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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		ST33G1M2A1 including optional cryptographic library NesLib and optional library SFM (C04)(ANSSI-CC-2020/24-R01)
ANSSI-CC-2020/24-R01
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC ST33G1M2A1 including optional cryptographic library NesLib and optional library SFM (C04)(ANSSI-CC-2020/24-R01)
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
status archived active
not_valid_after 07.05.2024 27.02.2029
not_valid_before 08.05.2019 27.02.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certificat-CC-2020_24-R01fr.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2020_24-R01fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-CC-2020_24-R01en.pdf
manufacturer Qualcomm Technologies Inc. STMicroelectronics
manufacturer_web https://www.qualcomm.com https://www.st.com/
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 ALC_DVS.2, EAL5+, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f 1d67bb03765a278a
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2020/24-R01
heuristics/cert_lab BSI []
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.4, ALC_TAT.2, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/extracted_versions - 2020, 24
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/protection_profiles cf0f01bcd7be3e9c f6d23054061d72ba
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0035b.pdf
pdf_data/cert_filename 1045c_pdf.pdf Certificat-CC-2020_24-R01fr.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • FR:
    • ANSSI-CC-2020/24-R01: 2
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-CC-PP-0035-2007: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL2: 1
    • EAL5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author: DUCLOS Charlene
  • /Category:
  • /Comments: ANSSI-CC-CER-F-14_v14.8
  • /Company: SGDSN
  • /CreationDate: D:20240229102447+01'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords: version x.x, révision x
  • /ModDate: D:20240229102448+01'00'
  • /Producer: Adobe PDF Library 23.1.175
  • /SourceModified: D:20240229092422
  • /Title: ANSSI-CC-2020/24-R01
  • pdf_file_size_bytes: 144907
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2020_24-R01fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2020/24-R01: 2
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0035-2007: 1
    • BSI-PP-0035-2007: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL2: 2
    • EAL5: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ALC:
    • ALC_DVS.2: 1
    • ALC_FLR: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • CESTI:
    • CESTI: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/cplc_data
  • ICVersion:
    • IC Version: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf ANSSI-cible-CC-2020_24-R01en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-PP-0035: 62
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 5: 2
    • EAL 5 augmented: 2
    • EAL4: 1
    • EAL5: 17
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADO:
    • ADO_DEL: 1
  • ADV:
    • ADV_ARC: 2
    • ADV_ARC.1: 1
    • ADV_FSP: 4
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE: 1
    • AGD_OPE.1: 1
    • AGD_PRE: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 1
    • ALC_CMS: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 4
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 3
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 7
  • FCS:
    • FCS_CKM.1: 21
    • FCS_CKM.4: 4
    • FCS_COP.1: 37
    • FCS_RNG: 1
    • FCS_RNG.1: 7
  • FDP:
    • FDP_ACC.1: 27
    • FDP_ACC.2: 13
    • FDP_ACF.1: 38
    • FDP_CKM.2: 1
    • FDP_IFC.1: 16
    • FDP_ITC.1: 14
    • FDP_ITC.2: 2
    • FDP_ITT.1: 11
    • FDP_SMF.1: 2
    • FDP_SMR.1: 1
  • FMT:
    • FMT_ITC.1: 1
    • FMT_LIM: 1
    • FMT_LIM.1: 20
    • FMT_LIM.2: 19
    • FMT_MSA.1: 28
    • FMT_MSA.2: 1
    • FMT_MSA.3: 38
    • FMT_SMF.1: 18
    • FMT_SMR.1: 10
  • FPT:
    • FPT_FLS.1: 12
    • FPT_ITT.1: 10
    • FPT_PHP.3: 12
  • FRU:
    • FRU_FLT.2: 12
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • O:
    • O.C: 3
    • O.RND: 4
  • R:
    • R.O: 3
  • T:
    • T.RND: 3
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Infineon:
    • Infineon Technologies: 1
  • Philips:
    • Philips: 1
  • STMicroelectronics:
    • STMicroelectronics: 25
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 17
      • AES-128: 1
      • AES-192: 1
      • AES-256: 1
  • DES:
    • 3DES:
      • TDEA: 1
      • TDES: 11
    • DES:
      • DES: 10
  • constructions:
    • MAC:
      • CBC-MAC: 2
      • CMAC: 4
      • HMAC: 4
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 5
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 4
    • EdDSA:
      • EdDSA: 5
  • FF:
    • DH:
      • Diffie-Hellman: 9
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • Keccak:
    • Keccak: 12
  • SHA:
    • SHA1:
      • SHA-1: 17
    • SHA2:
      • SHA-2: 4
      • SHA-224: 5
      • SHA-256: 8
      • SHA-384: 7
      • SHA-512: 5
    • SHA3:
      • SHA-3: 6
      • SHA3-224: 4
      • SHA3-256: 4
      • SHA3-384: 4
      • SHA3-512: 4
  • SHAKE:
    • SHAKE128: 4
    • SHAKE256: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KEM:
    • KEM: 1
  • MAC:
    • MAC: 1
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • DRBG: 9
  • RNG:
    • RND: 7
    • RNG: 6
  • TRNG:
    • TRNG: 3
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 10
  • CCM:
    • CCM: 3
  • ECB:
    • ECB: 9
  • GCM:
    • GCM: 3
pdf_data/st_keywords/crypto_engine
  • NesCrypt:
    • NESCRYPT: 3
pdf_data/st_keywords/crypto_library
  • Neslib:
    • NesLib : 9
    • NesLib 281: 1
    • NesLib 282: 1
    • NesLib 285: 1
    • NesLib 289: 1
    • NesLib 293: 1
    • NesLib 295: 1
    • NesLib 296: 1
    • NesLib 298: 1
    • NesLib 299: 1
    • NesLib 6.3: 2
    • NesLib 6.3.4: 3
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 13
    • malfunction: 2
    • physical tampering: 1
  • SCA:
    • Leak-Inherent: 12
    • Physical Probing: 4
    • Side channel: 1
    • physical probing: 3
    • side channel: 9
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • other:
    • T6: 1
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • BSI:
    • AIS31: 3
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 19
    • CCMB-2017-04-003: 2
  • FIPS:
    • FIPS 186-4: 4
    • FIPS PUB 140-2: 5
    • FIPS PUB 180-2: 5
    • FIPS PUB 197: 4
    • FIPS PUB 198-1: 2
    • FIPS PUB 202: 6
  • ISO:
    • ISO/IEC 14888: 2
    • ISO/IEC 7816-3: 1
    • ISO/IEC 9796: 1
    • ISO/IEC 9796-2: 3
  • NIST:
    • NIST SP 800-38A: 3
    • NIST SP 800-38B: 1
    • NIST SP 800-38C: 1
    • NIST SP 800-38D: 1
    • NIST SP 800-56A: 3
    • NIST SP 800-67: 3
    • NIST SP 800-90: 4
    • SP 800-38A: 2
    • SP 800-38B: 1
    • SP 800-38C: 1
    • SP 800-38D: 1
    • SP 800-67: 1
    • SP 800-90A: 1
  • PKCS:
    • PKCS #1: 6
    • PKCS1: 1
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • 35 The Security IC Embedded Software (ES) is in User NVM. The ES is not part of the TOE and is out of scope of the evaluation, except NesLib and SFM when they are embedded. 36 The user guidance documentation: 1
    • ES) is in User NVM. The ES is not part of the TOE and is out of scope of the evaluation, except NesLib and SFM when they are embedded: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
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