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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		S3CC91A 16-bit RISC Microcontroller for Smart Card, Revision 3
BSI-DSZ-CC-0483-2008
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC S3CC91A 16-bit RISC Microcontroller for Smart Card, Revision 3
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
not_valid_after 07.05.2024 01.09.2019
not_valid_before 08.05.2019 01.07.2008
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0483a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0483b.pdf
manufacturer Qualcomm Technologies Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.qualcomm.com https://www.samsung.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ADV_IMP.2, AVA_VLA.4, AVA_MSU.3, EAL4+, ALC_DVS.2
dgst 2e8cbf6ce18d4c6f 7db14b2410ce0ed3
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-0483-2008
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ATE_COV.2, ADV_RCR.1, ALC_TAT.1, ADV_FSP.1, AVA_VLA.4, ADV_HLD.2, ATE_FUN.1, AGD_USR.1, ATE_IND.2, AGD_ADM.1, ADV_LLD.1, ALC_DVS.2, ALC_LCD.1, ADV_IMP.2, ATE_DPT.1, AVA_SOF.1, ADV_SPM.1, AVA_MSU.3
heuristics/extracted_versions - 16, 3
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-0581-2009, BSI-DSZ-CC-0548-2008
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0451-2007
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-0581-2009, BSI-DSZ-CC-0548-2008
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0438-2007, BSI-DSZ-CC-0400-2007, BSI-DSZ-CC-0451-2007
heuristics/protection_profiles cf0f01bcd7be3e9c {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 0483a.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cert_id: BSI-DSZ-CC-0483-2008
    • cert_item: S3CC91A 16-bit RISC Microcontroller for Smart Card, Revision 3
    • cert_lab: BSI
    • developer: Samsung Electronics Co., Ltd
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-0451-2007: 1
    • BSI-DSZ-CC-0483: 1
    • BSI-DSZ-CC-0483-2008: 19
  • NL:
    • CC-0451-2007: 1
    • CC-0483: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0002-2001: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 4: 9
    • EAL 4 augmented: 4
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 6
    • EAL5: 6
    • EAL5+: 1
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 1
    • ACM_CAP: 2
    • ACM_CAP.4: 1
    • ACM_SCP: 2
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 1
    • ADO_IGS: 2
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_HLD: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 5
    • ADV_INT: 2
    • ADV_LLD: 2
    • ADV_RCR: 2
    • ADV_SPM: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_USR: 2
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.2: 6
    • ALC_FLR: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 1
    • ALC_TAT: 2
    • ALC_TAT.1: 1
  • APE:
    • APE_DES: 1
    • APE_ENV: 1
    • APE_INT: 1
    • APE_OBJ: 1
    • APE_REQ: 1
    • APE_SRE: 1
  • ASE:
    • ASE_DES: 1
    • ASE_ENV: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_PPC: 1
    • ASE_REQ: 1
    • ASE_SRE: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 2
    • ATE_DPT: 2
    • ATE_FUN: 2
    • ATE_IND: 2
  • AVA:
    • AVA_CCA: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 3
    • AVA_VLA: 3
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon Technologies AG: 1
  • Philips:
    • Philips: 1
  • Samsung:
    • Samsung: 16
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 2
    • TÜViT: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 1
  • DES:
    • 3DES:
      • Triple-DES: 5
    • DES:
      • DES: 7
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECDSA:
      • ECDSA: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • Bellcore attack: 1
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/cplc_data
  • ICFab:
    • IC Fabricator: 1
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 25: 3
    • AIS 26: 2
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 3
    • AIS 35: 2
    • AIS 36: 1
    • AIS 38: 1
    • AIS20: 1
  • ISO:
    • ISO/IEC 15408:2005: 3
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • 1.1, 2008-04-10, Samsung Electronics (confidential document) [9] Security Target Lite of S3CC91A 16-bit RISC Microcontroller for Smart Cards, Version 1.0: 1
    • 2, 2008-06-03, TÜViT (confidential document) [8] Configuration Management Documentation (Class ACM_AUT/CAP/SCP) – Project Cheyenne (S3CC91A: 1
    • EVALUATION (ETR-COMP), 8103270436_40 / BSI-DSZ- CC-0483, S3CC91A, Version 2, 2008-06-03, TÜViT (confidential document) [12] Security Application Note, S3CC91A, Version 1.4, 2008-03-31, Samsung Electronics 8: 1
    • Microcontroller for Smart Cards – Project Cheyenne, Version 1.3, 2008-04-10, Samsung Electronics (confidential document) [7] EVALUATION TECHNICAL REPORT SUMMARY (ETR SUMMARY), 8103270436_40 / BSI-DSZ-CC-0483, S3CC91A: 1
pdf_data/report_metadata
  • /Author: Federal Office for Information Security
  • /CreationDate: D:20080717124808+02'00'
  • /Creator: Writer
  • /Keywords: "S3CC91A 16-bit RISC Microcontroller for Smart Card, Revision 3, BSI-DSZ-CC-0483-2008, Samsung Electronics Co., Ltd"
  • /ModDate: D:20080717151127+02'00'
  • /Producer: StarOffice 8
  • /Subject: Common Criteria Zertifizierung
  • /Title: Zertifizierungsreport BSI-DSZ-CC-0483-2008
  • pdf_file_size_bytes: 566022
  • pdf_hyperlinks: http://www.bsi.bund.de/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 36
pdf_data/st_filename 1045b_pdf.pdf 0483b.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0002: 8
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 4: 1
    • EAL4: 10
    • EAL4 augmented: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ACM:
    • ACM_AUT: 2
    • ACM_AUT.1: 1
    • ACM_CAP: 2
    • ACM_CAP.4: 2
    • ACM_SCP: 2
    • ACM_SCP.2: 1
  • ADO:
    • ADO_DEL: 2
    • ADO_DEL.2: 2
    • ADO_IGS: 2
    • ADO_IGS.1: 3
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.1: 3
    • ADV_HLD: 1
    • ADV_HLD.1: 1
    • ADV_HLD.2: 1
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 5
    • ADV_LLD: 1
    • ADV_LLD.1: 3
    • ADV_RCR: 1
    • ADV_RCR.1: 2
    • ADV_SPM: 1
    • ADV_SPM.1: 5
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 4
    • AGD_USR: 2
    • AGD_USR.1: 4
  • ALC:
    • ALC_DVS: 2
    • ALC_DVS.1: 1
    • ALC_DVS.2: 6
    • ALC_LCD: 2
    • ALC_LCD.1: 1
    • ALC_TAT: 2
    • ALC_TAT.1: 2
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 2
    • ATE_DPT: 1
    • ATE_DPT.1: 1
    • ATE_FUN: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_MSU: 1
    • AVA_MSU.2: 1
    • AVA_MSU.3: 6
    • AVA_SOF: 1
    • AVA_SOF.1: 1
    • AVA_VLA: 1
    • AVA_VLA.4: 7
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_GEN.1: 1
    • FAU_SAS: 3
    • FAU_SAS.1: 8
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 29
    • FCS_CKM.1.1: 3
    • FCS_CKM.2: 4
    • FCS_CKM.4: 19
    • FCS_CKM.4.1: 2
    • FCS_COP: 1
    • FCS_COP.1: 21
    • FCS_COP.1.1: 2
    • FCS_RND: 2
    • FCS_RND.1: 8
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC: 1
    • FDP_ACC.1: 21
    • FDP_ACC.1.1: 1
    • FDP_ACF: 1
    • FDP_ACF.1: 12
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_CKM.2: 1
    • FDP_IFC: 2
    • FDP_IFC.1: 22
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 3
    • FDP_ITC.1: 15
    • FDP_ITC.1.1: 2
    • FDP_ITC.1.2: 2
    • FDP_ITC.1.3: 2
    • FDP_ITC.2: 17
    • FDP_ITC.2.1: 2
    • FDP_ITC.2.2: 2
    • FDP_ITC.2.3: 2
    • FDP_ITC.2.4: 2
    • FDP_ITC.2.5: 2
    • FDP_ITT: 1
    • FDP_ITT.1: 17
    • FDP_ITT.1.1: 1
    • FDP_SDI.1: 2
  • FMT:
    • FMT_LIM: 4
    • FMT_LIM.1: 14
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 19
    • FMT_LIM.2.1: 1
    • FMT_MSA: 2
    • FMT_MSA.1: 12
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 21
    • FMT_MSA.2.1: 2
    • FMT_MSA.3: 13
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF: 1
    • FMT_SMF.1: 7
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 8
  • FPT:
    • FPT_AMT.1: 1
    • FPT_FLS: 1
    • FPT_FLS.1: 22
    • FPT_FLS.1.1: 1
    • FPT_ITT: 1
    • FPT_ITT.1: 15
    • FPT_ITT.1.1: 1
    • FPT_PHP: 2
    • FPT_PHP.3: 18
    • FPT_PHP.3.1: 1
    • FPT_SEP: 2
    • FPT_SEP.1: 10
    • FPT_SEP.1.1: 1
    • FPT_SEP.1.2: 1
    • FPT_TDC.1: 2
  • FRU:
    • FRU_FLT: 1
    • FRU_FLT.1: 1
    • FRU_FLT.2: 18
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 2
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 5
  • T:
    • T.RND: 4
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Samsung:
    • Samsung: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • DES:
    • 3DES:
      • 3DES: 13
      • T-DES: 1
      • Triple-DES: 1
    • DES:
      • DES: 12
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 10
    • RNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/crypto_engine
  • TORNADO:
    • TORNADO: 8
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 1
    • Malfunction: 24
    • malfunction: 12
    • physical tampering: 2
  • SCA:
    • DPA: 5
    • Leak-Inherent: 20
    • Physical Probing: 4
    • Physical probing: 2
    • SPA: 3
    • physical probing: 6
    • side-channel: 2
    • timing attacks: 1
  • other:
    • reverse engineering: 3
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS 20: 2
    • AIS20: 3
  • FIPS:
    • FIPS PUB 46-3: 2
  • ISO:
    • ISO/IEC 15408-2005: 1
    • ISO/IEC 7816: 4
    • ISO/IEC 9796-1: 3
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: Kyungsuk Yi (Bryant)
  • /CreationDate: D:20080604112544+09'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /Keywords: Smartcard, IC, S3CC91A, 16-bit RISC Microcontroller For Smart Cards, 16-bit CMOS Microcontroller For Smart Cards, Samsung Electronics
  • /ModDate: D:20080609165146+09'00'
  • /Producer: Acrobat Distiller 6.0.1 (Windows)
  • /Subject: Securiti Target Lite
  • /Title: Security Target Lite of S3CC91A 16-bit RISC Microcontroller For Smart Cards
  • pdf_file_size_bytes: 540341
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: True
  • pdf_number_of_pages: 61
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