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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Infineon IFX_CCI_00003Fh IFX_CCI_000059h IFX_CCI_00005Bh IFX_CCI_00003Ch IFX_CCI_00003Dh IFX_CCI_00005Ah design step G11 and H11 with optional HSL v2.01.6198, optional SCL v2.13.001, optional ACL v3.03.003, optional ACL v3.04.001, optional ACL v3.05.002, optional HCL v1.13.001, optional RCL v1.10.006 and with specific IC-dedicated firmware identifier 80.203.00.3 and Flash Loader v8.06.001
NSCIB-CC-2200060-02-CR
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Infineon IFX_CCI_00003Fh IFX_CCI_000059h IFX_CCI_00005Bh IFX_CCI_00003Ch IFX_CCI_00003Dh IFX_CCI_00005Ah design step G11 and H11 with optional HSL v2.01.6198, optional SCL v2.13.001, optional ACL v3.03.003, optional ACL v3.04.001, optional ACL v3.05.002, optional HCL v1.13.001, optional RCL v1.10.006 and with specific IC-dedicated firmware identifier 80.203.00.3 and Flash Loader v8.06.001
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE NL
status archived active
not_valid_after 07.05.2024 30.08.2029
not_valid_before 08.05.2019 30.08.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200060-02-Cert.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200060-02-CR.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2200060-02-ST_lite_v2.6.pdf
manufacturer Qualcomm Technologies Inc. Infineon Technologies AG
manufacturer_web https://www.qualcomm.com https://www.infineon.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL6+, ALC_FLR.1
dgst 2e8cbf6ce18d4c6f 6b6c005285b16441
heuristics/cert_id BSI-DSZ-CC-1045-2019 NSCIB-CC-2200060-02-CR
heuristics/cert_lab BSI
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ATE_FUN.2, ALC_TAT.3, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ALC_CMC.5, ADV_CMC.5, ADV_IMP.2, ASE_OBJ.2, ASE_REQ.2, ADV_INT.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/extracted_versions - 2.13.001, 1.13.001, 3.04.001, 2.01.6198, 8.06.001, 1.10.006, 3.05.002, 80.203.00.3, 3.03.003
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-1158-V3-2025
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 BSI-DSZ-CC-1158-V3-2025
heuristics/scheme_data
maintenance_updates
pdf_data/cert_filename 1045c_pdf.pdf NSCIB-CC-2200060-02-Cert.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • NL:
    • NSCIB-2200060-02: 1
    • NSCIB-CC-2200060-02: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL2: 1
    • EAL6: 1
    • EAL6 augmented: 1
    • EAL7: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_FLR.3: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Infineon:
    • Infineon Technologies AG: 1
pdf_data/cert_keywords/eval_facility
  • TUV:
    • TÜV Informationstechnik: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
  • ISO:
    • ISO/IEC 15408-1: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 18045:2008: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Valerie
  • /CreationDate: D:20240902124133+01'00'
  • /Creator: Microsoft® Word 2021
  • /ModDate: D:20240902124133+01'00'
  • /Producer: Microsoft® Word 2021
  • /Title: NSCIB Certificate
  • pdf_file_size_bytes: 88337
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf NSCIB-CC-2200060-02-CR.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • NL:
  • DE:
  • NL:
    • cert_id: NSCIB-CC-2200060-02-CR
    • cert_item: IFX_CCI_00003Fh IFX_CCI_000059h IFX_CCI_00005Bh IFX_CCI_00003Ch IFX_CCI_00003Dh IFX_CCI_00005Ah design step G11 and H11 with optional HSL v2.01.6198, optional SCL v2.13.001, optional ACL v3.03.003, optional ACL v3.04.001, optional ACL v3.05.002, optional HCL v1.13.001, optional RCL v1.10.006 and with specific IC- dedicated firmware identifier 80.203.00.3 and Flash Loader v8.06.001 v1.13.001, optional RCL v1.10.006 and with specific IC- dedicated firmware identifier 80.203.00.3 and Flash Loader v8.06.001
    • cert_lab:
    • developer: Infineon Technologies AG
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • NL:
    • NSCIB-2200060-02: 3
    • NSCIB-CC-2200060-02-CR: 13
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL4: 1
    • EAL6: 1
    • EAL6 augmented: 1
    • EAL6+: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ALC:
    • ALC_FLR.1: 2
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon Technologies AG: 3
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 3
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 7
  • DES:
    • 3DES:
      • TDES: 6
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 3
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 7
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • SCA:
    • side channel: 1
  • other:
    • JIL: 2
    • JIL-AAPS: 3
    • JIL-AM: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • OutOfScope:
    • following proprietary or non-standard algorithms, protocols and implementations: none, which are out of scope as there are no security claims relating to these. Not all key sizes specified in the [ST] have: 1
    • out of scope: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf NSCIB-CC-2200060-02-ST_lite_v2.6.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 6: 1
    • EAL 6 augmented: 1
    • EAL6: 125
    • EAL6 augmented: 122
    • EAL6+: 123
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 1
    • ADV_FSP: 1
    • ADV_FSP.4: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 2
    • ADV_IMP.2: 2
    • ADV_INT.3: 1
    • ADV_SPM: 2
    • ADV_SPM.1: 7
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 3
    • ALC_CMC.5: 2
    • ALC_CMS: 2
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS: 2
    • ALC_DVS.1: 2
    • ALC_DVS.2: 4
    • ALC_FLR.1: 11
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL: 10
    • ASE_CCL.1: 1
    • ASE_ECD: 4
    • ASE_ECD.1: 1
    • ASE_INT: 25
    • ASE_INT.1: 1
    • ASE_OBJ: 9
    • ASE_OBJ.2: 1
    • ASE_REQ: 48
    • ASE_REQ.2: 1
    • ASE_SPD: 8
    • ASE_SPD.1: 1
    • ASE_TSS: 17
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 3
    • ATE_COV.3: 4
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 3
    • FAU_SAS.1: 11
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 106
    • FCS_CKM.1: 33
    • FCS_CKM.2: 4
    • FCS_CKM.4: 29
    • FCS_COP: 191
    • FCS_COP.1: 30
    • FCS_RNG: 61
    • FCS_RNG.1: 18
  • FDP:
    • FDP_ACC: 17
    • FDP_ACC.1: 27
    • FDP_ACC.1.1: 1
    • FDP_ACF: 17
    • FDP_ACF.1: 23
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_AFC: 1
    • FDP_IFC.1: 16
    • FDP_ITC.1: 23
    • FDP_ITC.2: 23
    • FDP_ITT.1: 14
    • FDP_PHP.3: 1
    • FDP_SDC: 2
    • FDP_SDC.1: 12
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 14
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 16
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 16
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FIA:
    • FIA_API: 3
    • FIA_API.1: 13
    • FIA_API.1.1: 1
    • FIA_SOS.2: 2
    • FIA_SOS.2.1: 1
    • FIA_SOS.2.2: 1
  • FMT:
    • FMT_ACF: 1
    • FMT_LIM: 29
    • FMT_LIM.1: 12
    • FMT_LIM.2: 11
    • FMT_MSA.1: 17
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 20
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 15
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 22
    • FPT_ITC.1: 2
    • FPT_ITT.1: 15
    • FPT_PHP.3: 19
    • FPT_TST: 5
    • FPT_TST.1: 11
    • FPT_TST.2: 31
    • FPT_TST.2.1: 1
  • FRU:
    • FRU_FLT.2: 9
  • FTP:
    • FTP_ITC.1: 21
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
    • FTP_TRP.1: 4
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 4
    • O.RND: 4
    • O.TDES: 4
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 12
    • Infineon Technologies: 21
    • Infineon Technologies AG: 31
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 43
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 28
      • Triple-DES: 2
    • DES:
      • DES: 18
  • constructions:
    • MAC:
      • CBC-MAC: 9
      • CMAC: 7
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
    • ECDH:
      • ECDH: 4
    • ECDSA:
      • ECDSA: 11
  • FF:
    • DH:
      • Diffie-Hellman: 7
    • DSA:
      • DSA: 1
  • RSA:
    • RSA2048: 1
    • RSA4096: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • MD:
    • MD5:
      • MD5: 13
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 14
    • SHA2:
      • SHA-2: 1
      • SHA256: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 2
    • Key agreement: 2
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • DRBG: 20
    • PRNG: 1
  • RNG:
    • RND: 5
    • RNG: 34
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 15
  • CFB:
    • CFB: 7
  • CTR:
    • CTR: 9
  • ECB:
    • ECB: 17
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 3
    • Malfunction: 11
    • malfunction: 1
  • SCA:
    • DPA: 2
    • Leak-Inherent: 11
    • Physical Probing: 2
    • SPA: 1
    • physical probing: 1
    • side channel: 7
    • side-channel: 1
  • other:
    • reverse engineering: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS20: 1
    • AIS31: 9
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 197: 4
    • FIPS PUB 140-2: 1
    • FIPS PUB 180-4: 2
  • ISO:
    • ISO/IEC 11770-3: 1
    • ISO/IEC 14888-3: 6
    • ISO/IEC 15946-1: 1
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9797-1: 2
    • ISO/IEC 9798-2: 1
  • NIST:
    • SP 800-108: 1
    • SP 800-38A: 9
    • SP 800-38B: 5
    • SP 800-67: 5
  • PKCS:
    • PKCS #1: 2
    • PKCS#1: 8
  • RFC:
    • RFC 5639: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • SFRs related to the TOE authentication are regarded as not applicable, due to the fact that it is out of scope of the intended use-case and the authentication functionality is no longer available. End of note: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: Jürgen Noller
  • /CreationDate: D:20240816140000+02'00'
  • /Creator: Microsoft® Word for Microsoft 365
  • /Keywords: Infineon, EAL6 +, EAL6 plus, PP0084, SmartCard
  • /MSIP_Label_a15a25aa-e944-415d-b7a7-40f6b9180b6b_ActionId: d341d1f5-358b-49ec-b185-c3480f3a71fb
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  • /MSIP_Label_a15a25aa-e944-415d-b7a7-40f6b9180b6b_Enabled: true
  • /MSIP_Label_a15a25aa-e944-415d-b7a7-40f6b9180b6b_Method: Standard
  • /MSIP_Label_a15a25aa-e944-415d-b7a7-40f6b9180b6b_Name: a15a25aa-e944-415d-b7a7-40f6b9180b6b
  • /MSIP_Label_a15a25aa-e944-415d-b7a7-40f6b9180b6b_SetDate: 2024-08-16T08:21:51Z
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  • /ModDate: D:20240816140000+02'00'
  • /Producer: Microsoft® Word for Microsoft 365
  • /Title: Public Security Target
  • pdf_file_size_bytes: 1233413
  • pdf_hyperlinks: mailto:[email protected];[email protected]?subject=Document%20question%20, http://csrc.nist.gov/groups/ST/toolkit/rng/documentation_software.html, http://www.ietf.org/rfc/rfc5639.txt, http://www.infineon.com/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 121
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