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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019
Akis Gezgin_N BAC Configuration with Active Authentication v1.0.1.0
21.0.03/TSE-CCCS-71
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Akis Gezgin_N BAC Configuration with Active Authentication v1.0.1.0
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE TR
not_valid_after 07.05.2024 22.03.2024
not_valid_before 08.05.2019 22.03.2021
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/AKiS_GEZGiN_N_BAC&AA_cc.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/AKiS_GEZGiN_N_BAC&AA_CR.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/AKiS%20GEZGiN_N%20BAC%20&%20AA%20Security%20Target%20Lite.pdf
manufacturer Qualcomm Technologies Inc. TÜBİTAK BİLGEM UEKAE
manufacturer_web https://www.qualcomm.com https://www.uekae.tubitak.gov.tr
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL4+, ALC_DVS.2
dgst 2e8cbf6ce18d4c6f a018a1bc3ef6ac2b
heuristics/cert_id BSI-DSZ-CC-1045-2019 21.0.03/TSE-CCCS-71
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AVA_COMP.1, ASE_INT.1, ASE_COMP.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ALC_FLR.1, ALC_TAT.1, ASE_TSS.1, ASE_SPD.1, ALC_DEL.1, ADV_COMP.1, ALC_LCD.1, AGD_OPE.1, AVA_VAN.3, AGD_PRE.1, ALC_CMS.4, AGD_COMP.1, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.3, ATE_DPT.1, ASE_REQ.2, ATE_COMP.1, ALC_COMP.1, ADV_FSP.4, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions - 1.0.1.0
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/st_references/directly_referencing {} BSI-DSZ-CC-0977-V2-2019, BSI-DSZ-CC-1019-V2-2019
heuristics/st_references/indirectly_referencing {} BSI-DSZ-CC-0977-V2-2019, BSI-DSZ-CC-1019-V2-2019
heuristics/protection_profiles cf0f01bcd7be3e9c 60455fc9564e2545
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0055b.pdf
pdf_data/cert_filename 1045c_pdf.pdf AKiS_GEZGiN_N_BAC&AA_cc.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • TR:
    • 21.0.03/TSE-CCCS-71: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-CC-PP-0055: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 4+: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_DVS.2: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
  • TUBITAK-BILGEM:
    • TÜBİTAK BİLGEM: 2
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
  • ISO:
    • ISO/IEC 15408: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Cem ERDİVAN
  • /CreationDate: D:20210330120451+03'00'
  • /Creator: Microsoft® Word 2019
  • /ModDate: D:20210330120451+03'00'
  • /Producer: Microsoft® Word 2019
  • pdf_file_size_bytes: 150378
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf AKiS_GEZGiN_N_BAC&AA_CR.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • TR:
    • 21.0.03/TSE-CCCS-71: 2
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0055: 1
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0035: 1
    • BSI-PP-0055: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 4: 1
    • EAL 4+: 5
    • EAL2: 1
    • EAL4+: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC.1: 1
    • ADV_COMP.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_COMP.1: 1
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_COMP.1: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_COMP.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COMP.1: 1
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_COMP.1: 1
    • AVA_VAN.3: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • NXP:
    • NXP: 4
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUBITAK-BILGEM:
    • TÜBİTAK BİLGEM: 8
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA1:
      • SHA-1: 1
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX3: 3
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • malfunction: 1
  • SCA:
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/ic_data_group
  • EF:
    • EF.DG14: 1
    • EF.DG15: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • ICAO:
    • ICAO: 5
  • ISO:
    • ISO/IEC 17025: 2
pdf_data/report_keywords/javacard_packages
  • org:
    • org.tr: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: TSE KSDB
  • /CreationDate: D:20210330120333+03'00'
  • /Creator: Microsoft® Word 2019
  • /ModDate: D:20210330120333+03'00'
  • /Producer: Microsoft® Word 2019
  • pdf_file_size_bytes: 523883
  • pdf_hyperlinks: http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 22
pdf_data/st_filename 1045b_pdf.pdf AKiS GEZGiN_N BAC & AA Security Target Lite.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0977-V2-2019: 1
    • BSI-DSZ-CC-1019-V2-2019: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP- 0084-2014: 2
    • BSI-CC-PP-0055: 6
    • BSI-CC-PP-0068-V2-2011: 1
    • BSI-PP-0055: 1
    • BSI-PP-0056: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 4+: 1
    • EAL 6+: 2
    • EAL4: 7
    • EAL4 augmented: 2
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_DVS.2: 6
    • ALC_FLR.1: 1
  • APE:
    • APE_SRE: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 4
    • FAU_SAS.1: 13
    • FAU_SAS.1.1: 2
  • FCS:
    • FCS_CKM.1: 24
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 19
    • FCS_CKM.4.1: 1
    • FCS_COP: 54
    • FCS_COP.1: 6
    • FCS_RND: 5
    • FCS_RND.1: 16
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 15
    • FDP_ACC.1.1: 1
    • FDP_ACF: 1
    • FDP_ACF.1: 12
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 2
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 2
    • FDP_IFC.1: 2
    • FDP_ITC: 1
    • FDP_ITC.1: 6
    • FDP_ITC.2: 6
    • FDP_MSA.3: 1
    • FDP_UCT.1: 12
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 12
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_AFL.1: 8
    • FIA_AFL.1.1: 1
    • FIA_AFL.1.2: 1
    • FIA_API: 5
    • FIA_API.1: 13
    • FIA_API.1.1: 1
    • FIA_SOS.2: 1
    • FIA_UAU.1: 10
    • FIA_UAU.1.1: 1
    • FIA_UAU.1.2: 1
    • FIA_UAU.4: 13
    • FIA_UAU.4.1: 1
    • FIA_UAU.5: 11
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UAU.6: 10
    • FIA_UAU.6.1: 1
    • FIA_UID.1: 12
    • FIA_UID.1.1: 1
    • FIA_UID.1.2: 1
  • FMT:
    • FMT_LIM: 4
    • FMT_LIM.1: 19
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 18
    • FMT_LIM.2.1: 2
    • FMT_MSA.3: 1
    • FMT_MTD: 39
    • FMT_MTD.1: 4
    • FMT_SMF.1: 17
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 17
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS.1: 10
    • FPT_FLS.1.1: 1
    • FPT_PHP.3: 10
    • FPT_PHP.3.1: 1
    • FPT_TST: 1
    • FPT_TST.1: 8
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 2
  • FTP:
    • FTP_ITC.1: 3
    • FTP_TRP.1: 3
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • OE:
    • OE.BAC-: 2
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • NXP:
    • NXP: 10
    • NXP Semiconductors: 2
pdf_data/st_keywords/eval_facility
  • TUBITAK-BILGEM:
    • TÜBİTAK BİLGEM: 87
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • 3-DES: 2
      • 3DES: 1
      • TDEA: 1
      • TDES: 4
    • DES:
      • DES: 9
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 8
    • ECDSA:
      • ECDSA: 6
  • FF:
    • DH:
      • Diffie-Hellman: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 8
      • SHA1: 1
    • SHA2:
      • SHA-224: 4
      • SHA-256: 4
      • SHA-384: 3
      • SHA-512: 3
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 7
pdf_data/st_keywords/crypto_protocol
  • PACE:
    • PACE: 3
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RNG: 10
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 2
  • ECB:
    • ECB: 1
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX3: 6
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 1
    • Malfunction: 4
    • Physical Tampering: 5
    • Physical tampering: 1
    • fault injection: 1
    • malfunction: 5
    • physical tampering: 2
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 3
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/technical_report_id
  • BSI:
    • BSI 2006: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/ic_data_group
  • EF:
    • EF.COM: 13
    • EF.DG1: 23
    • EF.DG13: 2
    • EF.DG14: 2
    • EF.DG15: 4
    • EF.DG16: 23
    • EF.DG2: 4
    • EF.DG3: 3
    • EF.DG4: 2
    • EF.DG5: 3
    • EF.SOD: 12
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 3
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 1
  • FIPS:
    • FIPS 186-4: 4
    • FIPS 197: 2
    • FIPS 46-3: 2
    • FIPS PUB 180-4: 1
  • ICAO:
    • ICAO: 9
  • ISO:
    • ISO/IEC 15946-1: 3
    • ISO/IEC 15946-2: 3
    • ISO/IEC 15946-3: 1
    • ISO/IEC 9796-2: 1
  • NIST:
    • NIST SP 800-90: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC 3447: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • out of scope: 2
    • target does not distinguish between the BIS, GIS and EIS because the Extended Access Control is out of scope. UNCLASSIFIED TÜBİTAK BİLGEM UEKAE eID Applications AKIS GEZGIN_N BAC & AA Security Target Lite: 1
    • to the paper or the plastic card is achieved by physical and organizational security measures being out of scope of this ST. The physical scope of the TOE is composed of the IC dedicated software, the IC embedded: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /CreationDate: D:20210118143127+03'00'
  • /Creator: Microsoft® Word 2016
  • /ModDate: D:20210118143127+03'00'
  • /Producer: Microsoft® Word 2016
  • pdf_file_size_bytes: 1315293
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 87
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