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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		IFX_CCI_000068h, IFX_CCI_000080h design step G12 with firmware version 80.505.04.1, optional PQ Crypto Suite v5.00.012, optional HSL v04.05.0040, optional UMSLC v02.01.0040 and user guidance documents
BSI-DSZ-CC-1249-2024
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC IFX_CCI_000068h, IFX_CCI_000080h design step G12 with firmware version 80.505.04.1, optional PQ Crypto Suite v5.00.012, optional HSL v04.05.0040, optional UMSLC v02.01.0040 and user guidance documents
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
status archived active
not_valid_after 07.05.2024 17.12.2029
not_valid_before 08.05.2019 17.12.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1249c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1249a_pdf.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1249b_pdf.pdf
manufacturer Qualcomm Technologies Inc. Infineon Technologies AG
manufacturer_web https://www.qualcomm.com https://www.infineon.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL6+, ALC_FLR.1
dgst 2e8cbf6ce18d4c6f 5e551e06e7b71400
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-1249-2024
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ASE_TSS.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ALC_CMC.5, ASE_REQ.2, ADV_INT.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3, ADV_SPM.1
heuristics/extracted_versions - 04.05.0040, 02.01.0040, 5.00.012, 80.505.04.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/scheme_data
pdf_data/cert_filename 1045c_pdf.pdf 1249c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • DE:
    • BSI-DSZ-CC-1249-2024: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
    • EAL 6: 1
    • EAL 6 augmented: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
    • ALC_FLR.1: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Infineon:
    • Infineon Technologies AG: 1
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: Federal Office for Information Security
  • /Keywords: "Common Criteria, Certification, Zertifizierung, Infineon Technologies AG, SmartCard, Security IC, PQC, Post Quantum"
  • /Subject: Common Criteria, Certification, Zertifizierung, Infineon Technologies AG, SmartCard, Security IC, PQC, Post Quantum
  • /Title: Certificate BSI-DSZ-CC-1249-2024
  • pdf_file_size_bytes: 231007
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 1249a_pdf.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cc_security_level: Common Criteria Part 3 conformant EAL 6 augmented by ALC_FLR.1 valid until: 16 December 2029 SOGIS Recognition Agreement
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 extended
    • cert_id: BSI-DSZ-CC-1249-2024
    • cert_item: IFX_CCI_000068h, IFX_CCI_000080h design step G12 with firmware version 80.505.04.1, optional PQ Crypto Suite v5.00.012, optional HSL v04.05.0040, optional UMSLC v02.01.0040 and user guidance documents
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-1249-2024: 18
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 1
    • EAL 5: 4
    • EAL 6: 4
    • EAL 6 augmented: 3
    • EAL5+: 1
    • EAL6: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 3
  • AGD:
    • AGD_HRM: 4
    • AGD_PPM: 5
    • AGD_PRM: 6
  • ALC:
    • ALC_CMC.5: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 3
    • ALC_FLR.1: 5
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ATE:
    • ATE_FUN: 1
  • AVA:
    • AVA_VAN.5: 5
pdf_data/report_keywords/cc_sfr
  • FCS:
    • FCS_CKM.1: 1
    • FCS_COP.1: 1
  • FDP:
    • FDP_ITC: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon: 1
    • Infineon Technologies: 1
    • Infineon Technologies AG: 15
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 6
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 7
      • AES-: 7
  • constructions:
    • MAC:
      • CMAC: 3
pdf_data/report_keywords/asymmetric_crypto
  • FF:
    • DSA:
      • DSA: 1
pdf_data/report_keywords/pq_crypto
  • FIPS:
    • ML-KEM: 6
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA3:
      • SHA-3: 1
      • SHA3-224: 1
      • SHA3-384: 1
      • SHA3-512: 1
pdf_data/report_keywords/crypto_scheme
  • KEX:
    • Key Exchange: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 13
pdf_data/report_keywords/cipher_mode
  • CCM:
    • CCM: 2
  • ECB:
    • ECB: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • physical tampering: 1
  • SCA:
    • physical probing: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7148: 1
    • BSI TR-02102: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 1: 1
    • AIS 14: 1
    • AIS 19: 1
    • AIS 20: 1
    • AIS 23: 1
    • AIS 25: 1
    • AIS 26: 1
    • AIS 27: 1
    • AIS 31: 2
    • AIS 32: 1
    • AIS 34: 2
    • AIS 35: 2
    • AIS 36: 3
    • AIS 37: 1
    • AIS 38: 1
    • AIS 39: 1
    • AIS 41: 1
    • AIS 46: 1
    • AIS 47: 1
  • FIPS:
    • FIPS 197: 1
    • FIPS 203: 1
    • FIPS PUB 203: 1
    • FIPS197: 3
    • FIPS202: 3
    • FIPS203: 5
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • TÜV Informationstechnik GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • v1.4.0, 2024-05-22, Infineon Technologies AG (confidential document) [14] (also [AGD_SG]), “SLC21, 32-bit Security Controller – V24, Security Guidelines”, v1.00-3001: 1
    • 32-bit Secu-rity Controller – V24) Errata sheet”, v3.0, 2024-01-09, Infineon Technologies AG (confidential document) [19] “Site Technical Audit Report (STAR) - Infineon Technologies AG, Munich”, Version 4: 1
    • Evaluation (ETR COMP) for the IFX_CCI_000068h, IFX_CCI_000080h G12”, TÜV Informationstechnik GmbH (confidential document) [11] Configuration list for the TOE, Version 0.1, 2024-10-22 (confidential document) [12] (also: 1
    • Flash Loader V10”, v10.01, 2023-06-28, Infineon Technologies AG (confidential document) [16] (also [AGD_CryptoUM]), “Crypto2304T V4, User Manual”, v3.0, 2024-06-21, Infineon Technologies: 1
    • Infineon Technologies AG (confidential document) [15] (also [AGD_PPM]), “SLC21 (32-bit Security Controller – V24), Production and personalization: 1
    • SLC21 Post-Quantum Edition Se-curity Target”, Version 1.2, 2024-10-14, Infineon Technologies AG (confidential document) [7] Evaluation Technical Report, Version 2, 2024-12-04, “EVALUATION TECHNICAL REPORT SUMMARY (ETR: 1
    • Security Controller – V24), Hardware Reference Manual”, v6.0, 2024-06-26, Infineon Technologies AG (confidential document) [13] (also [AGD_PRM]), “TEGRION™ SLx2 security con-troller family, Programmer's Reference Manual: 1
    • TÜV Informationstechnik GmbH (confidential document) [20] “Site Technical Audit Report (STAR) - Infineon Technologies Asia Pacific Pte Ltd., Singapore: 1
    • Version 3, 2024-11-14, TÜV Informationstechnik GmbH (confidential document) 28 / 31 BSI-DSZ-CC-1249-2024 Certification Report C. Excerpts from the Criteria For the meaning: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
    • confidential document) [17] (also [AGD_CS]), “CS-SLC21V24 CryptoSuite 32-bit Security Controller, User inter- face manual: 1
    • v5.00.012, 2024-08-27, Infineon Technologies AG (confidential document) 7 See section 9.1 on usage of specific AIS. 27 / 31 Certification Report BSI-DSZ-CC-1249-2024 [18: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf 1249b_pdf.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 6: 2
    • EAL6: 3
    • EAL6 augmented: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 4
    • ADV_IMP.1: 1
    • ADV_IMP.2: 2
    • ADV_INT.3: 1
    • ADV_SPM.1: 2
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMC.5: 3
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_DEL.1: 1
    • ALC_DVS.2: 1
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 1
  • ASE:
    • ASE_CCL: 3
    • ASE_CCL.1: 1
    • ASE_ECD: 3
    • ASE_ECD.1: 1
    • ASE_INT: 9
    • ASE_INT.1: 1
    • ASE_OBJ: 4
    • ASE_OBJ.2: 1
    • ASE_REQ: 26
    • ASE_REQ.2: 1
    • ASE_SPD: 4
    • ASE_SPD.1: 1
    • ASE_TSS: 6
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_COV.3: 2
    • ATE_DPT.3: 1
    • ATE_FUN.2: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 5
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 9
    • FCS_CKM.1: 8
    • FCS_CKM.2: 2
    • FCS_CKM.4: 13
    • FCS_CKM.4.1: 1
    • FCS_COP: 19
    • FCS_COP.1: 2
    • FCS_RNG: 26
    • FCS_RNG.1: 11
  • FDP:
    • FDP_ACC: 15
    • FDP_ACC.1: 6
    • FDP_ACC.2: 1
    • FDP_ACF: 14
    • FDP_ACF.1: 12
    • FDP_IFC.1: 8
    • FDP_ITC.1: 8
    • FDP_ITC.2: 8
    • FDP_ITT.1: 6
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 3
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 3
    • FDP_UIT.1: 3
  • FIA:
    • FIA_API: 1
    • FIA_API.1: 5
    • FIA_API.1.1: 1
    • FIA_UID: 8
    • FIA_UID.1: 5
    • FIA_UID.2: 1
  • FMT:
    • FMT_LIM: 8
    • FMT_LIM.1: 5
    • FMT_LIM.2: 5
    • FMT_MSA: 21
    • FMT_MSA.1: 4
    • FMT_MSA.3: 5
    • FMT_MTD: 9
    • FMT_MTD.1: 1
    • FMT_SMF: 19
    • FMT_SMF.1: 5
    • FMT_SMR: 14
    • FMT_SMR.1: 11
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 11
    • FPT_TST.1: 5
    • FPT_TST.1.1: 1
    • FPT_TST.1.2: 1
    • FPT_TST.1.3: 1
  • FRU:
    • FRU_FLT.2: 4
  • FTP:
    • FTP_ITC.1: 4
    • FTP_ITC.1.1: 1
    • FTP_ITC.1.2: 1
    • FTP_ITC.1.3: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 1
    • O.MLKEM: 4
    • O.RND: 3
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 4
    • Infineon Technologies: 7
    • Infineon Technologies AG: 9
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 16
      • AES128: 3
  • constructions:
    • MAC:
      • CMAC: 2
  • miscellaneous:
    • SM4:
      • SM4: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA2:
      • SHA256: 4
    • SHA3:
      • SHA-3: 3
      • SHA3: 1
      • SHA3-224: 1
      • SHA3-256: 1
      • SHA3-384: 1
      • SHA3-512: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 4
    • RNG: 41
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CCM:
    • CCM: 3
  • ECB:
    • ECB: 4
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 2
  • SCA:
    • Leak-Inherent: 2
    • Physical Probing: 2
    • physical probing: 1
    • side channel: 1
    • side-channel: 5
  • other:
    • JIL: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • IBM:
    • SE: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS 20: 3
    • AIS 31: 10
    • AIS 46: 3
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 197: 5
    • FIPS 202: 6
    • FIPS 203: 9
    • FIPS PUB 197: 1
  • NIST:
    • SP 800-108: 3
    • SP 800-22: 3
    • SP 800-38A: 3
    • SP 800-38B: 3
    • SP 800-38C: 3
    • SP 800-90A: 4
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
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