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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional) and UMSLC v01.00.0234, with specific IC-dedicated firmware (BOS and FlashLoader)
BSI-DSZ-CC-1102-V2-2025
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional) and UMSLC v01.00.0234, with specific IC-dedicated firmware (BOS and FlashLoader)
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
status archived active
not_valid_after 07.05.2024 20.02.2030
not_valid_before 08.05.2019 20.02.2025
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1102V2b_pdf.pdf
manufacturer Qualcomm Technologies Inc. Infineon Technologies AG
manufacturer_web https://www.qualcomm.com https://www.infineon.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, AVA_VAN.5, EAL5+
dgst 2e8cbf6ce18d4c6f e08641b048343159
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-1102-V2-2025
heuristics/extracted_sars ALC_CMC.4, AVA_VAN.5, ALC_LCD.1, ALC_DVS.2, ALC_TAT.1, ALC_CMS.4, ALC_DEL.1 ALC_CMC.4, ASE_CCL.1, ATE_IND.2, AGD_OPE.1, ADV_COMP.1, ASE_REQ.2, ALC_DEL.1, ASE_SPD.1, ASE_INT.1, ALC_DVS.2, AGD_PRE.1, ADV_INT.2, ADV_ARC.1, ADV_IMP.1, AVA_VAN.5, ALC_TAT.2, ADV_TDS.4, ALC_LCD.1, ASE_OBJ.2, ATE_COV.2, ATE_DPT.3, ASE_ECD.1, ASE_TSS.1, ATE_FUN.1, ALC_CMS.5, ADV_FSP.5
heuristics/extracted_versions - 01.00.0234, 2.62.7626
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1102-2019
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-1102-2019
heuristics/scheme_data
  • category: Smart Cards and similar devices
  • cert_id: BSI-DSZ-CC-1102-V2-2025
  • certification_date: 20.02.2025
  • enhanced:
    • applicant: Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg
    • assurance_level: EAL 5+,ALC_DVS.2,AVA_VAN.5
    • cert_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1100/1102V2c_pdf.pdf?__blob=publicationFile&v=2
    • certification_date: 20.02.2025
    • description: The Target of Evaluation (TOE) is the Infineon Smart Card IC (Security Controller) IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional), SCL v2.04.003 (optional) and UMSLC v01.00.0234, with specific IC-dedicated firmware (BOS and Flash Loader) as well as User Guidance. The TOE provides a real 32-bit CPU-architecture and is compatible to the ARMv7-M instruction set. The major components of the core system are the 32-bit CPU (Central Processing Unit) based on the ARM SecurCore SC300TM, the NVIC (Nested Vectored Interrupt Controller), and the MPU (Memory Protection Unit). The TOE consists of the hardware and firmware (BOS and Flash Loader) parts as well as three software parts (HSL, SCL and UMSLC libraries).
    • entries: [frozendict({'id': 'BSI', 'description': 'In comparison to the TOE forerunner, the scope of software libraries has been changed and changes on the TOE documentation were conducted.'}), frozendict({'id': 'BSI', 'description': 'The changes are related to an update of life cycle security aspects.'}), frozendict({'id': 'BSI', 'description': 'Certificate'})]
    • evaluation_facility: TÜV Informationstechnik GmbH
    • expiration_date: 19.02.2030
    • product: Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional) and UMSLC v01.00.0234, with specific IC-dedicated firmware (BOS and FlashLoader)
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
    • report_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1100/1102V2a_pdf.pdf?__blob=publicationFile&v=3
    • target_link: https://www.bsi.bund.de/SharedDocs/Downloads/DE/BSI/Zertifizierung/Reporte/Reporte1100/1102V2b_pdf.pdf?__blob=publicationFile&v=2
  • product: Infineon Technologies Security Controller IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, …
  • subcategory: ICs, Cryptolib
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/SmartCards_IC_Cryptolib/1102.html
  • vendor: Infineon Technologies AG
pdf_data/cert_filename 1045c_pdf.pdf 1102V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-1102-V2-2025: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Infineon:
    • Infineon Technologies AG: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Federal Office for Information Security
  • /Subject: IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional) and UMSLC v01.00.0234, with specific IC-dedicated firmware (BOS and Flash Loader) from Infineon Technologies AG
  • /Title: Certification Report
  • pdf_file_size_bytes: 233579
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 1102V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 5 augmented by ALC_DVS.2 and AVA_VAN.5 valid until: 19 February 2030
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1102-V2-2025
    • cert_item: IFX_CCI_001Fh, IFX_CCI_002Fh, IFX_CCI_0030h, IFX_CCI_0033h, IFX_CCI_0035h, IFX_CCI_0036h, IFX_CCI_0038h in the design steps S11 and M11 with software libraries: HSL v2.62.7626 (optional) and UMSLC v01.00.0234, with specific IC- dedicated firmware (BOS and Flash Loader
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-1102-2019: 3
    • BSI-DSZ-CC-1102-V2-2025: 18
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 1
    • EAL 5: 8
    • EAL 5 augmented: 3
    • EAL5+: 1
    • EAL6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon: 5
    • Infineon Technologies: 1
    • Infineon Technologies AG: 16
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/asymmetric_crypto
  • FF:
    • DSA:
      • DSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_scheme
  • KEX:
    • Key Exchange: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 2
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • SCA:
    • physical probing: 1
    • side-channel: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 3
    • AIS 23: 3
    • AIS 25: 1
    • AIS 26: 1
    • AIS 27: 1
    • AIS 31: 1
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 40: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS 48: 2
    • AIS31: 1
    • AIS47: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • EVALUATION TECHNICAL REPORT FOR COMPOSITE EVALUATION (ETR_COMP), TÜV Informationstechnik GmbH (confidential document) [11] Configuration list for the TOE, Version 1.2, 2024-11-11, Configuration Management Scope: 1
    • IFX_CCI_0035h, IFX_CCI_0036h,IFX_CCI_0038h S11 and M11 Security Target, Infineon Technologies AG e (confidential document) [7] Evaluation Technical Report, Version 1, Date 2025-01-14, Document Title, Lab- Name: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 1102V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 3
    • EAL 5 augmented: 3
    • EAL5: 5
    • EAL5+: 2
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 2
    • ADV_COMP.1: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 4
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.3: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL: 5
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 12
    • ASE_INT.1: 1
    • ASE_OBJ: 4
    • ASE_OBJ.2: 1
    • ASE_REQ: 16
    • ASE_REQ.2: 1
    • ASE_SPD: 4
    • ASE_SPD.1: 1
    • ASE_TSS: 4
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 10
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 4
    • FAU_SAS.1: 5
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_RNG: 3
    • FCS_RNG.1: 7
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC.1: 15
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 12
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 5
    • FDP_ITT.1: 3
    • FDP_SDC: 1
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 5
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FIA:
    • FIA_API: 1
    • FIA_API.1: 5
    • FIA_API.1.1: 1
  • FMT:
    • FMT_LIM: 13
    • FMT_LIM.1: 13
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 9
    • FMT_LIM.2.1: 1
    • FMT_MSA.1: 11
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 12
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 8
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 5
    • FPT_ITT.1: 3
    • FPT_PHP.3: 3
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 28
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 4
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 1
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 3
    • Infineon Technologies: 7
    • Infineon Technologies AG: 10
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • TDES: 1
    • DES:
      • DES: 2
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • MD:
    • MD5:
      • MD5: 2
  • SHA:
    • SHA1:
      • SHA-1: 2
    • SHA2:
      • SHA-256: 2
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • PRNG: 1
  • RNG:
    • RND: 2
    • RNG: 9
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 1
    • Malfunction: 5
  • SCA:
    • DPA: 1
    • Leak-Inherent: 4
    • Physical Probing: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 3
  • ISO:
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9798-2: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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