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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		HED Secure Smart Card Chip CIU9872B_01 C11 with IC Dedicated Software
None
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC HED Secure Smart Card Chip CIU9872B_01 C11 with IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE NO
not_valid_after 07.05.2024 25.11.2021
not_valid_before 08.05.2019 25.11.2016
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/files/epfiles/20161125%20S-090%20CR%20%20v1.0%20Huada.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/files/epfiles/Security%20Target-lite%20of%20CIU9872B_01%20C11%20Secure%20Smart%20Card%20Chip%20V1.1.pdf
manufacturer Qualcomm Technologies Inc. CEC Huada Electronic Design Co., Ltd.
manufacturer_web https://www.qualcomm.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f d48cc6c1c371a5a4
heuristics/cert_id BSI-DSZ-CC-1045-2019
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.4, ALC_TAT.2, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 25.11.2016
  • developer: CEC Huada Electronic Design Co., Ltd.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-090
    • certification_date: 25.11.2016
    • description: The TOE is a high-end secure smart card integrated circuit with dedicated software mainly for financial applications. The scope of the TOE includes the IC hardware and IC dedicated software which is constitutive of Chip Management System (CMS) and cryptographic library. CMS supports two functionalities, which are booting process controlling and chip module function testing. The cryptographic library implements the arithmetic function like RSA, DES, and TDES with cooperating of hardware. The whole IC dedicated software is programed with C language.
    • developer: CEC Huada Electronic Design Co., Ltd.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135106-1607952924/SERTIT/Sertifikater/2016/90/20161125%20SERTIT-090%20C.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135112-1607952929/SERTIT/Sertifikater/2016/90/Security%20Target-lite%20of%20CIU9872B_01%20C11%20Secure%20Smart%20Card%20Chip%20V1.1.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135109-1607952926/SERTIT/Sertifikater/2016/90/20161125%20S-090%20CR%20%20v1.0%20Huada.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • level: EAL 5, ALC_DVS.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: C11
    • protection_profile: BSI-CC-PP-0084-2014 v1.0
    • sponsor: CEC Huada Electronic Design Co., Ltd.
  • product: HED Secure Smart Card Chip CIU9872B_01
  • url: https://sertit.no/certified-products/product-archive/hed-secure-smart-card-chip-ciu9872b-01
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/asymmetric_crypto
pdf_data/report_keywords/pq_crypto
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_scheme
pdf_data/report_keywords/crypto_protocol
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/cipher_mode
pdf_data/report_keywords/ecc_curve
pdf_data/report_keywords/crypto_engine
pdf_data/report_keywords/tls_cipher_suite
pdf_data/report_keywords/crypto_library
pdf_data/report_keywords/vulnerability
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/device_model
pdf_data/report_keywords/tee_name
pdf_data/report_keywords/os_name
pdf_data/report_keywords/cplc_data
pdf_data/report_keywords/ic_data_group
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/javacard_version
pdf_data/report_keywords/javacard_api_const
pdf_data/report_keywords/javacard_packages
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf Security Target-lite of CIU9872B_01 C11 Secure Smart Card Chip V1.1.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084: 24
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
    • EAL5: 9
    • EAL5 augmented: 3
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 2
    • ADV_FSP.5: 2
    • ADV_IMP.1: 2
    • ADV_INT.2: 1
    • ADV_TDS.4: 2
  • AGD:
    • AGD_OPE: 2
    • AGD_OPE.1: 2
    • AGD_PRE: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 10
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 5
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 13
    • FCS_CKM.4: 10
    • FCS_COP: 1
    • FCS_COP.1: 21
    • FCS_COP.1.1: 2
    • FCS_RNG: 3
    • FCS_RNG.1: 11
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 12
    • FDP_ACC.1.1: 1
    • FDP_ACF: 1
    • FDP_ACF.1: 12
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 4
    • FDP_ITC.1: 9
    • FDP_ITC.2: 9
    • FDP_ITT.1: 4
    • FDP_SDC: 3
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI: 1
    • FDP_SDI.1: 3
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 5
    • FMT_LIM.2: 5
    • FMT_MSA.3: 4
  • FPT:
    • FPT_FLS: 1
    • FPT_FLS.1: 6
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 4
    • FPT_PHP: 1
    • FPT_PHP.3: 5
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.2: 6
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.MEM-ACCESS: 1
    • O.RND: 2
    • O.RSA: 4
    • O.TDES: 5
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 28
    • DES:
      • DES: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • PKE:
    • PKE: 3
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 4
    • RNG: 11
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 2
    • Malfunction: 6
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 3
    • Leak-Inherent: 5
    • Physical Probing: 2
    • SPA: 3
    • physical probing: 3
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS20: 5
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS PUB 46-3: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 7816: 2
    • ISO/IEC14443: 2
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: 刘剑峰
  • /CreationDate: D:20161125102430+00'00'
  • /Creator: Microsoft Word
  • /ModDate: D:20161125102430+00'00'
  • pdf_file_size_bytes: 1079746
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 40
state/cert/convert_ok True False
state/cert/download_ok True False
state/cert/extract_ok True False
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/convert_ok True False
state/report/download_ok True False
state/report/extract_ok True False
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different