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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Feitian FT-JCOS V5.0
SERTIT-116
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Feitian FT-JCOS V5.0
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE NO
not_valid_after 07.05.2024 17.09.2023
not_valid_before 08.05.2019 17.09.2018
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/20180917SERTIT-116%20C.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/20180917%20Sertit-116%20CR%20Feitian%20v10.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/[09895][SERTIT-116][ST][v1.0.8]%20FTJCOS%20v5.0%20Security%20Target.pdf
manufacturer Qualcomm Technologies Inc. Feitian Technologies Co., Ltd.
manufacturer_web https://www.qualcomm.com https://www.ftsafe.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f 8d5f8b6024447c59
heuristics/cert_id BSI-DSZ-CC-1045-2019 SERTIT-116
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AVA_COMP.1, ASE_INT.1, ASE_COMP.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ADV_COMP.1, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ATE_DPT.1, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_COMP.1, ALC_COMP.1, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions - 5.0
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 17.09.2018
  • developer: Feitian Technologies Co., Ltd.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-116
    • certification_date: 17.09.2018
    • description: The TOE is an open Java Card Platforms (JCP), that is, smart cards or similar devices enabled with JavaCard technology that support post-issuance downloading of applications.The purpose of the TOE is to provide a limited Java Card environment for a single applet, specifically for e-passport and similar applications such as eID and driving license.The TOE is composed of a Smart Card Platform (SCP) and an embedded software (JCS + non-TSF parts). The JCP is compliant with Java Card Specification v3.0.4 and GlobalPlatform Specification v.2.3. The TOE allows for the loading of the customer applets, but after loading the single applet the platform must be closed to prevent further loading of applets after issuance of the card to the end user. To support this functionality, the TOE provides a closing mechanism with specific guidance. The applet should have been previously verified by an off-card trusted IT component. The JCP is managed by Card Manager that is a part of the TOE. The Card Manager(ISD) is a pre-issuance applet. The JCP is fully compliant with the Java Card Specification v3.0.4 excluding the optional part JCRMI which is not implemented by the TOE. The SCP is a certified hardware platform – the SLE77CLFX2400PM with specific IC dedicated software (firmware). The hardware platform is certified by the BSI under the certification ID: BSI-DSZ-CC-0964-V3-2017 . Not all functionality of the hardware is used by the composite TOE. Therefore some parts of the IC platform are not part of the composite TOEto ensure that the developed applet has sufficient ability to counter attacks.
    • developer: Feitian Technologies Co., Ltd.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135382-1607954033/SERTIT/Sertifikater/2018/116/20180917SERTIT-116%20C.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135385-1607954035/SERTIT/Sertifikater/2018/116/%5B09895%5D%5BSERTIT-116%5D%5BST%5D%5Bv1.0.8%5D%20FTJCOS%20v5.0%20Security%20Target.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135379-1607954030/SERTIT/Sertifikater/2018/116/20180917%20Sertit-116%20CR%20Feitian%20v10.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • expiration_date: 17.09.2023
    • level: EAL 5, ALC_DVS.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: V5.0.9
    • sponsor: Feitian Technologies Co., Ltd.
  • product: FT-JCOS V5.0
  • url: https://sertit.no/certified-products/product-archive/ft-jcos-v5-0
heuristics/st_references/directly_referencing {} BSI-DSZ-CC-0964-V3-2017
heuristics/st_references/indirectly_referencing {} BSI-DSZ-CC-0964-V3-2017
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf 20180917SERTIT-116 C.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • NO:
    • SERTIT-116: 2
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Feitian:
    • Feitian Technologies: 1
pdf_data/cert_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
pdf_data/cert_keywords/crypto_library
  • NSS:
    • NSS: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • pdf_file_size_bytes: 744305
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 20180917 Sertit-116 CR Feitian v10.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • NO:
    • SERTIT-116: 20
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 5: 1
    • EAL1: 1
    • EAL5+: 22
    • EAL7: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC.1: 1
    • ADV_COMP.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_COMP.1: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_COMP.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COMP.1: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_COMP.1: 1
    • AVA_VAN.5: 4
pdf_data/report_keywords/cc_sfr
  • FCS:
    • FCS_RNG.1: 4
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Feitian:
    • Feitian: 1
    • Feitian Technologies: 2
    • Feitian Technologies Co: 1
  • Infineon:
    • Infineon: 1
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • BrightSight:
    • Brightsight: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • other:
    • JIL: 2
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15408: 8
    • ISO/IEC 7816: 2
  • SCP:
    • SCP02: 2
pdf_data/report_keywords/javacard_version
  • GlobalPlatform:
    • GlobalPlatform 3.0.4: 1
  • JavaCard:
    • Java Card 2.3: 1
    • Java Card 3.0.4: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /AAPL:Keywords: ['ugradert']
  • /Author: Arne-Hoye.Rage@nsm.no
  • /CreationDate: D:20180917114319Z00'00'
  • /Creator: Microsoft® Word 2013
  • /Keywords: ugradert
  • /ModDate: D:20180917114319Z00'00'
  • /Producer: Mac OS X 10.13.6 Quartz PDFContext
  • /Title: tittel
  • pdf_file_size_bytes: 1156984
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 21
pdf_data/st_filename 1045b_pdf.pdf [09895][SERTIT-116][ST][v1.0.8] FTJCOS v5.0 Security Target.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0964-: 1
    • BSI-DSZ-CC-0964-V3-2017: 3
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0084: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 1
    • EAL 5 augmented: 1
    • EAL5: 6
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 6
    • ADV_FSP.1: 4
    • ADV_FSP.2: 2
    • ADV_FSP.4: 2
    • ADV_FSP.5: 7
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.2: 1
    • ADV_TDS.3: 10
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 10
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 7
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
    • ALC_TAT.2: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 4
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 2
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 7
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_ARP.1: 21
    • FAU_ARP.1.1: 1
    • FAU_SAA.1: 3
  • FCO:
    • FCO_NRO: 6
    • FCO_NRO.2: 5
  • FCS:
    • FCS_CKM.1: 10
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 9
    • FCS_CKM.2.1: 1
    • FCS_CKM.3: 8
    • FCS_CKM.3.1: 1
    • FCS_CKM.4: 13
    • FCS_CKM.4.1: 1
    • FCS_COP: 7
    • FCS_COP.1: 21
    • FCS_RNG: 5
    • FCS_RNG.1: 13
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 21
    • FDP_ACC.1: 12
    • FDP_ACC.2: 2
    • FDP_ACF: 21
    • FDP_ACF.1: 13
    • FDP_IFC: 23
    • FDP_IFC.1: 13
    • FDP_IFC.2: 2
    • FDP_IFF: 18
    • FDP_IFF.1: 17
    • FDP_ITC: 12
    • FDP_ITC.1: 4
    • FDP_ITC.2: 10
    • FDP_ITT.1: 1
    • FDP_RIP: 75
    • FDP_RIP.1: 8
    • FDP_ROL: 12
    • FDP_ROL.1: 3
    • FDP_SDI.1: 1
    • FDP_SDI.2: 9
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UIT: 5
    • FDP_UIT.1: 2
  • FIA:
    • FIA_ATD: 8
    • FIA_ATD.1: 2
    • FIA_UID: 24
    • FIA_UID.1: 10
    • FIA_UID.2: 1
    • FIA_USB: 7
    • FIA_USB.1: 3
  • FMT:
    • FMT_MSA: 87
    • FMT_MSA.1: 10
    • FMT_MSA.2: 2
    • FMT_MSA.3: 16
    • FMT_MTD: 20
    • FMT_MTD.1: 2
    • FMT_MTD.3: 1
    • FMT_SMF: 18
    • FMT_SMF.1: 18
    • FMT_SMF.1.1: 1
    • FMT_SMR: 31
    • FMT_SMR.1: 30
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNO.1: 8
    • FPR_UNO.1.1: 1
  • FPT:
    • FPT_FLS: 13
    • FPT_FLS.1: 13
    • FPT_FLS.1.1: 2
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_RCV: 22
    • FPT_RCV.3: 13
    • FPT_RCV.4: 2
    • FPT_TDC.1: 8
    • FPT_TDC.1.1: 1
    • FPT_TDC.1.2: 1
    • FPT_TST.1: 1
  • FRU:
    • FRU_FLT.2: 1
  • FTP:
    • FTP_ITC: 6
    • FTP_ITC.1: 4
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.APPLET: 6
    • A.DELETION: 1
    • A.VERIFICATION: 6
  • D:
    • D.API_DATA: 3
    • D.APP_CODE: 6
    • D.APP_C_DATA: 2
    • D.APP_I_DATA: 4
    • D.CM_APDU: 1
    • D.CRYPTO: 7
    • D.JCS_CODE: 4
    • D.JCS_DATA: 5
    • D.JCS_KEYS: 4
    • D.SEC_ATTRIBUTES: 2
    • D.SEC_DATA: 8
  • O:
    • O.ALARM: 20
    • O.APPLET: 4
    • O.CARD-: 7
    • O.CARD-MANAGEMENT: 30
    • O.CIPHER: 14
    • O.CODE_PKG: 3
    • O.COMMUNICATION: 11
    • O.DELETION: 1
    • O.FIREWALL: 37
    • O.GLOBAL: 2
    • O.GLOBAL_ARRAYS_CONFID: 16
    • O.GLOBAL_ARRAYS_INTEG: 9
    • O.IC_SUPPORT: 17
    • O.INSTALL: 16
    • O.JAVAOBJECT: 22
    • O.KEY-: 1
    • O.KEY-MNGT: 20
    • O.LOAD: 18
    • O.NATIVE: 14
    • O.OPERATE: 33
    • O.OS: 1
    • O.OS_SUPPORT: 23
    • O.PACKAGE: 2
    • O.PIN-MNGT: 1
    • O.REALLOCATION: 15
    • O.RECOVERY: 23
    • O.REMOTE: 1
    • O.RESOURCES: 19
    • O.RND: 14
    • O.SID: 30
    • O.TRANSACTION: 14
  • OE:
    • OE.APPLET: 9
    • OE.CARD-MANAGEMENT: 2
    • OE.CODE-: 5
    • OE.CODE-EVIDENCE: 16
    • OE.SCP: 6
    • OE.VERIFICATION: 37
  • OP:
    • OP.ARRAY_ACCESS: 4
    • OP.CREATE: 7
    • OP.GP: 3
    • OP.INSTANCE_FIELD: 4
    • OP.INVK_INTERFACE: 7
    • OP.INVK_VIRTUAL: 6
    • OP.JAVA: 5
    • OP.LOAD_PCKG: 1
    • OP.PUT: 6
    • OP.THROW: 5
    • OP.TYPE_ACCESS: 5
  • OSP:
    • OSP.VERIFICATION: 6
  • R:
    • R.JAVA: 5
  • T:
    • T.COMMUNICATION: 5
    • T.CONFID-: 2
    • T.CONFID-APPLI-: 2
    • T.CONFID-APPLI-DATA: 16
    • T.CONFID-JCS-CODE: 7
    • T.CONFID-JCS-DATA: 9
    • T.DELETION: 1
    • T.EXE-: 1
    • T.EXE-CODE: 8
    • T.FAULT: 6
    • T.INSTALL: 6
    • T.INTEG-: 6
    • T.INTEG-APPLI-: 4
    • T.INTEG-APPLI-CODE: 12
    • T.INTEG-APPLI-DATA: 17
    • T.INTEG-JCS-: 1
    • T.INTEG-JCS-CODE: 7
    • T.INTEG-JCS-DATA: 12
    • T.LEAKAGE: 6
    • T.NATIVE: 6
    • T.PHYSICAL: 8
    • T.RESOURCES: 9
    • T.RND: 6
    • T.SID: 19
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Feitian:
    • Feitian Technologies: 1
    • Feitian Technologies Co: 92
  • Infineon:
    • Infineon: 10
    • Infineon Technologies AG: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 13
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 1
      • TDES: 7
      • Triple-DES: 1
    • DES:
      • DES: 3
  • constructions:
    • MAC:
      • CMAC: 2
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 3
    • SHA2:
      • SHA-256: 2
      • SHA256: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KEX:
    • Key exchange: 1
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 21
    • RNG: 10
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 1
  • CTR:
    • CTR: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 3
    • malfunction: 4
    • physical tampering: 1
  • SCA:
    • DPA: 3
    • Leak-Inherent: 2
    • SPA: 1
    • physical probing: 3
    • timing attacks: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS20: 2
    • AIS36: 2
  • FIPS:
    • FIPS PUB 140-2: 1
    • FIPS PUB 180-4: 1
    • FIPS PUB 197: 1
    • FIPS140: 2
    • FIPS180-4: 2
    • FIPS197: 3
  • ICAO:
    • ICAO: 3
  • ISO:
    • ISO/IEC 18013: 2
    • ISO/IEC 9796-2: 1
  • SCP:
    • SCP02: 6
pdf_data/st_keywords/javacard_version
  • JavaCard:
    • Java Card 3.0.4: 3
pdf_data/st_keywords/javacard_api_const
  • misc:
    • TYPE_ACCESS: 5
pdf_data/st_keywords/javacard_packages
  • javacard:
    • javacard.security: 2
  • javacardx:
    • javacardx.crypto: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • a timeout policy that prevent them from being blocked should a card fails to answer. That point is out of scope of this Protection Profile, though. Finally, the objectives O.RECOVERY and O.OS_SUPPORT are: 1
    • com 11 FT-JCOS V5.0 Security Target Phase 2 covers the Secure IC Development of Infineon and is out of scope of the TOE evaluation as that is part of the IC platform evaluation. In Phase 3, the Chip: 1
    • out of scope: 2
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /CreationDate: D:20180811160413+08'00'
  • /Creator: LaTeX with hyperref package
  • /Producer: MiKTeX-xdvipdfmx (0.7.8)
  • pdf_file_size_bytes: 1189588
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 89
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