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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		MAWIS-Security Rev. 4.0
BSI-DSZ-CC-0496-V2-2025
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC MAWIS-Security Rev. 4.0
status archived active
not_valid_after 07.05.2024 23.01.2030
not_valid_before 08.05.2019 24.01.2025
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0496V2c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0496V2a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0496V2b_pdf.pdf
manufacturer Qualcomm Technologies Inc. MOBA Mobile Automation AG
manufacturer_web https://www.qualcomm.com https://www.moba.de/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ASE_SPD.1, ASE_OBJ.2, ASE_REQ.2, EAL1+
dgst 2e8cbf6ce18d4c6f c8c9125bad005bbe
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-0496-V2-2025
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_TSS.1, ADV_FSP.1, ALC_CMC.1, ASE_INT.1, ASE_SPD.1, AVA_VAN.1, ATE_IND.1, ASE_OBJ.2, AGD_OPE.1, ASE_ECD.1, ASE_REQ.2
heuristics/extracted_versions - 4.0
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/scheme_data
  • category: Other products
  • cert_id: BSI-DSZ-CC-0496-V2-2025
  • certification_date: 24.01.2025
  • enhanced:
    • applicant: MOBA Mobile Automation AG Kapellenstraße 15 65555 Limburg
    • assurance_level: EAL1,ASE_SPD.1,ASE_REQ.2,ASE_OBJ.2
    • certification_date: 24.01.2025
    • description: The TOE is the Waste Bin Identification Systems (WBIS) MAWIS-Security Rev 4.0. The TOE is evaluated and certified conform to the „Protection Profile Waste Bin Identification System (WBIS-PP), Version 1.04“. Waste Bin Identification Systems (WBIS) in the sense of this document are systems, which allow to identify waste bins by an ID-tag (e.g. an electronic chip, which is referred to as transponder) in order to determine how often a specific waste bin has been cleared. Note that this type of system does not identify the waste directly but the waste bin, which contains the waste for disposal. The TOE with its security functionality ensures validity, integrity and completeness of the protected data during storage in the vehicle and Transmission between physically separated parts of the TOE.
    • entries: [frozendict({'id': 'BSI-DSZ-CC-0496-V2-2025', 'description': 'The TOE is evaluated and certified conform to the „Protection Profile Waste Bin Identification System (WBIS-PP), Version 1.04“. Waste Bin Identification Systems (WBIS) in the sense of this document are systems, which allow to identify waste bins by an ID-tag (e.g. an electronic chip, which is referred to as transponder) in order to determine how often a specific waste bin has been cleared. Note that this type of system does not identify the waste directly but the waste bin, which contains the waste for disposal. The TOE with its security functionality ensures validity, integrity and completeness of the protected data during storage in the vehicle and Transmission between physically separated parts of the TOE.'}), frozendict({'id': 'BSI-DSZ-CC-0496-2017'})]
    • evaluation_facility: Deutsches Forschungszentrum für Künstliche Intelligenz GmbH
    • expiration_date: 23.01.2030
    • product: MAWIS-Security Rev. 4.0
    • protection_profile: Protection Profile Waste Bin Identification Systems (WBIS-PP), Version 1.04, 27 May 2004, BSI-PP-0010-2004
  • product: MAWIS-Security Rev. 4.0
  • url: https://www.bsi.bund.de/SharedDocs/Zertifikate_CC/CC/Sonstiges/0496.html
  • vendor: MOBA Mobile Automation AG
heuristics/protection_profiles cf0f01bcd7be3e9c f1e8c937d15e713a
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/WBIS-PPv1-04.pdf
pdf_data/cert_filename 1045c_pdf.pdf 0496V2c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-0496-V2-2025: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP- 0010-2004: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 1: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ASE:
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /Keywords: "Common Criteria, Certification, Zertifizierung, WBIS, Waste Bin Identification System, Müllbehälter-Identifikationssystem, MAWIS-Security Rev. 4.0, BSI-DSZ-CC-0496-V2-2025"
  • /Subject: Common Criteria, Certification, Zertifizierung, WBIS, Waste Bin Identification System, Müllbehälter-Identifikationssystem, MAWIS-Security Rev. 4.0, BSI-DSZ-CC-0496-V2-2025
  • /Title: Zertifikat BSI-DSZ-CC-0496-V2-2025
  • pdf_file_size_bytes: 386689
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 0496V2a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cert_id: BSI-DSZ-CC-0496-V2-2025
    • cert_item: MAWIS-Security Rev. 4.0
    • cert_lab: BSI
    • developer: MOBA Mobile Automation AG
    • match_rules: ['(BSI-DSZ-CC-.+?) zu (.+?) der (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-0496-V2-2025: 10
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP- 0010-2004: 1
    • BSI-PP-0010-: 1
    • BSI-PP-0010-2004: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 5
    • EAL 2: 1
    • EAL 4: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ALC:
    • ALC_FLR: 1
  • ASE:
    • ASE_OBJ.2: 4
    • ASE_REQ.2: 4
    • ASE_SPD.1: 4
  • AVA:
    • AVA_VAN.1: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • DFKI:
    • DFKI: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 32: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 0496V2b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0010-2004: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 1+: 1
    • EAL1: 9
    • EAL1 augmented: 2
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_FSP.1: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.1: 1
  • ASE:
    • ASE_ECD.1: 2
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_OBJ.2: 5
    • ASE_REQ.1: 1
    • ASE_REQ.2: 5
    • ASE_SPD.1: 6
    • ASE_TSS.1: 1
  • ATE:
    • ATE_IND.1: 1
  • AVA:
    • AVA_VAN.1: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FDP:
    • FDP_DAU: 2
    • FDP_DAU.1: 8
    • FDP_DAU.1.1: 1
    • FDP_DAU.1.2: 1
    • FDP_ITT: 4
    • FDP_ITT.1: 1
    • FDP_ITT.5: 20
    • FDP_ITT.5.1: 2
    • FDP_SDI: 2
    • FDP_SDI.1: 9
    • FDP_SDI.1.1: 1
  • FPT:
    • FPT_FLS.1: 2
  • FRU:
    • FRU_FLT: 2
    • FRU_FLT.1: 8
    • FRU_FLT.1.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • NXP:
    • NXP: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • ISO:
    • ISO/IEC 18000-63: 2
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: Holz, Stephan
  • /Subject: Sicherheitsvorgaben nach WBIS-PP
  • /Title: MAWIS-Security, Rev. 4.0
  • pdf_file_size_bytes: 1129671
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 40
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