Comparing certificates Experimental feature

You are comparing two certificates. By default, only differing attributes are shown. Use the button below to show/hide all attributes.

Showing only differing attributes.
Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
BSI-DSZ-CC-1045-2019
Samsung TEEgris on Exynos 2200 (Version 5.0.0.0) (ANSSI-CC-2023/71)
ANSSI-CC-2023/71
name Qualcomm Secure Processor Unit SPU230 in SDM855 SoC Samsung TEEgris on Exynos 2200 (Version 5.0.0.0) (ANSSI-CC-2023/71)
category Other Devices and Systems Trusted Computing
scheme DE FR
status archived active
not_valid_after 07.05.2024 01.02.2029
not_valid_before 08.05.2019 01.02.2024
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045c_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/Certificat-CC-2023_71fr.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045a_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-CC-2023_71fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/1045b_pdf.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-CC-2023_71en.pdf
manufacturer Qualcomm Technologies Inc. Samsung Electronics Co., Ltd.
manufacturer_web https://www.qualcomm.com https://www.samsung.com
security_level EAL4+, ALC_DVS.2, AVA_VAN.5 EAL2+
dgst 2e8cbf6ce18d4c6f 01cb0a033c2b1c55
heuristics/cert_id BSI-DSZ-CC-1045-2019 ANSSI-CC-2023/71
heuristics/cert_lab BSI []
heuristics/cpe_matches {} cpe:2.3:h:samsung:exynos_2200:-:*:*:*:*:*:*:*
heuristics/extracted_sars ALC_TAT.1, ALC_CMS.4, AVA_VAN.5, ALC_DEL.1, ALC_DVS.2, ALC_LCD.1, ALC_CMC.4 AGD_PRE.1, ALC_CMS.2, ASE_TSS.1, ADV_TDS.1, ASE_INT.1, ASE_SPD.1, ATE_FUN.1, ALC_DEL.1, ALC_CMC.2, ATE_COV.1, AGD_OPE.1, AVA_VAN.2, ASE_OBJ.2, ADV_ARC.1, ASE_CCL.1, ADV_FSP.2, ASE_ECD.1, ASE_REQ.2
heuristics/extracted_versions - 5.0.0.0
heuristics/report_references/directly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/report_references/indirectly_referenced_by BSI-DSZ-CC-1045-V2-2023 {}
heuristics/protection_profiles cf0f01bcd7be3e9c {}
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename 1045c_pdf.pdf Certificat-CC-2023_71fr.pdf
pdf_data/cert_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 1
  • FR:
    • ANSSI-CC-2023/71: 2
    • ANSSI-CC-PP-2014/01-M02: 1
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • ANSSI:
    • ANSSI-CC-PP-2014/01-M02: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
    • EAL 4 augmented: 1
    • EAL 5: 1
  • EAL:
    • EAL2: 2
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/vendor
  • Qualcomm:
    • Qualcomm: 2
  • Samsung:
    • Samsung: 1
pdf_data/cert_keywords/tee_name
  • other:
    • TEE: 1
    • TEEgris: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408: 2
    • ISO/IEC 18045: 2
pdf_data/cert_metadata
  • /Author: Bundesamt für Sicherheit in der Informationstechnik
  • /CreationDate: D:20200129140240+01'00'
  • /Creator: Writer
  • /Keywords: Common Criteria, Certification, Zertifizierung, Qualcomm, SoC, system on chip, SPU230, hardmacro, secure element, secure processor
  • /ModDate: D:20200129140509+01'00'
  • /Producer: LibreOffice 6.2
  • /Subject: Common Criteria Certification
  • /Title: Certificate BSI-DSZ-CC-1045-2019
  • pdf_file_size_bytes: 898760
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /CreationDate: D:20240215120518+01'00'
  • /Creator: Acrobat PDFMaker 23 pour Word
  • /Keywords:
  • /ModDate: D:20240215120555+01'00'
  • /Producer: Adobe PDF Library 23.1.175
  • pdf_file_size_bytes: 154878
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename 1045a_pdf.pdf ANSSI-CC-2023_71fr.pdf
pdf_data/report_frontpage
  • FR:
  • DE:
    • cc_security_level: Common Criteria Part 3 extended EAL 4 augmented by AVA_VAN.5 and ALC_DVS.2
    • cc_version: PP conformant plus product specific extensions Common Criteria Part 2 conformant
    • cert_id: BSI-DSZ-CC-1045-2019
    • cert_item: Qualcomm Secure Processor Unit SPU230 in SDM855 SoC
    • cert_lab: BSI
    • developer: Qualcomm Technologies Inc
    • match_rules: ['(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January 2014, BSI-CC-PP-0084-2014
  • FR:
  • DE:
pdf_data/report_keywords/cc_cert_id
  • DE:
    • BSI-DSZ-CC-1045-2019: 15
  • FR:
    • ANSSI-CC-2023/71: 2
    • ANSSI-CC-PP-2014/01-M02: 2
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-: 1
    • BSI-CC-PP-0084-2014: 3
  • ANSSI:
    • ANSSI-CC-PP-2014/01-M02: 2
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 1: 1
    • EAL 2: 3
    • EAL 4: 5
    • EAL 4 augmented: 3
    • EAL 5: 4
  • EAL:
    • EAL2: 3
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL: 1
    • ALC_DEL.1: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ATE:
    • ATE_FUN: 1
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 1
    • AVA_VAN.5: 4
  • ALC:
    • ALC_FLR: 1
pdf_data/report_keywords/cc_claims
  • O:
    • O.C: 5
  • R:
    • R.O: 5
pdf_data/report_keywords/vendor
  • Qualcomm:
    • Qualcomm: 29
  • Samsung:
    • Samsung: 19
pdf_data/report_keywords/eval_facility
  • TSystems:
    • T-Systems International: 3
  • atsec:
    • atsec: 2
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA1: 2
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • fault injection: 1
  • SCA:
    • Side-channel: 1
    • physical probing: 1
  • other:
    • JIL: 3
pdf_data/report_keywords/technical_report_id
  • BSI:
    • BSI 7148: 1
pdf_data/report_keywords/tee_name
  • ARM:
    • TrustZone: 1
  • other:
    • TEE: 10
    • TEEgris: 12
pdf_data/report_keywords/standard_id
  • BSI:
    • AIS 20: 1
    • AIS 25: 2
    • AIS 26: 3
    • AIS 31: 3
    • AIS 32: 1
    • AIS 34: 1
    • AIS 35: 2
    • AIS 36: 1
    • AIS 37: 1
  • ISO:
    • ISO/IEC 15408: 4
    • ISO/IEC 17065: 2
    • ISO/IEC 18045: 4
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
pdf_data/report_keywords/certification_process
  • ConfidentialDocument:
    • List TOE implementation representation and tools, ALC/SPU_3_1_config_list.txt, April 11th 2019 (confidential document) [11] Guidance documentation for the TOE; Qualcomm SPUI Core, Hana Application Programming: 1
    • Qualcomm SPU230 Core Security Target 80-NU430-5-C; Revision C, April 8th , 2019 (confidential document) [7] Evaluation Technical Report, Version 1.2, May 06th 2019, Evaluation Technical Report - Summary: 1
    • T-Systems International GmbH (confidential document) [8] Security IC Platform Protection Profile with Augmentation Packages Version 1.0, 13 January: 1
    • being maintained, is not given any longer. In particular, prior to the dissemination of confidential documentation and information related to the TOE or resulting from the evaluation and certification: 1
pdf_data/report_metadata
pdf_data/st_filename 1045b_pdf.pdf ANSSI-cible-CC-2023_71en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 3
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 1
    • EAL4 augmented: 1
  • EAL:
    • EAL 2: 6
    • EAL 2 augmented: 2
    • EAL 2+: 1
pdf_data/st_keywords/cc_sar
  • ALC:
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
  • ADV:
    • ADV_ARC.1: 7
    • ADV_FSP.1: 3
    • ADV_FSP.2: 15
    • ADV_TDS.1: 10
  • AGD:
    • AGD_OPE.1: 10
    • AGD_PRE.1: 9
  • ALC:
    • ALC_CMC.2: 1
    • ALC_CMS.1: 1
    • ALC_CMS.2: 1
    • ALC_DEL.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 4
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 5
    • ATE_FUN.1: 4
  • AVA:
    • AVA_VAN.2: 7
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN: 1
    • FAU_SAS.1: 4
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 30
    • FCS_CKM.1: 7
    • FCS_CKM.2: 2
    • FCS_CKM.4: 7
    • FCS_COP: 17
    • FCS_COP.1: 5
    • FCS_ITC.1: 5
    • FCS_ITC.2: 5
    • FCS_RNG.1: 3
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC: 4
    • FDP_ACC.1: 2
    • FDP_ACC.2: 3
    • FDP_ACC.2.1: 1
    • FDP_ACC.2.2: 1
    • FDP_ACF: 3
    • FDP_ACF.1: 4
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ICT.1: 1
    • FDP_IFC.1: 5
    • FDP_IFC.1.1: 2
    • FDP_IFF.1: 1
    • FDP_ITC.1: 8
    • FDP_ITC.1.1: 1
    • FDP_ITC.1.2: 1
    • FDP_ITC.1.3: 1
    • FDP_ITT.1: 3
    • FDP_ITT.1.1: 1
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_SDA: 7
    • FDP_SDA.1: 8
    • FDP_SDA.1.1: 2
    • FDP_SDC.1: 11
    • FDP_SDC.1.1: 2
    • FDP_SDI: 2
    • FDP_SDI.2: 18
    • FDP_SDI.2.1: 3
    • FDP_SDI.2.2: 3
    • FDP_SDR: 7
    • FDP_SDR.1: 8
    • FDP_SDR.1.1: 2
  • FMT:
    • FMT_CMT: 2
    • FMT_CMT.1: 35
    • FMT_CMT.1.1: 7
    • FMT_LIM.1: 5
    • FMT_LIM.1.1: 1
    • FMT_LIM.2: 5
    • FMT_LIM.2.1: 1
    • FMT_MSA: 5
    • FMT_MSA.1: 2
    • FMT_MSA.3: 5
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_SMR.1: 1
  • FPT:
    • FPT_FLS.1: 5
    • FPT_FLS.1.1: 1
    • FPT_ITT.1: 3
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 3
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 4
    • FRU_FLT.2.1: 1
  • FAU:
    • FAU_ARP.1: 12
    • FAU_ARP.1.1: 1
    • FAU_GEN.1: 4
    • FAU_SAA.1: 2
    • FAU_SAR.1: 5
    • FAU_SAR.1.1: 1
    • FAU_SAR.1.2: 1
    • FAU_STG.1: 5
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
  • FCS:
    • FCS_CKM: 48
    • FCS_CKM.1: 17
    • FCS_CKM.2: 2
    • FCS_CKM.4: 23
    • FCS_COP: 68
    • FCS_COP.1: 14
    • FCS_RNG: 3
    • FCS_RNG.1: 10
    • FCS_RNG.1.1: 2
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC: 40
    • FDP_ACC.1: 15
    • FDP_ACF: 35
    • FDP_ACF.1: 21
    • FDP_IFC: 13
    • FDP_IFC.1: 8
    • FDP_IFC.2: 2
    • FDP_IFF: 11
    • FDP_IFF.1: 8
    • FDP_ITC.1: 15
    • FDP_ITC.2: 15
    • FDP_ITT: 11
    • FDP_ITT.1: 4
    • FDP_RIP: 10
    • FDP_RIP.1: 2
    • FDP_ROL: 7
    • FDP_ROL.1: 2
    • FDP_SDI: 6
    • FDP_SDI.2: 15
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_TRP: 1
  • FIA:
    • FIA_ATD: 7
    • FIA_ATD.1: 10
    • FIA_ATD.1.1: 1
    • FIA_UAU: 12
    • FIA_UAU.2: 1
    • FIA_UAU.6: 2
    • FIA_UID: 8
    • FIA_UID.1: 3
    • FIA_UID.2: 8
    • FIA_UID.2.1: 1
    • FIA_USB: 6
    • FIA_USB.1: 9
    • FIA_USB.1.1: 1
    • FIA_USB.1.2: 1
    • FIA_USB.1.3: 1
  • FMT:
    • FMT_MSA: 55
    • FMT_MSA.1: 7
    • FMT_MSA.2: 1
    • FMT_MSA.3: 15
    • FMT_MTD: 5
    • FMT_MTD.1: 1
    • FMT_SMF: 5
    • FMT_SMF.1: 21
    • FMT_SMF.1.1: 1
    • FMT_SMR: 6
    • FMT_SMR.1: 24
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPT:
    • FPT_FLS: 12
    • FPT_FLS.1: 18
    • FPT_FLS.1.1: 1
    • FPT_INI: 4
    • FPT_INI.1: 14
    • FPT_INI.1.1: 2
    • FPT_INI.1.2: 2
    • FPT_INI.1.3: 2
    • FPT_INI.1.4: 1
    • FPT_ITT: 6
    • FPT_ITT.1: 2
    • FPT_STM: 10
    • FPT_STM.1: 2
    • FPT_TEE.1: 6
    • FPT_TEE.1.1: 1
    • FPT_TEE.1.2: 1
  • FTP:
    • FTP_TPR: 1
    • FTP_TRP: 7
    • FTP_TRP.1: 3
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 3
    • O.KDF: 5
    • O.RND: 1
    • O.SHA: 4
  • T:
    • T.AUTH-APPLI-DATA: 3
    • T.AUTH-TSF-DATA: 3
    • T.CONFID-APPLI-DATA: 5
    • T.CONFID-TSF-CODE: 3
    • T.CONFID-TSF-DATA: 4
    • T.INTEG-: 1
    • T.INTEG-APPLI-CODE: 3
    • T.INTEG-APPLI-DATA: 5
    • T.INTEG-TSF-CODE: 3
    • T.INTEG-TSF-DATA: 3
    • T.RBP-APPLI-DATA: 3
    • T.RBP-TSF-DATA: 3
    • T.RND: 1
  • A:
    • A.NO_RESIDUAL_DATA: 3
    • A.PROTECTION_AFTER_: 1
    • A.PROTECTION_AFTER_DELIVERY: 2
    • A.ROLLBACK: 1
    • A.TA_DEVELOPMENT: 4
    • A.TA_DEVELOPMENT_TUI: 3
    • A.TA_MANAGEMENT: 5
  • O:
    • O.CAPTURE: 2
    • O.CA_TA_IDENTIFICATION: 11
    • O.DATA_ACCESS: 11
    • O.DEBUG: 12
    • O.FUNCTION_ACCESS: 4
    • O.INITIALISATION: 10
    • O.INITIALIZATION: 1
    • O.INSTANCE_TIME: 11
    • O.KEYS_USAGE: 4
    • O.OPERATION: 8
    • O.PERIPHERAL_INITIALISATION: 3
    • O.PREVENT_RESIDUAL_DATA: 3
    • O.PROTECTED_COMMUNICATION_CHANNEL: 12
    • O.RNG: 12
    • O.ROLLBACK_PROTECTION: 5
    • O.RUNTIME_CONFIDENTIALITY: 10
    • O.RUNTIME_INTEGRITY: 21
    • O.SAFE_RELEASE: 11
    • O.TA_AUTHENTICITY: 7
    • O.TA_ISOLATION: 15
    • O.TA_PERSISTENT_TIME: 12
    • O.TEE_DATA_PROTECTION: 11
    • O.TEE_ID: 11
    • O.TEE_ISOLATION: 14
    • O.TRUSTED_STORAGE: 9
  • OE:
    • OE.DISABLED_DEBUG: 1
    • OE.INTEGRATION_CONFIGURATION: 7
    • OE.NO_RESIDUAL_DATA: 2
    • OE.PROTECTION_AFTER_DELIVERY: 7
    • OE.ROLLBACK: 1
    • OE.SECRETS: 2
    • OE.TA_DEVELOPMENT: 6
    • OE.TA_DEVELOPMENT_TUI: 5
    • OE.TA_MANAGEMENT: 3
  • OP:
    • OP.ACTIVATE: 1
    • OP.AUTHENTICATE: 2
    • OP.DEBUG: 7
    • OP.EXTRACT_KEY: 4
    • OP.LOAD: 3
    • OP.STORE: 4
    • OP.USE_KEY: 4
  • OSP:
    • OSP.INTEGRATION_: 1
    • OSP.INTEGRATION_CONFIGURATION: 2
    • OSP.SECRETS: 3
  • T:
    • T.ABUSE_DEBUG: 3
    • T.ABUSE_FUNCT: 3
    • T.CLONE: 3
    • T.CORRUPT_RUNTIME_: 1
    • T.CORRUPT_RUNTIME_DATA: 2
    • T.CORRUPT_SETUP: 5
    • T.EXTRACT_DATA: 3
    • T.EXTRACT_EXCHANGED_: 1
    • T.EXTRACT_EXCHANGED_DATA: 2
    • T.FLASH_DUMP: 3
    • T.IMPERSONATION: 3
    • T.INJECT_DATA: 3
    • T.INJECT_EXCHANGED_: 1
    • T.INJECT_EXCHANGED_DATA: 2
    • T.MODIFY_DATA: 3
    • T.MODIFY_EXCHANGED_: 1
    • T.MODIFY_EXCHANGED_DATA: 2
    • T.MODIFY_FIRMWARE: 3
    • T.PERIPHERAL_ACCESS: 3
    • T.PERTURBATION: 3
    • T.RAM: 3
    • T.RESIDUAL: 3
    • T.RNG: 3
    • T.ROGUE_CODE_: 1
    • T.ROGUE_CODE_EXECUTION: 2
    • T.ROLLBACK: 3
    • T.SHARED_FUNCTION_: 1
    • T.SHARED_FUNCTION_ACCESS: 2
    • T.SPY: 3
    • T.STORAGE_CORRUPTION: 3
    • T.TA_PERSISTENT_TIME_: 1
    • T.TA_PERSISTENT_TIME_ROLLBACK: 2
    • T.TEE_FIRMWARE_: 1
    • T.TEE_FIRMWARE_DOWNGRADE: 2
pdf_data/st_keywords/vendor
  • Qualcomm:
    • Qualcomm: 19
  • Samsung:
    • Samsung: 140
  • Thales:
    • Thales: 7
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 34
      • AES-256: 2
  • constructions:
    • MAC:
      • CMAC: 17
      • HMAC: 3
  • AES_competition:
    • AES:
      • AES: 11
  • DES:
    • 3DES:
      • 3DES: 7
    • DES:
      • DES: 7
  • constructions:
    • MAC:
      • CMAC: 3
      • HMAC: 5
      • HMAC-SHA-224: 1
      • HMAC-SHA-384: 1
      • HMAC-SHA-512: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECDH:
      • ECDH: 5
    • ECDSA:
      • ECDSA: 13
    • EdDSA:
      • EdDSA: 1
  • FF:
    • DH:
      • DH: 5
      • Diffie-Hellman: 2
    • DSA:
      • DSA: 4
pdf_data/st_keywords/hash_function
  • SHA:
    • SHA1:
      • SHA-1: 5
      • SHA1: 1
    • SHA2:
      • SHA-256: 10
      • SHA-384: 3
      • SHA-512: 4
  • SHA:
    • SHA1:
      • SHA-1: 1
      • SHA1: 1
    • SHA2:
      • SHA-224: 1
      • SHA-256: 2
      • SHA-384: 1
      • SHA-512: 1
      • SHA224: 1
      • SHA256: 2
      • SHA384: 1
      • SHA512: 1
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 1
  • KA:
    • Key Agreement: 1
  • MAC:
    • MAC: 2
pdf_data/st_keywords/crypto_protocol
  • IPsec:
    • IPsec: 2
  • TLS:
    • SSL:
      • SSL: 1
    • TLS:
      • TLS: 1
  • VPN:
    • VPN: 2
pdf_data/st_keywords/randomness
  • PRNG:
    • DRBG: 1
  • RNG:
    • RND: 2
    • RNG: 12
  • PRNG:
    • DRBG: 5
  • RNG:
    • RNG: 29
  • TRNG:
    • TRNG: 5
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
  • CCM:
    • CCM: 4
  • CTR:
    • CTR: 2
  • ECB:
    • ECB: 2
  • CTR:
    • CTR: 1
  • ECB:
    • ECB: 1
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 3
    • fault injection: 2
    • malfunction: 3
  • SCA:
    • Leak-Inherent: 3
    • Physical Probing: 2
    • Side-channel: 1
    • physical probing: 4
    • side channels: 1
    • side-channel: 2
  • other:
    • cold boot: 4
  • SCA:
    • side-channels: 1
  • other:
    • cold boot: 1
pdf_data/st_keywords/tee_name
  • ARM:
    • ARM TrustZone: 1
  • ARM:
    • TrustZone: 2
  • IBM:
    • SE: 2
  • other:
    • TEE: 594
    • TEEgris: 126
pdf_data/st_keywords/standard_id
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
  • FIPS:
    • FIPS 180-4: 3
    • FIPS 186-4: 1
    • FIPS 197: 5
    • FIPS 198-1: 2
    • FIPS PUB 180-4: 3
    • FIPS PUB 186-4: 1
    • FIPS PUB 197: 3
    • FIPS PUB 198-1: 2
  • NIST:
    • NIST SP 800-108: 3
    • NIST SP 800-38A: 2
    • NIST SP 800-38B: 2
    • NIST SP 800-38C: 1
    • NIST SP 800-90A: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC3447: 1
  • FIPS:
    • FIPS 140-2: 1
    • FIPS 180-4: 1
    • FIPS 186-2: 1
    • FIPS 186-4: 2
    • FIPS 197: 1
    • FIPS 46-3: 1
    • FIPS 81: 1
  • PKCS:
    • PKCS#1: 1
  • RFC:
    • RFC 1423: 1
    • RFC 2119: 3
    • RFC 2202: 1
    • RFC 4231: 1
    • RFC 7748: 1
    • RFC 8032: 1
pdf_data/st_keywords/javacard_api_const
  • curves:
    • ED25519: 4
    • X25519: 4
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • and this assumption applies only for Phase 7 - End usage. Note that the operational environment is out of scope of the evaluation. A.TA_MANAGEMENT A well-defined TA identification and TA signature policy exist: 1
    • out of scope: 1
pdf_data/st_metadata
  • /Author: QTI
  • /CreationDate: D:20190503125434-07'00'
  • /Creator: Microsoft® Word for Office 365
  • /Keywords: integrated secure element, PP0084, Qualcomm, secure processing unit, secure subsystem, SDM855, SoC, SPU230
  • /ModDate: D:20190503125649-07'00'
  • /Producer: Microsoft® Word for Office 365
  • /Subject: 80-NU430-6 Rev. B
  • /Title: Qualcomm® Secure Processing Unit SPU230 Core Security Target Lite
  • pdf_file_size_bytes: 723737
  • pdf_hyperlinks: https://createpoint.qti.qualcomm.com/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 54
  • /Author: rosep
  • /CreationDate: D:20240108141421+01'00'
  • /ModDate: D:20240108141421+01'00'
  • /Producer: Microsoft: Print To PDF
  • /Title: Microsoft Word - Samsung_TEEgris_5.0_Security_Target_v2.10_20230809_clean.docx
  • pdf_file_size_bytes: 1813549
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 98
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different