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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Infineon Smart Card IC (Security Controller) SLE66C166PE/m1532-a24
BSI-DSZ-CC-0345-2006
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Infineon Smart Card IC (Security Controller) SLE66C166PE/m1532-a24
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
not_valid_after 07.05.2024 01.09.2019
not_valid_before 08.05.2019 01.01.2007
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0345a.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0345b.pdf
manufacturer Qualcomm Technologies Inc. Infineon Technologies AG
manufacturer_web https://www.qualcomm.com https://www.infineon.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL5+, AVA_MSU.3, ALC_DVS.2, AVA_VLA.4
dgst 2e8cbf6ce18d4c6f 42bc0a7bc7d3a7f7
heuristics/cert_id BSI-DSZ-CC-1045-2019 BSI-DSZ-CC-0345-2006
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_ENV.1, ALC_LCD.2, ASE_INT.1, AGD_USR.1, ALC_DVS.2, ASE_REQ.1, ASE_PPC.1, ASE_DES.1, AVA_SOF.1, ATE_COV.2, ASE_TSS.1, ATE_DPT.2, AGD_ADM.1, ADV_INT.1, ADV_RCR.2, ATE_FUN.1, ADV_IMP.2, ALC_TAT.2, ADV_HLD.3, AVA_VLA.4, ASE_SRE.1, ASE_OBJ.1, ADV_SPM.3, ATE_IND.2, ADV_LLD.1, ADV_FSP.3, AVA_CCA.1, AVA_MSU.3
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-0344-2005, BSI-DSZ-CC-0322-2005
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0322-2005, BSI-DSZ-CC-0344-2005, BSI-DSZ-CC-0169-2002, BSI-DSZ-CC-0266-2005, BSI-DSZ-CC-0223-2003
heuristics/protection_profiles cf0f01bcd7be3e9c {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf 0345a.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
    • cert_id: BSI-DSZ-CC-0345-2006
    • cert_item: Infineon Smart Card IC (Security Controller) SLE66C166PE/m1532-a24 with specific IC Dedicated Software
    • cert_lab: BSI
    • developer: Infineon Technologies AG
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-0322: 1
    • BSI-DSZ-CC-0322-2005: 1
    • BSI-DSZ-CC-0344-2005: 3
    • BSI-DSZ-CC-0345-2006: 25
  • NL:
    • CC-0322-2005: 1
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0002-2001: 4
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 4: 1
    • EAL 5: 2
    • EAL 5 augmented: 1
    • EAL 7: 1
    • EAL1: 5
    • EAL2: 3
    • EAL3: 4
    • EAL4: 10
    • EAL5: 9
    • EAL5 augmented: 2
    • EAL5+: 1
    • EAL6: 3
    • EAL7: 4
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ACM:
    • ACM_AUT: 3
    • ACM_AUT.1: 1
    • ACM_CAP: 3
    • ACM_CAP.4: 1
    • ACM_SCP: 4
    • ACM_SCP.3: 2
  • ADO:
    • ADO_DEL: 3
    • ADO_DEL.2: 1
    • ADO_IGS: 3
    • ADO_IGS.1: 1
  • ADV:
    • ADV_FSP: 2
    • ADV_FSP.3: 2
    • ADV_HLD: 2
    • ADV_HLD.3: 2
    • ADV_IMP: 2
    • ADV_IMP.2: 2
    • ADV_INT: 2
    • ADV_INT.1: 2
    • ADV_LLD: 2
    • ADV_LLD.1: 1
    • ADV_RCR: 2
    • ADV_RCR.2: 2
    • ADV_SPM: 2
    • ADV_SPM.3: 2
  • AGD:
    • AGD_ADM: 2
    • AGD_ADM.1: 1
    • AGD_USR: 2
    • AGD_USR.1: 1
  • ALC:
    • ALC_DVS: 3
    • ALC_DVS.2: 5
    • ALC_FLR: 2
    • ALC_LCD: 2
    • ALC_LCD.2: 2
    • ALC_TAT: 3
    • ALC_TAT.2: 2
  • ASE:
    • ASE_DES.1: 1
    • ASE_ENV.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.1: 1
    • ASE_PPC.1: 1
    • ASE_REQ.1: 1
    • ASE_SRE.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 2
    • ATE_COV.2: 1
    • ATE_DPT: 2
    • ATE_DPT.2: 2
    • ATE_FUN: 2
    • ATE_FUN.1: 1
    • ATE_IND: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_CCA: 2
    • AVA_CCA.1: 2
    • AVA_MSU: 2
    • AVA_MSU.3: 5
    • AVA_SOF: 4
    • AVA_SOF.1: 1
    • AVA_VLA: 4
    • AVA_VLA.2: 1
    • AVA_VLA.3: 1
    • AVA_VLA.4: 6
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 1
  • FCS:
    • FCS_CKM.1: 1
    • FCS_CKM.4: 1
    • FCS_COP.1: 2
    • FCS_RND.1: 1
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACF.1: 1
    • FDP_IFC.1: 1
    • FDP_ITC.1: 1
    • FDP_ITC.2: 1
    • FDP_ITT.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 1
  • FMT:
    • FMT_LIM.1: 1
    • FMT_LIM.2: 1
    • FMT_MSA.1: 1
    • FMT_MSA.2: 1
    • FMT_MSA.3: 1
    • FMT_SMF.1: 1
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
    • FPT_SEP.1: 1
    • FPT_TST.2: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Infineon:
    • Infineon: 20
    • Infineon Technologies: 2
    • Infineon Technologies AG: 15
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • TUV:
    • TÜV Informationstechnik: 4
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • 3DES:
      • 3DES: 1
      • Triple-DES: 3
    • DES:
      • DES: 10
pdf_data/report_keywords/asymmetric_crypto
  • RSA:
    • RSA2048: 2
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
  • SHA:
    • SHA1:
      • SHA-1: 1
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • RNG:
    • RNG: 6
pdf_data/report_keywords/cipher_mode
  • CBC:
    • CBC: 1
  • ECB:
    • ECB: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • DFA: 1
    • Malfunction: 1
    • malfunction: 1
    • physical tampering: 1
  • SCA:
    • DPA: 5
    • Physical Probing: 1
    • SPA: 2
    • physical probing: 2
    • side channel: 1
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
  • BSI:
    • BSI 7125: 2
    • BSI 7148: 1
    • BSI 7149: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 2
    • AIS 34: 3
    • AIS 36: 5
    • AIS31: 1
  • ISO:
    • ISO/IEC 15408:1999: 1
    • ISO/IEC15408: 1999: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
  • ConfidentialDocument:
    • 07.04, (confidential document) [13] Application Note, SLE 66CxxxP and SLE 66CxxxPE, Testing the Random Number Generator, Version: 1
    • 2, 20 February 2006, for the Product Smart Card IC (Security Controller) SLE66C166PE / m1532-a24, (confidential document) [8] Smartcard IC Platform Protection Profile, Version 1.0, July 2001, BSI registration ID: 1
    • Card IC (Security Controller) SLE66C166PE / m1532-a24 (confidential document). B-27 Certification Report BSI-DSZ-CC-0345-2006 This page is intentionally left blank. B-28: 1
    • Management Scope (ACM_SCP), Version 1.0, 17. August 2005 (i.e. TOE Configuration List, confidential document) [26] ETR-lite for composition, according to AIS 36, Version 2, 20 February 2006, for the Product: 1
    • Manual, SLE66xxxP (Superslim) and SLE 66CxxxPE (Microslim) Controllers , Version 03.05, (confidential document) [12] Security &Chip Card ICs SLE 66CxxxPE – Instruction Set and Special Function Registers – Quick: 1
    • and Chipcard ICs, SLE66CxxxPE, MicroSlim Security Controller Family, Data Book, Version 07.05 (confidential document) [10] Security & Chip Card ICs – SLE 66CxxxPE – Instruction Set, 07.04, (confidential document) [11: 1
pdf_data/report_metadata
  • /Author: BSI
  • /Company: BSI, Postfach 200363, 53133 Bonn
  • /CreationDate: D:20060428104546+02'00'
  • /Creator: Acrobat PDFMaker 7.0.7 für Word
  • /Keywords: Common Criteria, Certification, Zertifizierung, Smartcard
  • /ModDate: D:20060508105944+02'00'
  • /Producer: Acrobat Distiller 7.0.5 (Windows)
  • /SourceModified: D:20060428084232
  • /Title: Certification Report BSI-DSZ-CC-0345-2006
  • pdf_file_size_bytes: 778876
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 50
pdf_data/st_filename 1045b_pdf.pdf 0345b.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0002: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 4
    • EAL 5 augmented: 4
    • EAL5: 4
    • EAL5 augmented: 1
    • EAL5+: 3
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ACM:
    • ACM_AUT.1: 2
    • ACM_CAP.4: 1
    • ACM_SCP: 3
    • ACM_SCP.2: 1
    • ACM_SCP.3: 5
  • ADO:
    • ADO_DEL.2: 2
    • ADO_IGS.1: 2
  • ADV:
    • ADV_FSP: 1
    • ADV_FSP.2: 1
    • ADV_FSP.3: 5
    • ADV_HLD.3: 3
    • ADV_IMP.2: 3
    • ADV_INT.1: 3
    • ADV_LLD.1: 3
    • ADV_RCR.2: 3
    • ADV_SPM.1: 1
    • ADV_SPM.3: 2
  • AGD:
    • AGD_ADM.1: 2
    • AGD_USR.1: 2
  • ALC:
    • ALC_DVS.2: 4
    • ALC_LCD.2: 1
    • ALC_TAT.2: 2
  • ATE:
    • ATE_COV.2: 2
    • ATE_DPT.2: 1
    • ATE_FUN.1: 2
    • ATE_IND.2: 2
  • AVA:
    • AVA_CCA.1: 2
    • AVA_MSU.3: 3
    • AVA_SOF: 4
    • AVA_SOF.1: 2
    • AVA_VLA.4: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_CKM.1: 13
    • FCS_CKM.1.1: 1
    • FCS_CKM.2: 1
    • FCS_CKM.4: 12
    • FCS_CKM.4.1: 1
    • FCS_COP.1: 19
    • FCS_COP.1.1: 1
    • FCS_RND: 2
    • FCS_RND.1: 4
    • FCS_RND.1.1: 1
  • FDP:
    • FDP_ACC.1: 19
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 15
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 8
    • FDP_ITC.1: 12
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITC.2: 11
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 3
    • FDP_SDI.1: 17
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 15
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 4
    • FMT_LIM.2: 4
    • FMT_MSA.1: 13
    • FMT_MSA.1.1: 1
    • FMT_MSA.2: 11
    • FMT_MSA.2.1: 1
    • FMT_MSA.3: 14
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMF.1: 8
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 7
  • FPT:
    • FPT_AMT.1: 4
    • FPT_FLS.1: 5
    • FPT_ITT.1: 3
    • FPT_PHP.3: 7
    • FPT_SEP.1: 6
    • FPT_TDC.1: 1
    • FPT_TST: 2
    • FPT_TST.1: 11
    • FPT_TST.2: 26
    • FPT_TST.2.1: 2
  • FRU:
    • FRU_FLT.2: 5
  • FTP:
    • FTP_ITC.1: 1
    • FTP_TRP.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 1
  • T:
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon: 2
    • Infineon Technologies AG: 8
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • DES:
    • 3DES:
      • 3DES: 20
      • Triple-DES: 1
    • DES:
      • DES: 13
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 9
  • RSA:
    • RSA2048: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 2
    • RNG: 7
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • DFA: 2
    • Malfunction: 15
    • malfunction: 3
  • SCA:
    • DPA: 4
    • Leak-Inherent: 10
    • Physical Probing: 2
    • SPA: 2
  • other:
    • reverse engineering: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 9
  • FIPS:
    • FIPS PUB 46-3: 2
  • ISO:
    • ISO/IEC 7816: 2
    • ISO/IEC 7816-3: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • out of scope: 1
    • single DES is out of scope of the evaluation: 1
    • smart card applications, • data encryption according to single-DES and 3DES standard (single DES is out of scope of the evaluation), • advanced security sensors and physical countermeasures (e.g. shielding), •: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: grans
  • /CreationDate: D:20050915133741+02'00'
  • /Creator: pdfFactory Pro www.pdffactory.com
  • /ModDate: D:20060508110054+02'00'
  • /Producer: pdfFactory Pro 2.38 (Windows XP Professional German)
  • /Title: Evaluation Documentation SLE66C166PE / m1532-a24
  • pdf_file_size_bytes: 266166
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 46
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