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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		SAM 5000 build 4.12, BOS-V1 and RMS firmware with ID 80001141 CL97 Asymmetric Crypto Library for Crypto@2304T RSA/ECC/Toolbox v2.07.003, and Infineon Technologies Smart Card IC Security Controller M9900, design step A22 and G11, of the SLE97 family (smart card), or the SLI97 family (VQFN chip)
CSEC2017020
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC SAM 5000 build 4.12, BOS-V1 and RMS firmware with ID 80001141 CL97 Asymmetric Crypto Library for Crypto@2304T RSA/ECC/Toolbox v2.07.003, and Infineon Technologies Smart Card IC Security Controller M9900, design step A22 and G11, of the SLE97 family (smart card), or the SLI97 family (VQFN chip)
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE SE
not_valid_after 07.05.2024 28.08.2023
not_valid_before 08.05.2019 28.08.2018
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certifikat%20SAM%205000%20-%20CCRA.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certification%20Report%20-%20SAM5000.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SecurityTargetLite-KapschSAM5000-B.pdf
manufacturer Qualcomm Technologies Inc. Kapsch TrafficCom S.r.l.
manufacturer_web https://www.qualcomm.com https://www.kapsch.net/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL5
dgst 2e8cbf6ce18d4c6f 471a372b97a0b9f4
heuristics/cert_id BSI-DSZ-CC-1045-2019 CSEC2017020
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AVA_COMP.1, ASE_INT.1, ASE_COMP.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ADV_COMP.1, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_COMP.1, ALC_COMP.1, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions - 4.12, 2.07.003
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/st_references/directly_referencing {} BSI-DSZ-CC-0827-V6-2017
heuristics/st_references/indirectly_referencing {} BSI-DSZ-CC-0827-V6-2017
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf Certifikat SAM 5000 - CCRA.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Infineon:
    • Infineon Technologies: 1
pdf_data/cert_keywords/eval_facility
  • Combitech:
    • Combitech AB: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /CreationDate: D:20180828085843+02'00'
  • /ModDate: D:20180828093024+02'00'
  • pdf_file_size_bytes: 278986
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf Certification Report - SAM5000.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-0827-V7-2017: 1
  • SE:
    • CSEC2017020: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 5: 2
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_COMP.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.5: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_COMP.1: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_COMP.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COMP.1: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_COMP.1: 1
    • AVA_VAN: 1
    • AVA_VAN.4: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
  • T:
    • T.RND: 1
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon: 1
    • Infineon Technologies: 4
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • Combitech:
    • Combitech AB: 5
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 6
  • DES:
    • 3DES:
      • 3DES: 1
    • DES:
      • DES: 6
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 4
  • FF:
    • DH:
      • DH: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA1:
      • SHA-1: 1
    • SHA2:
      • SHA-256: 1
pdf_data/report_keywords/crypto_scheme
  • MAC:
    • MAC: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RND: 1
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • Malfunction: 2
  • SCA:
    • Leak-Inherent: 1
    • Physical Probing: 1
  • other:
    • JIL: 2
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 17025: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: hesve
  • /CreationDate: D:20180828085420+02'00'
  • /ModDate: D:20180828104437+02'00'
  • /Producer: Microsoft: Print To PDF
  • /Title: Microsoft Word - Certification Report - SAM5000
  • pdf_file_size_bytes: 859066
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 17
pdf_data/st_filename 1045b_pdf.pdf SecurityTargetLite-KapschSAM5000-B.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-0827-V6-2017: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP- 0035: 1
    • BSI-PP-0035: 3
    • BSI-PP-035: 11
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL5: 6
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 2
    • ADV_IMP.1: 3
    • ADV_INT: 1
    • ADV_INT.2: 2
    • ADV_TDS.3: 1
    • ADV_TDS.4: 2
  • AGD:
    • AGD_OPE.1: 3
    • AGD_PRE.1: 3
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 3
    • ALC_CMS.4: 1
    • ALC_CMS.5: 2
    • ALC_DEL: 1
    • ALC_DEL.1: 3
    • ALC_DVS.1: 2
    • ALC_DVS.2: 2
    • ALC_LCD: 1
    • ALC_LCD.1: 3
    • ALC_TAT.1: 1
    • ALC_TAT.2: 2
  • ASE:
    • ASE_CCL.1: 3
    • ASE_ECD.1: 3
    • ASE_INT.1: 3
    • ASE_OBJ.2: 3
    • ASE_REQ.2: 3
    • ASE_SPD.1: 3
    • ASE_TSS.1: 3
  • ATE:
    • ATE_COV.2: 3
    • ATE_DPT.2: 1
    • ATE_DPT.3: 2
    • ATE_FUN.1: 3
    • ATE_IND.2: 3
  • AVA:
    • AVA_VAN.4: 3
    • AVA_VAN.5: 2
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_CKM: 42
    • FCS_CKM.1: 19
    • FCS_CKM.2: 5
    • FCS_CKM.3: 7
    • FCS_CKM.4: 42
    • FCS_COP: 117
    • FCS_COP.1: 17
    • FCS_RNG.1: 1
  • FDP:
    • FDP_ACC.1: 13
    • FDP_ACF.1: 9
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ETC.2: 12
    • FDP_ETC.2.2: 1
    • FDP_ETC.2.3: 1
    • FDP_ETC.2.4: 1
    • FDP_IFC.1: 15
    • FDP_IFF.1: 8
    • FDP_IFF.1.2: 1
    • FDP_IFF.1.3: 1
    • FDP_IFF.1.4: 1
    • FDP_IFF.1.5: 1
    • FDP_ITC.1: 15
    • FDP_ITC.2: 31
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 1
  • FIA:
    • FIA_AFL: 16
    • FIA_AFL.1: 4
    • FIA_SOS.1: 8
    • FIA_UAU.1: 9
    • FIA_UAU.1.2: 1
    • FIA_UAU.5: 8
    • FIA_UAU.5.2: 1
    • FIA_UAU.6: 7
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
    • FMT_MSA.1: 1
    • FMT_MSA.3: 14
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 8
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_RPL.1: 8
    • FPT_RPL.1.2: 1
    • FPT_TDC.1: 2
    • FPT_TEE.1: 8
    • FPT_TEE.1.2: 1
    • FPT_TST.2: 1
  • FRU:
    • FRU_FLT.2: 1
  • FTP:
    • FTP_ITC.1: 1
    • FTP_TRP.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 2
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 8
    • Infineon Technologies: 3
    • Infineon Technologies AG: 3
pdf_data/st_keywords/eval_facility
  • Combitech:
    • Combitech AB: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 51
  • DES:
    • 3DES:
      • 3DES: 2
      • TDES: 1
      • Triple-DES: 1
    • DES:
      • DES: 44
  • constructions:
    • MAC:
      • CMAC: 6
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 22
    • ECDH:
      • ECDH: 1
  • FF:
    • DH:
      • DH: 7
      • Diffie-Hellman: 7
    • DSA:
      • DSA: 1
  • RSA:
    • RSA 1024: 1
    • RSA 2048: 6
    • RSA 4096: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 8
    • SHA2:
      • SHA-256: 7
      • SHA256: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • MAC:
    • MAC: 36
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 3
    • RNG: 4
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 20
  • ECB:
    • ECB: 5
pdf_data/st_keywords/ecc_curve
  • NIST:
    • NIST P-256: 2
    • NIST P-521: 2
    • P-256: 6
    • P-521: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 5
    • malfunction: 2
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
  • FIPS:
    • FIPS 140-2: 2
    • FIPS PUB 180-4: 1
    • FIPS PUB 186-2: 1
  • ISO:
    • ISO/IEC 10116:2006: 1
    • ISO/IEC 15446: 2
  • PKCS:
    • PKCS #1: 2
  • RFC:
    • RFC 5639: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: stgran
  • /CreationDate: D:20180321144633+01'00'
  • /ModDate: D:20180828105702+02'00'
  • /Producer: Microsoft: Print To PDF
  • /Title: Microsoft Word - 902390D.docx
  • pdf_file_size_bytes: 1184710
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 73
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