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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Infineon Security Controller IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 000022h in the design step H13 and including optional software libraries and dedicated firmware in several versions
BSI-DSZ-CC-1110-V3-2020
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Infineon Security Controller IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 000022h in the design step H13 and including optional software libraries and dedicated firmware in several versions
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
status archived active
not_valid_after 07.05.2024 13.05.2025
not_valid_before 08.05.2019 13.05.2020
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1110V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1110V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1110V3b_pdf.pdf
manufacturer Qualcomm Technologies Inc. Infineon Technologies AG
manufacturer_web https://www.qualcomm.com https://www.infineon.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL6+, ALC_FLR.1
dgst 2e8cbf6ce18d4c6f a4f085e9dca6909a
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-1110-V3-2020
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ADV_CMC.5, ALC_CMC.5, ASE_REQ.2, ADV_INT.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-1110-V4-2021, BSI-DSZ-CC-1098-2020, BSI-DSZ-CC-1077-2020, BSI-DSZ-CC-1076-2020, ANSSI-CC-2020/87, ANSSI-CC-2020/88, NSCIB-CC-0075541-CR2, BSI-DSZ-CC-0976-V4-2021, KECS-ISIS-1031-2020
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1110-V2-2019
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-1172-2022, BSI-DSZ-CC-1110-V5-2022, ANSSI-CC-2020/88-R01, ANSSI-CC-2019/56-R01, BSI-DSZ-CC-1162-V2-2023, BSI-DSZ-CC-1076-2020, ANSSI-CC-2022/68, ANSSI-CC-2022/07, BSI-DSZ-CC-1243-2024, BSI-DSZ-CC-0976-V4-2021, ANSSI-CC-2022/33, ANSSI-CC-2019/55-R01, NSCIB-CC-175887-CR3, ANSSI-CC-2019/58-R01, BSI-DSZ-CC-1110-V6-2023, ANSSI-CC-2022/08, BSI-DSZ-CC-1077-V2-2024, ANSSI-CC-2020/87-R01, ANSSI-CC-2022/20, BSI-DSZ-CC-1162-2021, ANSSI-CC-2019/57-R01, NSCIB-CC-0075541-CR2, KECS-ISIS-1031-2020, NSCIB-CC-0299277-CR, BSI-DSZ-CC-1098-2020, BSI-DSZ-CC-1162-V3-2024, BSI-DSZ-CC-1077-2020, BSI-DSZ-CC-1110-V4-2021, BSI-DSZ-CC-1176-2023, ANSSI-CC-2020/87, ANSSI-CC-2020/88, BSI-DSZ-CC-1110-V7-2024, NSCIB-CC-22-0286910-CR, ANSSI-CC-2022/19, ANSSI-CC-2022/67, ANSSI-CC-2022/64, NSCIB-CC-0299278-CR, ANSSI-CC-2022/65
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0891-2015, BSI-DSZ-CC-0782-2012, BSI-DSZ-CC-0945-V3-2018, BSI-DSZ-CC-1110-2019, BSI-DSZ-CC-0945-2017, BSI-DSZ-CC-1110-V2-2019, BSI-DSZ-CC-0945-V2-2018, BSI-DSZ-CC-0891-V2-2016
heuristics/st_references/directly_referenced_by {} BSI-DSZ-CC-1098-2020, BSI-DSZ-CC-1077-2020, BSI-DSZ-CC-1076-2020, NSCIB-CC-0286907-CR, ANSSI-CC-2020/87, ANSSI-CC-2020/88, NSCIB-CC-0075541-CR2, BSI-DSZ-CC-0976-V4-2021, KECS-ISIS-1031-2020
heuristics/st_references/indirectly_referenced_by {} BSI-DSZ-CC-1067-V4-2023, BSI-DSZ-CC-1068-V3-2022, BSI-DSZ-CC-1098-2020, BSI-DSZ-CC-1077-2020, BSI-DSZ-CC-1076-2020, BSI-DSZ-CC-1067-V3-2022, NSCIB-CC-0286907-CR, ANSSI-CC-2020/87, ANSSI-CC-2020/88, NSCIB-CC-0075541-CR2, BSI-DSZ-CC-1067-V5-2024, BSI-DSZ-CC-0976-V4-2021, KECS-ISIS-1031-2020, BSI-DSZ-CC-1068-V4-2023, BSI-DSZ-CC-1068-V5-2024
pdf_data/cert_filename 1045c_pdf.pdf 1110V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-1110-V3-2020: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Infineon:
    • Infineon: 1
    • Infineon Technologies AG: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200514115558+02'00'
  • /Creator: Writer
  • /ModDate: D:20200514115714+02'00'
  • /Producer: LibreOffice 6.2
  • /Title: Certification Report BSI-DSZ-CC-1110-V3-2019
  • pdf_file_size_bytes: 287059
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 1110V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1110-V3-2020
    • cert_item: Infineon Security Controller IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 000022h in the design step H13 and including optional software libraries and dedicated firmware in several versions
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-1110-V2-2019: 1
    • BSI-DSZ-CC-1110-V3-2020: 23
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL5+: 1
    • EAL6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 3
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • GD:
    • G&D: 1
    • Giesecke & Devrient: 1
  • Infineon:
    • Infineon: 25
    • Infineon Technologies AG: 23
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 5
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 17
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 2
      • Triple-DES: 3
    • DES:
      • DES: 4
  • constructions:
    • MAC:
      • CBC-MAC: 2
      • CMAC: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
    • ECDH:
      • ECDH: 1
    • ECDSA:
      • ECDSA: 2
  • FF:
    • DH:
      • Diffie-Hellman: 1
    • DSA:
      • DSA: 1
  • RSA:
    • RSA2048: 3
    • RSA4096: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA2:
      • SHA-256: 1
pdf_data/report_keywords/crypto_scheme
  • KA:
    • Key Agreement: 2
  • KEX:
    • Key Exchange: 1
  • MAC:
    • MAC: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • CFB:
    • CFB: 2
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 4
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • DFA: 2
  • SCA:
    • DPA: 2
    • SPA: 2
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 25: 1
    • AIS 26: 1
    • AIS 27: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 2
    • AIS 37: 1
    • AIS 38: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS31: 2
  • FIPS:
    • FIPS186-4: 2
    • FIPS197: 7
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • RFC:
    • RFC 5639: 1
    • RFC5639: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • IFX_CCI_00001Dh, IFX_CCI_000021h, IFX_CCI_000022h design step H13”, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report for the Product BSI-DSZ-CC-1110-V3-2020, Version 1, 2020-04-23: 1
    • Standards Compliance Verification”, Version 1, 2020-04-20, TÜV Informationstechnik GmbH (confidential document) 33 / 37 Certification Report BSI-DSZ-CC-1110-V3-2020 C. Excerpts from the Criteria For the: 1
    • Technical Report - Summary”, TÜV Informationstechnik GmbH, (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • Version 1, 2020-04-23, ETR for composite evaluation (EFC), TÜV Informationstechnik GmbH (confidential document) [11] 16-Bit Security Controller - V01, Security Guidelines, Rev. 1.01-2477, Infineon Technologies: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • OutOfScope:
    • 05-22 Table 2: Deliverables of the TOE Please note that NRG functionality, RFAPI and toolbox are out of scope of this evaluation, hence no evaluated TOE guidance documentation applies. However, respective: 1
    • 10), are solely relevant in the GBIC context and not in the CC context (hence for CC these are out of scope). As a result of the evaluation, the verdict PASS is confirmed for the following assurance: 1
    • and symmetric cryptography libraries and the supporting Toolbox libraries (note: Toolbox library is out of scope of the certification). The Flash Loader is a firmware located in the ROM and enables the download: 1
    • hence for CC these are out of scope: 1
    • note: Toolbox library is out of scope of the certification: 1
    • out of scope: 3
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 1110V3b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL6: 168
    • EAL6 augmented: 164
    • EAL6+: 165
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 1
    • ADV_SPM.1: 10
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 2
    • ALC_CMS.4: 3
    • ALC_CMS.5: 3
    • ALC_DEL: 2
    • ALC_DEL.1: 1
    • ALC_DVS: 3
    • ALC_DVS.2: 3
    • ALC_FLR.1: 10
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL: 6
    • ASE_CCL.1: 1
    • ASE_ECD: 3
    • ASE_ECD.1: 1
    • ASE_INT: 19
    • ASE_INT.1: 1
    • ASE_OBJ: 12
    • ASE_OBJ.2: 1
    • ASE_REQ: 64
    • ASE_REQ.2: 1
    • ASE_SPD: 7
    • ASE_SPD.1: 1
    • ASE_TSS: 23
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 3
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 3
    • FAU_SAS.1: 11
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 157
    • FCS_CKM.1: 42
    • FCS_CKM.2: 7
    • FCS_CKM.4: 43
    • FCS_COP: 191
    • FCS_COP.1: 39
    • FCS_RNG: 38
    • FCS_RNG.1: 15
  • FDP:
    • FDP_ACC: 15
    • FDP_ACC.1: 29
    • FDP_ACC.1.1: 1
    • FDP_ACF: 15
    • FDP_ACF.1: 26
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 19
    • FDP_ITC.1: 35
    • FDP_ITC.2: 35
    • FDP_ITT.1: 21
    • FDP_SDC: 1
    • FDP_SDC.1: 12
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 26
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 12
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 12
    • FDP_UIT.1.1: 1
  • FIA:
    • FIA_API: 4
    • FIA_API.1: 14
    • FIA_API.1.1: 1
  • FMT:
    • FMT_LIM: 35
    • FMT_LIM.1: 9
    • FMT_LIM.2: 8
    • FMT_MSA.1: 18
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 3
    • FMT_MSA.3: 22
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 16
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 31
    • FPT_ITT.1: 22
    • FPT_PHP.3: 34
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 30
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 8
  • FTP:
    • FTP_ACF: 1
    • FTP_ITC.1: 18
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 3
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 8
    • O.RND: 4
    • O.TDES: 7
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 20
    • Infineon Technologies: 26
    • Infineon Technologies AG: 18
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 88
      • AES-128: 4
  • DES:
    • 3DES:
      • 3DES: 4
      • TDEA: 3
      • TDES: 54
      • Triple-DES: 3
      • TripleDES: 2
    • DES:
      • DES: 33
  • constructions:
    • MAC:
      • CBC-MAC: 6
      • CMAC: 33
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 21
    • ECDH:
      • ECDH: 12
    • ECDSA:
      • ECDSA: 31
  • FF:
    • DH:
      • Diffie-Hellman: 14
    • DSA:
      • DSA: 2
  • RSA:
    • RSA2048: 1
    • RSA4096: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • MD:
    • MD5:
      • MD5: 29
  • SHA:
    • SHA1:
      • SHA-1: 29
    • SHA2:
      • SHA-256: 29
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 2
    • Key agreement: 3
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • PRNG: 1
  • RNG:
    • RND: 5
    • RNG: 25
  • TRNG:
    • DTRNG: 1
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 14
  • CFB:
    • CFB: 9
  • CTR:
    • CTR: 8
  • ECB:
    • ECB: 17
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 3
    • Malfunction: 13
    • fault induction: 1
    • fault injection: 5
    • malfunction: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 12
    • Physical Probing: 2
    • SPA: 1
    • physical probing: 1
    • side channel: 18
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI TR-02102: 1
    • BSI TR-03111: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS 31: 1
    • AIS31: 24
    • AIS32: 10
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
  • FIPS:
    • FIPS 140-2: 2
    • FIPS 197: 2
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 11770-3: 1
    • ISO/IEC 14443-4: 4
    • ISO/IEC 14888-3: 1
    • ISO/IEC 18033: 2
    • ISO/IEC 18033-3: 8
    • ISO/IEC 18092: 2
    • ISO/IEC 9797-1: 7
    • ISO/IEC 9798-2: 2
    • ISO/IEC14443-3: 1
  • NIST:
    • NIST SP 800-90A: 2
    • SP 800-22: 1
    • SP 800-38A: 16
    • SP 800-38B: 4
    • SP 800-67: 4
  • PKCS:
    • PKCS #1: 2
    • PKCS#1: 1
  • RFC:
    • RFC 5639: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • certification. The user operating system and further applications implemented on the TOE are also out of scope of this certification. To summarize, if used with the PCD software the certification view equals to: 1
    • is enabled to communicate via the selected interfaces. The surrounding environment is in both cases out of scope. The CIPURSE™ CL is delivered as object code and in this way integrated in the user software. The: 1
    • out of scope: 2
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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