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Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019 		IDmove v4 on Infineon in EAC with PACE configuration with AA in option
ANSSI-CC-2019/57
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC IDmove v4 on Infineon in EAC with PACE configuration with AA in option
category Other Devices and Systems ICs, Smart Cards and Smart Card-Related Devices and Systems
scheme DE FR
not_valid_after 07.05.2024 20.12.2024
not_valid_before 08.05.2019 20.12.2019
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2019_57fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cible-cc-2019_57en.pdf
manufacturer Qualcomm Technologies Inc. Idemia
manufacturer_web https://www.qualcomm.com https://www.idemia.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL5+, ALC_DVS.2, AVA_VAN.5
dgst 2e8cbf6ce18d4c6f 1578bb12ee0046da
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2019/57
heuristics/cert_lab BSI SERMA
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_FLR.3, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.4, ALC_TAT.2, ASE_REQ.2, ATE_IND.2, ASE_CCL.1
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/directly_referencing {} BSI-DSZ-CC-1110-V2-2019
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referencing {} BSI-DSZ-CC-0891-2015, BSI-DSZ-CC-0782-2012, BSI-DSZ-CC-0945-V3-2018, BSI-DSZ-CC-1110-2019, BSI-DSZ-CC-0945-2017, BSI-DSZ-CC-1110-V2-2019, BSI-DSZ-CC-0945-V2-2018, BSI-DSZ-CC-0891-V2-2016
heuristics/st_references/directly_referencing {} BSI-DSZ-CC-1110-V2-2019
heuristics/st_references/indirectly_referencing {} BSI-DSZ-CC-1110-V2-2019
heuristics/protection_profiles cf0f01bcd7be3e9c a33327d40f253f46, b380aabf93b29692
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0068_V2b_pdf.pdf, https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0056_V2b_pdf.pdf
pdf_data/cert_filename 1045c_pdf.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
pdf_data/cert_keywords/eval_facility
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename 1045a_pdf.pdf anssi-cc-2019_57fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
    • cc_security_level: EAL 5 augmenté ALC_DVS.2, AVA_VAN.5
    • cc_version: Critères Communs version 3.1 révision 5
    • cert_id: ANSSI-CC-2019/57
    • cert_item: IDmove V4 on Infineon in EAC with PACE configuration with AA in option
    • cert_item_version: OS Commercial Version : 0x 09 08 04 OS Unique Identifier : 0x 3C 1D Conformité a un profil de protection Machine Readable Travel Document with “ICAO Application”, Extended Access Control with PACE, Version 1.3.2 certifié BSI-CC-PP-0056-V2-2012-MA-02 le 5 décembre 2012 Machine Readable Travel Document using Standard Inspection Procedure with PACE, Version 1.01 certifié BSI-CC-PP-0068-V2-2011-MA-01 le 22 juillet 2014
    • cert_lab: Serma Safety & Security 14 rue Galilée, CS 10071, 33608 Pessac Cedex, France
    • developer: IDEMIA Infineon Technologies AG 2 place Samuel de Champlain, AIM CC SM PS - Am Campeon 1-12, 92400 Courbevoie, France 85579 Neubiberg, Allemagne Commanditaire IDEMIA 2 place Samuel de Champlain, 92400 Courbevoie, France
    • match_rules: ["Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Critères d'évaluation et version(.+)Niveau d'évaluation(.+)Développeurs(.+)Centre d'évaluation(.+)Accords de reconnaissance applicables"]
    • ref_protection_profiles:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • DE:
    • BSI-DSZ-CC-1110-V2-2019: 1
  • FR:
    • ANSSI-CC-2019/57: 18
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0056-V2-2012-MA-02: 1
    • BSI-CC-PP-0068-V2-2011-MA-01: 1
    • BSI-PP-0056-V2-2012-MA-02: 1
    • BSI-PP-0068-V2-MA-2011: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL 5: 2
    • EAL2: 2
    • EAL6: 1
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_SPM: 1
    • ADV_TDS: 1
  • AGD:
    • AGD_OPE: 2
    • AGD_PRE: 3
  • ALC:
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 2
    • ALC_FLR: 1
    • ALC_FLR.1: 1
    • ALC_LCD: 1
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
  • ATE:
    • ATE_COV: 1
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Idemia:
    • IDEMIA: 23
  • Infineon:
    • Infineon: 25
    • Infineon Technologies: 1
    • Infineon Technologies AG: 2
  • Oberthur:
    • Oberthur Technologies: 1
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
  • CESTI:
    • CESTI: 1
  • Serma:
    • SERMA: 11
    • Serma Safety & Security: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • AES_competition:
    • AES:
      • AES-128: 1
      • AES-192: 1
      • AES-256: 1
  • DES:
    • DES:
      • DES: 2
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/crypto_protocol
  • PACE:
    • PACE: 30
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • ICAO:
    • ICAO: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
  • /CreationDate: D:20200106135841+01'00'
  • /Creator: PScript5.dll Version 5.2.2
  • /ModDate: D:20200106140705+01'00'
  • /Producer: Acrobat Distiller 11.0 (Windows)
  • /Title:
  • pdf_file_size_bytes: 285061
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 18
pdf_data/st_filename 1045b_pdf.pdf anssi-cible-cc-2019_57en.pdf
pdf_data/st_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1110-V2-2019: 1
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
  • BSI:
    • BSI-CC-PP-0056-V2-: 1
    • BSI-CC-PP-0056-V2-2012-MA-02: 1
    • BSI-CC-PP-0068-V2-2011-MA-01: 1
    • BSI-PP-0002-2001: 1
    • BSI-PP-0056: 1
    • BSI-PP-0084-2014: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
    • EAL5: 7
    • EAL5 augmented: 2
    • EAL6: 1
    • EAL6 augmented: 1
    • EAL6+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 6
    • ADV_FSP.1: 2
    • ADV_FSP.2: 2
    • ADV_FSP.4: 1
    • ADV_FSP.5: 4
    • ADV_IMP.1: 4
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 3
    • ADV_TDS.4: 5
  • AGD:
    • AGD_OPE: 3
    • AGD_OPE.1: 6
    • AGD_PRE: 7
    • AGD_PRE.1: 2
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR.3: 1
    • ALC_LCD.1: 2
    • ALC_SCT: 2
    • ALC_STM: 2
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 3
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 2
    • ATE_DPT.1: 2
    • ATE_DPT.3: 1
    • ATE_FUN.1: 4
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.3: 1
    • AVA_VAN.5: 8
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS: 5
    • FAU_SAS.1: 13
    • FAU_SAS.1.1: 3
  • FCS:
    • FCS_CKM: 53
    • FCS_CKM.1: 21
    • FCS_CKM.2: 2
    • FCS_CKM.4: 46
    • FCS_CKM.4.1: 2
    • FCS_COP: 75
    • FCS_COP.1: 42
    • FCS_RND: 6
    • FCS_RND.1: 16
    • FCS_RND.1.1: 3
  • FDP:
    • FDP_ACC: 32
    • FDP_ACC.1: 19
    • FDP_ACF: 34
    • FDP_ACF.1: 46
    • FDP_ACF.1.2: 1
    • FDP_IFC.1: 6
    • FDP_ITC: 8
    • FDP_ITC.1: 12
    • FDP_ITC.2: 4
    • FDP_RIP.1: 8
    • FDP_RIP.1.1: 2
    • FDP_UCT: 17
    • FDP_UCT.1: 9
    • FDP_UIT: 17
    • FDP_UIT.1: 16
  • FIA:
    • FIA_AFL: 10
    • FIA_AFL.1: 12
    • FIA_API: 17
    • FIA_API.1: 12
    • FIA_API.1.1: 2
    • FIA_SOS.2: 1
    • FIA_UAU: 86
    • FIA_UAU.1: 14
    • FIA_UAU.4: 8
    • FIA_UAU.5: 11
    • FIA_UAU.6: 12
    • FIA_UID: 19
    • FIA_UID.1: 17
  • FMT:
    • FMT_LIM: 6
    • FMT_LIM.1: 17
    • FMT_LIM.1.1: 3
    • FMT_LIM.2: 16
    • FMT_LIM.2.1: 3
    • FMT_MOF: 17
    • FMT_MOF.1: 10
    • FMT_MSA.1: 2
    • FMT_MSA.3: 7
    • FMT_MTD: 119
    • FMT_MTD.1: 67
    • FMT_MTD.3: 6
    • FMT_MTD.3.1: 2
    • FMT_SMF.1: 19
    • FMT_SMF.1.1: 2
    • FMT_SMR: 11
    • FMT_SMR.1: 12
  • FPT:
    • FPT_EMS: 4
    • FPT_EMS.1: 14
    • FPT_EMS.1.1: 4
    • FPT_EMS.1.2: 4
    • FPT_FLS.1: 9
    • FPT_FLS.1.1: 2
    • FPT_PHP.3: 10
    • FPT_PHP.3.1: 2
    • FPT_TST.1: 8
    • FPT_TST.1.1: 2
    • FPT_TST.1.2: 2
    • FPT_TST.1.3: 2
  • FTP:
    • FTP_ITC: 14
    • FTP_ITC.1: 25
    • FTP_TRP.1: 4
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Idemia:
    • IDEMIA: 20
  • Infineon:
    • Infineon: 16
    • Infineon Technologies AG: 1
  • Morpho:
    • Morpho: 1
  • Oberthur:
    • Oberthur Technologies: 1
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 25
  • DES:
    • 3DES:
      • 3DES: 2
      • Triple-DES: 11
    • DES:
      • DES: 21
  • constructions:
    • MAC:
      • CMAC: 5
      • KMAC: 3
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 2
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 2
  • FF:
    • DH:
      • DH: 4
    • DSA:
      • DSA: 1
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 4
    • SHA2:
      • SHA-224: 3
      • SHA-256: 5
      • SHA-384: 3
      • SHA-512: 4
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 4
pdf_data/st_keywords/crypto_protocol
  • PACE:
    • PACE: 169
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CBC:
    • CBC: 11
  • ECB:
    • ECB: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • FI:
    • Malfunction: 7
    • Physical Tampering: 6
    • Physical tampering: 2
    • fault injection: 1
    • malfunction: 6
    • physical tampering: 1
  • SCA:
    • DPA: 2
    • SPA: 1
    • physical probing: 3
    • timing attacks: 1
  • other:
    • reverse engineering: 2
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
pdf_data/st_keywords/ic_data_group
  • EF:
    • EF.COM: 19
    • EF.DG1: 20
    • EF.DG13: 2
    • EF.DG14: 4
    • EF.DG15: 2
    • EF.DG16: 19
    • EF.DG2: 6
    • EF.DG3: 13
    • EF.DG4: 13
    • EF.DG5: 4
    • EF.SOD: 16
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS 180-2: 1
    • FIPS 186-3: 1
    • FIPS 197: 1
    • FIPS 46-3: 1
    • FIPS PUB 197: 1
  • ICAO:
    • ICAO: 15
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 18013: 10
    • ISO/IEC 7816-4: 1
    • ISO/IEC 9797-1: 1
  • PKCS:
    • PKCS#3: 3
  • RFC:
    • RFC3369: 1
  • SCP:
    • SCP02: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: CHOPIN Irina
  • /CreationDate: D:20190718230327+02'00'
  • /Creator: Microsoft® Word 2016
  • /ModDate: D:20190718230327+02'00'
  • /Producer: Microsoft® Word 2016
  • pdf_file_size_bytes: 3588305
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 135
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