmware révision 9
    • cert_lab: THALES (TCS – CNES) 18 avenue Edouard Belin, BPI1414, 31401 Toulouse Cedex 9, France
    • developer: STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, B.P. 2, 13106 Rousset, France Commanditaire STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, B.P. 2, 13106 Rousset, France
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur\\(s\\)(.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: BSI_PP_0035-2007], version v1.0 Security IC Platform Protection Profile
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2014/46: 21
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 1
    • EAL 7: 1
    • EAL4: 2
    • EAL5: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 3
    • AVA_VAN.5: 2
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • STMicroelectronics:
    • STMicroelectronics: 16
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 1
pdf_data/report_keywords/crypto_library
  • Neslib:
    • NesLib 4.1: 3
    • NesLib v4.1: 3
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 31: 2
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: Duquesnoy
  • /CreationDate: D:20140721174339+02'00'
  • /Creator: Microsoft® Word 2010
  • /Keywords: ANSSI-CC-CER-F-07.010
  • /ModDate: D:20140721174339+02'00'
  • /Producer: Microsoft® Word 2010
  • /Subject: Microcontrôleur sécurisé ST33G1M2 révision F, Firmware révision 9, incluant optionnellement la bibliothèque cryptographique Neslib 4.1 et la bibliothèque MIFARE® DESFire® EV1 révision 3.7 ou 3.8
  • /Title: ANSSI-CC-2014/46
  • pdf_file_size_bytes: 783296
  • pdf_hyperlinks: http://www.ssi.gouv.fr/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
pdf_data/st_filename 1045b_pdf.pdf ST33G1M2_SECURITY_TARGET_PUBLIC_SMD_ST33G_ST_13_002_v2_3.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035: 74
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL4: 1
    • EAL5: 17
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADO:
    • ADO_DEL: 1
  • ADV:
    • ADV_ARC: 2
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ATE:
    • ATE_COV: 3
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
  • FCS:
    • FCS_CKM.1: 21
    • FCS_CKM.4: 13
    • FCS_COP.1: 34
    • FCS_RNG: 1
    • FCS_RNG.1: 7
  • FDP:
    • FDP_ACC.1: 42
    • FDP_ACC.2: 12
    • FDP_ACF.1: 47
    • FDP_CKM.2: 1
    • FDP_IFC.1: 15
    • FDP_ITC.1: 14
    • FDP_ITC.2: 13
    • FDP_ITT.1: 7
    • FDP_RIP.1: 9
    • FDP_ROL.1: 9
    • FDP_SMF.1: 2
    • FDP_SMR.1: 1
  • FIA:
    • FIA_UAU.2: 9
    • FIA_UAU.5: 10
    • FIA_UID.1: 2
    • FIA_UID.2: 11
  • FMT:
    • FMT_ITC.1: 1
    • FMT_LIM: 1
    • FMT_LIM.1: 18
    • FMT_LIM.2: 17
    • FMT_MSA.1: 36
    • FMT_MSA.2: 1
    • FMT_MSA.3: 46
    • FMT_MTD.1: 9
    • FMT_SMF.1: 27
    • FMT_SMR.1: 22
  • FPR:
    • FPR_UNL.1: 9
  • FPT:
    • FPT_FLS.1: 10
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
    • FPT_RPL.1: 10
    • FPT_TDC.1: 10
    • FPT_TRP.1: 6
  • FRU:
    • FRU_FLT.2: 9
    • FRU_RSA.2: 9
  • FTP:
    • FTP_ITC.1: 1
    • FTP_TRP.1: 6
    • FTP_TRP.1.3: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 3
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
  • STMicroelectronics:
    • STMicroelectronics: 9
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 26
      • AES-128: 1
      • AES-192: 1
      • AES-256: 1
  • DES:
    • 3DES:
      • 3DES: 5
      • Triple-DES: 1
    • DES:
      • DES: 26
  • constructions:
    • MAC:
      • CBC-MAC: 3
      • CMAC: 2
      • HMAC: 3
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 8
    • SHA2:
      • SHA-224: 6
      • SHA-256: 9
      • SHA-384: 6
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 3
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • DRBG: 7
  • RNG:
    • RND: 6
    • RNG: 6
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 6
  • ECB:
    • ECB: 4
pdf_data/st_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 3
    • Nescrypt: 3
pdf_data/st_keywords/crypto_library
  • Neslib:
    • NESLIB 4.1: 1
    • NesLib 4.1: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 9
    • malfunction: 4
    • physical tampering: 1
  • SCA:
    • Leak-Inherent: 8
    • Physical Probing: 4
    • physical probing: 3
    • side channel: 6
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 3
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 40
    • CCMB-2012-09-003: 2
  • FIPS:
    • FIPS 186-3: 2
    • FIPS PUB 140-2: 5
    • FIPS PUB 180-4: 5
    • FIPS PUB 197: 4
    • FIPS PUB 198-1: 2
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 10116: 7
    • ISO/IEC 14888: 2
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9797: 1
    • ISO/IEC 9797-1: 3
  • NIST:
    • NIST SP 800-38B: 2
    • NIST SP 800-90A: 5
  • PKCS:
    • PKCS #1: 5
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • 31 The Security IC Embedded Software (ES) is in User NVM. The ES is not part of the TOE and is out of scope of the evaluation, except Neslib and DESFire, when they are embedded. 32 The TOE optionally: 1
    • ES) is in User NVM. The ES is not part of the TOE and is out of scope of the evaluation, except Neslib and DESFire, when they are embedded: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: Christiane DROULERS
  • /CreationDate: D:20140630112314Z
  • /Creator: FrameMaker 7.2
  • /ModDate: D:20140707154401+02'00'
  • /Producer: Acrobat Distiller 9.0.0 (Windows)
  • /Title: SMD_ST33G_V2_3.book
  • pdf_file_size_bytes: 636249
  • pdf_hyperlinks: http://www.st.com
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 89
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