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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		Microcontrôleurs sécurisés ST33F1M/1M0/896/768/640/512, SC33F1M0/896/768/640/512/384, SM33F1M/1M0/896/768/640/512, SE33F1M/1M0/896/768/640/512, SL33F1M/1M0/896/768/640/512, SP33F1M, incluant le logiciel dédié révision D ou E et optionnellement la bibliothèque cryptographique NesLib v3.0 ou v3.2
ANSSI-CC-2013/44
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Microcontrôleurs sécurisés ST33F1M/1M0/896/768/640/512, SC33F1M0/896/768/640/512/384, SM33F1M/1M0/896/768/640/512, SE33F1M/1M0/896/768/640/512, SL33F1M/1M0/896/768/640/512, SP33F1M, incluant le logiciel dédié révision D ou E et optionnellement la bibliothèque cryptographique NesLib v3.0 ou v3.2
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
not_valid_after 07.05.2024 01.09.2019
not_valid_before 08.05.2019 17.06.2013
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC_2013-44fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-cible_2013-44en.pdf
manufacturer Qualcomm Technologies Inc. STMicroelectronics
manufacturer_web https://www.qualcomm.com https://www.st.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f 33e3fb1d1486ab51
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2013/44
heuristics/cert_lab BSI THALES
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AGD_PRE.1, ATE_COV.2, ALC_TAT.2, ALC_CMS.5, ATE_FUN.1, AVA_VAN.5, ALC_DEL.1, ATE_DPT.3, ATE_IND.2, ADV_TDS.4, ALC_LCD.1, ALC_DVS.2, ADV_ARC.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, ALC_CMC.4, ADV_IMP.1
heuristics/extracted_versions - 3.2, 3.0
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} ANSSI-CC-2012/79
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} ANSSI-CC-2010/50, ANSSI-CC-2010/49, ANSSI-CC-2012/79, ANSSI-CC-2011/07
heuristics/protection_profiles cf0f01bcd7be3e9c f6d23054061d72ba
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC_2013-44fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL5 Augmenté ALC_DVS.2 et AVA_VAN.5
    • cc_version: CC version 3.1 révision 3
    • cert_id: ANSSI-CC-2013/44
    • cert_item: Microcontrôleurs sécurisés ST33F1M/1M0/896/768/640/512, SC33F1M0/896/768/640/512/384, SM33F1M/1M0/896/768/640/512, SE33F1M/1M0/896/768/640/512, SL33F1M/1M0/896/768/640/512, SP33F1M, incluant le logiciel dédié révision D ou E et optionnellement la bibliothèque cryptographique NesLib v3.0 ou v3.2
    • cert_item_version: Version maskset K8C0A, révision externe F, révision interne J
    • cert_lab: Thales (TCS-CNES) 18 avenue Edouard Belin, 31401 Toulouse Cedex 9, France
    • developer: STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, 13106 ROUSSET, France Commanditaire STMicroelectronics 190 avenue Celestin Coq, ZI de Rousset, 13106 ROUSSET, France
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: BSI_PP_0035], version V1.0 Security IC Platform Protection Profile
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2012/79: 3
    • ANSSI-CC-2012/79-M01: 3
    • ANSSI-CC-2013/44: 21
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 1
    • EAL 7: 1
    • EAL4: 2
    • EAL5: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_INT: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 2
    • ALC_TAT: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 2
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • STMicroelectronics:
    • STMicroelectronics: 12
  • Thales:
    • Thales: 1
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 2
  • DES:
    • DES:
      • DES: 2
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
  • TRNG:
    • TRNG: 2
pdf_data/report_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 2
pdf_data/report_keywords/crypto_library
  • Neslib:
    • NesLib 3.0: 1
    • NesLib 3.2: 1
    • NesLib v3.0: 25
    • NesLib v3.2: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/tee_name
  • IBM:
    • SE: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • BSI:
    • AIS 31: 2
    • AIS31: 3
  • CC:
    • CCMB-2009-07-001: 1
    • CCMB-2009-07-002: 1
    • CCMB-2009-07-003: 1
    • CCMB-2009-07-004: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /CreationDate: D:20130618153047+02'00'
  • /Creator: PDFCreator Version 1.2.1
  • /Keywords:
  • /ModDate: D:20130619102325+02'00'
  • /Producer: GPL Ghostscript 9.02
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 175003
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
pdf_data/st_filename 1045b_pdf.pdf ANSSI-CC-cible_2013-44en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035: 57
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL4: 1
    • EAL5: 17
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADO:
    • ADO_DEL: 1
  • ADV:
    • ADV_ARC: 2
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ATE:
    • ATE_COV: 3
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
  • FCS:
    • FCS_CKM.1: 24
    • FCS_CKM.4: 4
    • FCS_COP.1: 26
    • FCS_RNG: 1
    • FCS_RNG.1: 6
  • FDP:
    • FDP_ACC.1: 15
    • FDP_ACC.2: 12
    • FDP_ACF.1: 24
    • FDP_CKM.2: 1
    • FDP_IFC.1: 12
    • FDP_ITC.1: 13
    • FDP_ITC.2: 2
    • FDP_ITT.1: 7
    • FDP_SMF.1: 2
    • FDP_SMR.1: 1
  • FMT:
    • FMT_ITC.1: 1
    • FMT_LIM: 1
    • FMT_LIM.1: 18
    • FMT_LIM.2: 17
    • FMT_MSA.1: 22
    • FMT_MSA.2: 1
    • FMT_MSA.3: 23
    • FMT_SMF.1: 16
    • FMT_SMR.1: 6
  • FPT:
    • FPT_FLS.1: 8
    • FPT_ITT.1: 6
    • FPT_PHP.3: 7
  • FRU:
    • FRU_FLT.2: 8
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.RND: 3
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
  • STMicroelectronics:
    • STMicroelectronics: 9
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 10
  • DES:
    • 3DES:
      • 3DES: 5
    • DES:
      • DES: 15
  • constructions:
    • MAC:
      • CBC-MAC: 4
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 8
    • SHA2:
      • SHA-2: 1
      • SHA-224: 5
      • SHA-256: 5
      • SHA-384: 5
      • SHA-512: 3
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 6
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 4
  • ECB:
    • ECB: 2
pdf_data/st_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 5
pdf_data/st_keywords/crypto_library
  • Neslib:
    • NESLIB 3.0: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 9
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • DPA: 1
    • Leak-Inherent: 8
    • Physical Probing: 4
    • SPA: 1
    • physical probing: 3
    • side channel: 6
    • timing attacks: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • CC:
    • CCMB-2012-09-001: 3
    • CCMB-2012-09-002: 17
    • CCMB-2012-09-003: 2
  • FIPS:
    • FIPS PUB 140-2: 7
    • FIPS PUB 180-1: 4
    • FIPS PUB 180-2: 3
    • FIPS PUB 186: 2
    • FIPS PUB 197: 3
    • FIPS PUB 46-3: 3
  • ISO:
    • ISO/IEC 10116: 5
    • ISO/IEC 10118-: 2
    • ISO/IEC 14888: 2
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9796: 1
    • ISO/IEC 9796-2: 4
    • ISO/IEC 9797: 1
    • ISO/IEC 9797-1: 3
  • PKCS:
    • PKCS #1: 8
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /CreationDate: D:20130207100045Z
  • /Creator: FrameMaker 7.2
  • /ModDate: D:20130619102333+02'00'
  • /Producer: Acrobat Distiller 6.0 (Windows)
  • /Title:
  • pdf_file_size_bytes: 931029
  • pdf_hyperlinks: http://www.st.com
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 58
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state/cert/extract_ok True False
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