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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		FM1280 V05
SERTIT-109
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC FM1280 V05
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE NO
not_valid_after 07.05.2024 02.07.2023
not_valid_before 08.05.2019 02.07.2018
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20C%20v%202.0.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20Certification%20Report%20Fudan%20EAL5plus%20v2.0_rev.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/FM1280%20EAL5plus%20ST%20lite%20v2.0.pdf
manufacturer Qualcomm Technologies Inc. Shanghai Fudan Microelectronics Group Co., Ltd.
manufacturer_web https://www.qualcomm.com https://eng.fmsh.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f 29eab60d2793d1a1
heuristics/cert_id BSI-DSZ-CC-1045-2019 SERTIT-109
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 02.07.2018
  • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-109
    • certification_date: 02.07.2018
    • description: The TOE is a Dual Interface Smart Card Chip with IC Dedicated Software. It provides TDES, RSA, AES, ECC,True Random Number Generator and other security features. It can be widely and easily applied in various security fields such as banking and financial market, social security card, transport card, small-amount payment and security identification, etc. The TOE supports the following communication interfaces: - ISO/IEC 14443 TYPE A contactless interface - ISO/IEC 7816 contact interface - GPIO - SPI - I2C - UART
    • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135331-1607953855/SERTIT/Sertifikater/2018/109/SERTIT-109%20C%20v%202.0.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135325-1607953847/SERTIT/Sertifikater/2018/109/FM1280%20EAL5%2B%20ST%20lite.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135328-1607953852/SERTIT/Sertifikater/2018/109/SERTIT-109%20Certification%20Report%20Fudan%20EAL5%2B%20v2.0_rev.pdf'})], 'maintenance': [frozendict({'href': 'https://sertit.no/getfile.php/135322-1607953843/SERTIT/Sertifikater/2018/109/SERTIT-109%20MR%20Maintenance%20Report%20v1.0-.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • expiration_date: 02.07.2023
    • level: EAL 5, ALC_DVS.2, ATE_DPT.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: V05
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, BSI-CC-PP-0084-2014
    • sponsor: Shanghai Fudan Microelectronics Group Co., Ltd.
  • product: FM1280
  • url: https://sertit.no/certified-products/product-archive/fm1280
maintenance_updates
pdf_data/cert_filename 1045c_pdf.pdf SERTIT-109 C v 2.0.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • NO:
    • SERTIT-109: 2
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ALC:
    • ALC_FLR: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • pdf_file_size_bytes: 2830569
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf SERTIT-109 Certification Report Fudan EAL5plus v2.0_rev.pdf
pdf_data/report_frontpage
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • NO:
    • SERTIT-109: 20
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0084-2014: 23
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 2: 1
    • EAL 5: 22
    • EAL 5 augmented: 1
    • EAL1: 1
    • EAL4: 1
    • EAL5: 1
    • EAL5+: 1
    • EAL7: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_COP.1: 8
    • FCS_RNG.1: 4
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACF.1: 1
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
    • FDP_SDC.1: 4
    • FDP_SDI.2: 3
  • FMT:
    • FMT_LIM.1: 2
    • FMT_LIM.2: 2
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • BrightSight:
    • Brightsight: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • TDES: 5
    • DES:
      • DES: 3
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
  • FI:
    • Fault Injection: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • other:
    • JIL: 2
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15408: 8
    • ISO/IEC 7816: 2
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /Author: Ulrich Isachsen
  • /CreationDate: D:20190319130354+01'00'
  • /Creator: Microsoft® Word 2013
  • /Keywords: ugradert
  • /ModDate: D:20190319130354+01'00'
  • /Producer: Microsoft® Word 2013
  • /Title: tittel
  • pdf_file_size_bytes: 423796
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
pdf_data/st_filename 1045b_pdf.pdf FM1280 EAL5plus ST lite v2.0.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL5: 2
    • EAL5 augmented: 2
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 9
    • FCS_CKM.4: 9
    • FCS_COP.1: 28
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 6
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC.1: 8
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 7
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 4
    • FDP_ITC.1: 13
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDC.1: 7
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 2
    • FMT_MSA.3: 3
  • FPT:
    • FPT_FLS.1: 6
    • FPT_ITT.1: 6
    • FPT_PHP.3: 5
  • FRU:
    • FRU_FLT.2: 6
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.AES: 5
    • O.ECC: 5
    • O.MEM_ACCCESS: 1
    • O.MEM_ACCESS: 4
    • O.RND: 3
    • O.RSA: 5
    • O.TDES: 6
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 29
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 1
      • TDES: 16
      • Triple-DES: 7
    • DES:
      • DES: 13
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 30
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • RNG:
    • RND: 5
    • RNG: 8
  • TRNG:
    • TRNG: 1
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 5
  • ECB:
    • ECB: 5
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 5
    • fault injection: 1
    • malfunction: 4
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS 197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 7816: 4
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • PKCS:
    • PKCS#1: 3
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: FMSH
  • /CreationDate: D:20180606084137+08'00'
  • /Creator: Microsoft® Word 2010
  • /ModDate: D:20180606084137+08'00'
  • /Producer: Microsoft® Word 2010
  • pdf_file_size_bytes: 677458
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 31
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