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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		NXP Secure Smart Card Controller N7021 VA including IC Dedicated Software
BSI-DSZ-CC-0977-V3-2021
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC NXP Secure Smart Card Controller N7021 VA including IC Dedicated Software
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
status archived active
not_valid_after 07.05.2024 24.02.2026
not_valid_before 08.05.2019 24.02.2021
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0977V3c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0977V3a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0977V3b_pdf.pdf
manufacturer Qualcomm Technologies Inc. NXP Semiconductors Germany GmbH
manufacturer_web https://www.qualcomm.com https://www.nxp.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL6+, ASE_TSS.2, ALC_FLR.1
dgst 2e8cbf6ce18d4c6f 705f4b1941123308
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-0977-V3-2021
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ADV_CMS.5, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ATE_FUN.2, ALC_TAT.3, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_CMC.5, ASE_OBJ.2, ADV_IMP.2, ADV_ARC.1, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0977-V2-2019
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0977-2017, BSI-DSZ-CC-0977-V2-2019
pdf_data/cert_filename 1045c_pdf.pdf 0977V3c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-0977-V3-2021: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
  • ASE:
    • ASE_TSS.2: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • NXP:
    • NXP: 1
    • NXP Semiconductors: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20210303072345+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, NXP, N7021VA
  • /ModDate: D:20210303072501+01'00'
  • /Producer: LibreOffice 6.3
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-0977-V3-2021
  • pdf_file_size_bytes: 256432
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 0977V3a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ASE_TSS.2 and ALC_FLR.1
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-0977-V3-2021
    • cert_item: NXP Secure Smart Card Controller N7021 VA including IC Dedicated Software
    • cert_lab: BSI
    • developer: NXP Semiconductors Germany GmbH
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-0977-V2-2019: 2
    • BSI-DSZ-CC-0977-V3-2021: 19
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 2
    • EAL 2+: 1
    • EAL 4: 1
    • EAL 5: 4
    • EAL 5+: 1
    • EAL 6: 5
    • EAL 6 augmented: 3
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ATE: 7
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_TSS.2: 4
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
  • O:
    • O.C: 2
  • R:
    • R.O: 2
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • NXP:
    • NXP: 61
    • NXP Semiconductors: 36
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 6
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 15
  • DES:
    • 3DES:
      • TDEA: 2
      • TDES: 2
      • Triple-DES: 2
    • DES:
      • DES: 7
  • constructions:
    • MAC:
      • CBC-MAC: 3
      • CMAC: 6
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 3
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 6
  • TRNG:
    • TRNG: 1
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 2
pdf_data/report_keywords/crypto_engine
  • SmartMX:
    • SmartMX3: 24
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • fault injection: 1
  • SCA:
    • DPA: 1
    • physical probing: 1
    • side-channel: 1
  • other:
    • JIL: 4
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 1: 1
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 1
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 46: 1
    • AIS 47: 1
    • AIS14: 1
    • AIS19: 1
    • AIS31: 6
  • FIPS:
    • FIPS 197: 1
    • FIPS197: 14
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-108: 1
    • NIST SP 800-38A: 1
    • NIST SP 800-38B: 1
    • NIST SP 800-67: 4
    • NIST SP 800-90a: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • 1, 2020-09-24, NXP Semiconductors (confidential document) [28] Order Entry Form, Version 1.9, 2017-03-27, NXP Semiconductors [29] SITE TECHNICAL AUDIT: 1
    • 2.6, 2020-08-07, NXP Secure Smart Card Controller N7021 VA, Security Target, NXP Semiconductors (confidential document) [7] Evaluation Technical Report, Version 3.0, 2021-02-01, Evaluation Technical Report (ETR Summary: 1
    • 3, 2018-05-15, NXP Semiconductors (confidential document) [14] SmartMX3 N7021 Post Delivery Configuration Post Delivery Configuration Objective data sheet: 1
    • 3.1, 2019-06-04, NXP Semiconductors (confidential document) [12] SmartMX3 N7021 Instruction Set Manual Objective data sheet addendum, Version 1.4, 2016-09-29: 1
    • APIs on the N7021, Objective data sheet addendum, Version 1.1, 2017-03-09, NXP Semiconductors (confidential document) [19] SmartMX3 N7021 N7021 – NVM Operate Function NVM Operate Function, Use on the N7021, Objective: 1
    • Cipher Library (SymCfg), User manual, Version 1.2, 2017-02-13, NXP Semiconductors (confidential document) [25] N7021 Crypto Library RNG Library, Product user manual, Version 1.3, 2017-03-27, NXP: 1
    • Data Sheet addendum, Version 1.5, 2017-11-03, NXP Semiconductors (confidential document) [18] SmartMX3 N7021 N7021 – Inter-Card Communication, Inter-Card Communication Functionality and: 1
    • Manual, Version 1.4, 2019-06-04, NXP Semiconductors (confidential document) [21] SmartMX3 N7021 FlashLoader, FlashLoader for N7021: Protocol and Application Objective data: 1
    • NXP Semiconductors (confidential document) [16] SmartMX3 N7021 Peripheral Configuration and Use, Peripheral Configuration and Use on the: 1
    • Objective data sheet addendum, Version 1.2, 2017-11-03, NXP Semiconductors (confidential document) [23] SmartMX3 N7021 NXP System Mode OS Interface, UM configuration and applications, Objective: 1
    • Objective data sheet addendum, Version 1.5, 2019-12-12, NXP Semiconductors (confidential document) [17] SmartMX3 N7021 MMU configuration & FW interface, Access / resource management and security: 1
    • Semiconductors (confidential document) [13] SmartMX3 family N7021 Wafer and delivery specification Objective wafer specification, Version: 1
    • TÜV Informationstechnik GmbH – Evaluation Body for IT Security, (confidential document) 7 specifically • AIS 1, Durchführung der Ortsbesichtigung in der Entwicklungsumgebung des: 1
    • Version 1.1, 2017-03-22, NXP Semiconductors (confidential document) [15] SmartMX3 N7021 Chip Health Mode Chip Health Mode Objective data sheet addendum, Version 1.0: 1
    • addendum, Version 1.3, 2018-08-24, NXP Semiconductors (confidential document) [22] SmartMX3 N7021 Shared OS Libraries Memory, communication and CRC, including guidance and: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [26] N7021 Crypto Library, Utils Library, User manual, Version 1.1, 2016-11-28, NXP Semiconductors: 1
    • confidential document) [27] Crypto Library Iron on N7021 VA, Information on Guidance and Operation, User manual, Version: 1
    • sheet addendum, Version 1.0, 2017-01-13, NXP Semiconductor (confidential document) [20] NXP Secure Smart Card Controller N7021, Information on Guidance and Operation, Guidance and: 1
    • sheet addendum, Version 1.6, 2017-11-03, NXP Semiconductors (confidential document) 26 / 33 BSI-DSZ-CC-0977-V3-2021 Certification Report [24] Crypto Library V1.0 on N7021 VA: 1
    • to AIS 36 for the N7021 VA, BSI-DSZ-CC-0977-V3 Version 3, 2021-02-01, TÜV Informationstechnik GmbH (confidential document) [11] SmartMX3 family P71D320 Overview, pinning and electrical characteristics Product data sheet: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 0977V3b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL4: 3
    • EAL4+: 1
    • EAL6: 46
    • EAL6 augmented: 4
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 2
    • ADV_CMC.4: 1
    • ADV_CMC.5: 1
    • ADV_CMS.4: 1
    • ADV_CMS.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 6
    • ADV_FSP.5: 12
    • ADV_IMP: 1
    • ADV_IMP.1: 3
    • ADV_IMP.2: 3
    • ADV_INT.3: 1
    • ADV_SPM.1: 8
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 2
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 3
    • ALC_CMC.5: 5
    • ALC_CMS: 2
    • ALC_CMS.4: 4
    • ALC_CMS.5: 5
    • ALC_COV: 1
    • ALC_DEL.1: 2
    • ALC_DVS.2: 2
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 5
  • ATE:
    • ATE_COV.2: 3
    • ATE_COV.3: 5
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 27
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 2
    • FCS_CKM.4: 33
    • FCS_CKM.4.1: 3
    • FCS_COP.1: 39
    • FCS_COP.1.1: 6
    • FCS_RNG.1: 17
    • FCS_RNG.1.1: 5
    • FCS_RNG.1.2: 4
  • FDP:
    • FDP_ACC.1: 40
    • FDP_ACC.1.1: 3
    • FDP_ACF.1: 30
    • FDP_ACF.1.1: 4
    • FDP_ACF.1.2: 4
    • FDP_ACF.1.3: 4
    • FDP_ACF.1.4: 3
    • FDP_IFC.1: 18
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 1
    • FDP_ITC.1: 19
    • FDP_ITC.2: 19
    • FDP_ITT.1: 9
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 7
    • FDP_RIP.1.1: 1
    • FDP_SDC.1: 4
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 5
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 4
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM.1: 16
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 17
    • FMT_LIM.2.1: 2
    • FMT_MSA.1: 23
    • FMT_MSA.1.1: 2
    • FMT_MSA.3: 22
    • FMT_MSA.3.1: 2
    • FMT_MSA.3.2: 2
    • FMT_SMF.1: 25
    • FMT_SMF.1.1: 2
    • FMT_SMR.1: 13
  • FPT:
    • FPT_FLS.1: 12
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 6
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 8
    • FPT_PHP.3.1: 1
    • FPT_TST.1: 8
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FRU:
    • FRU_FLT.1: 1
    • FRU_FLT.2: 9
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 9
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 4
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 4
    • O.CUST_RECONFIG: 5
    • O.MEM_ACCESS: 5
    • O.NVM_INTEGRITY: 4
    • O.PUF: 5
    • O.REUSE: 5
    • O.RND: 4
    • O.SFR_ACCESS: 4
    • O.TDES: 5
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • NXP:
    • NXP: 68
    • NXP N.V: 1
    • NXP Semiconductors: 34
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 51
  • DES:
    • 3DES:
      • 3DES: 2
      • TDEA: 1
      • TDES: 18
      • Triple-DES: 16
    • DES:
      • DES: 10
  • constructions:
    • MAC:
      • CBC-MAC: 10
      • CMAC: 7
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 7
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 7
    • RNG: 43
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 12
  • ECB:
    • ECB: 9
pdf_data/st_keywords/crypto_engine
  • SmartMX:
    • SmartMX3: 25
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 11
    • malfunction: 6
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • Leak-Inherent: 12
    • Physical Probing: 4
    • physical probing: 5
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • FIPS:
    • FIPS 197: 4
    • FIPS PUB 197: 2
  • ISO:
    • ISO/IEC 14443: 6
    • ISO/IEC 7816: 12
    • ISO/IEC 9797-1: 1
  • NIST:
    • NIST SP 800-38A: 6
    • NIST SP 800-38B: 2
    • NIST SP 800-67: 4
    • SP 800-67: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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