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NXP MF2DL(H)x0, MF2ID(H)10, NT4H2x21Gf and NT4H2x21Tf, Version 01.1
NSCIB-CC-2300128-01-CR 		Winbond SpiFlash TrustME Secure Flash Memory W75F32WWJB\W75F32WWJC version A
2018-19-INF-3292
name NXP MF2DL(H)x0, MF2ID(H)10, NT4H2x21Gf and NT4H2x21Tf, Version 01.1 Winbond SpiFlash TrustME Secure Flash Memory W75F32WWJB\W75F32WWJC version A
scheme NL ES
not_valid_after 27.12.2028 05.11.2025
not_valid_before 27.12.2023 05.11.2020
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2300128-01-CERT.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2018-19%20CCRA.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2300128-01-CR%20.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2018-19%20INF-3292.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/NSCIB-CC-2300128-01-ST%20lite.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/2018-19%20ST_lite.pdf
manufacturer NXP Semiconductors Germany GmbH Winbond Electonics Corporation
manufacturer_web https://www.nxp.com https://www.winbond.com/
security_level EAL4 EAL5+, ALC_DVS.2, AVA_VAN.5
dgst 2b64c5fbc41dddeb 457c233b22eb68ce
heuristics/cert_id NSCIB-CC-2300128-01-CR 2018-19-INF-3292
heuristics/cert_lab []
heuristics/extracted_sars ASE_INT.1, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ALC_TAT.1, ASE_SPD.1, ALC_DEL.1, ALC_LCD.1, AGD_OPE.1, AVA_VAN.3, AGD_PRE.1, ALC_CMS.4, ATE_FUN.1, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.3, ATE_DPT.1, ASE_REQ.2, ALC_DVS.1, ADV_FSP.4, ATE_IND.2, ASE_CCL.1 ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_TDS.4, ALC_TAT.2, ASE_REQ.2, ASE_CCL.1
heuristics/extracted_versions 01.1 -
heuristics/scheme_data
  • category: Smart Cards and similiar devices
  • certification_date: 05.11.2020
  • enhanced:
    • category: Smart Cards and similiar devices
    • cc_version: Common Criteria 3.1 release 5
    • cert_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1039
    • certification_date: 05.11.2020
    • description: The TOE is a Memory Flash IC designed to be embedded into highly critical hardware devices such as smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure applications such as financial, telecommunication, identity (e-Government), etc. and they will be working in a hostile environment. In particular, the TOE main function is the secure storage of the code and data of critical applications. The security needs for the TOE consist in: Maintaining the integrity of the content of the memories and the confidentiality of the content of protected memory areas as required by the critical HW products (e.g. Security IC) the Memory Flash is built for. Providing a secure communication with the Host device that will embed the TOE in a secure HW product such as Security IC.
    • evaluation_facility: Applus Laboratories
    • level: EAL5 + ALC_DVS.2 + AVA_VAN.5
    • manufacturer: Winbond Electronics Corporation
    • report_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1040
    • status: Certified
    • target_link: https://oc.ccn.cni.es/en/component/djcatalog2/?format=raw&task=download&fid=1038
    • type: Product
  • manufacturer: Winbond Electronics Corporation
  • product: Winbond SpiFlash TrustME Secure Flash Memory W75F32WWJB\W75F32WWJC version A
  • product_link: https://oc.ccn.cni.es/en/certified-products/certified-products/618-winbond-spiflash-trustme-secure-flash-memory-w75f32wwjb-w75f32wwjc-version-a
pdf_data/cert_filename NSCIB-CC-2300128-01-CERT.pdf 2018-19 CCRA.pdf
pdf_data/cert_keywords/cc_cert_id
  • NL:
    • CC-19-175197: 1
    • NSCIB-2300128-01: 1
    • NSCIB-CC-2300128-01: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL2: 1
    • EAL4: 2
  • EAL:
    • EAL5: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR.3: 1
  • ALC:
    • ALC_DVS.2: 1
  • AVA:
    • AVA_VAN.5: 1
pdf_data/cert_keywords/cc_claims
  • O:
    • O.E: 1
  • T:
    • T.I: 1
pdf_data/cert_keywords/vendor
  • NXP:
    • NXP Semiconductors: 1
pdf_data/cert_keywords/eval_facility
  • Riscure:
    • Riscure: 1
  • Applus:
    • Applus Laboratories: 1
pdf_data/cert_keywords/standard_id
  • ISO:
    • ISO/IEC 15408-1: 2
    • ISO/IEC 18045: 4
    • ISO/IEC 18045:2008: 1
pdf_data/cert_metadata
  • /Author: JM2
  • /CreationDate: D:20240109181337+00'00'
  • /Creator: Microsoft® Word 2021
  • /ModDate: D:20240109181337+00'00'
  • /Producer: Microsoft® Word 2021
  • /Title: NSCIB Certificate
  • pdf_file_size_bytes: 92264
  • pdf_hyperlinks: https://www.tuv-nederland.nl/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
  • /Author:
  • /CreationDate:
  • /Creator:
  • /Keywords:
  • /ModDate:
  • /Producer:
  • /Subject:
  • /Title:
  • /Trapped:
  • pdf_file_size_bytes: 753211
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 2
pdf_data/report_filename NSCIB-CC-2300128-01-CR .pdf 2018-19 INF-3292.pdf
pdf_data/report_frontpage
  • NL:
    • cert_id: NSCIB-CC-2300128-01-CR
    • cert_item: MF2DL(H)x0, MF2ID(H)10, NT4H2x21Gf and NT4H2x21Tf, Version 01.1
    • cert_lab: Riscure B.V.
    • developer: NXP Semiconductors Germany GmbH
  • NL:
pdf_data/report_keywords/cc_cert_id
  • NL:
    • CC-19-175197: 1
    • NSCIB-2300128-01: 1
    • NSCIB-CC-2300128-01-CR: 11
  • ES:
    • 2018-19-INF-3292-v1: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 4: 1
    • EAL4: 3
  • EAL:
    • EAL 1: 1
    • EAL 2: 1
    • EAL 4: 2
    • EAL2: 1
    • EAL5: 8
  • ITSEC:
    • ITSEC Evaluation: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_IMP.1: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 8
    • ALC_FLR: 3
    • ALC_LCD.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_INT.1: 1
    • ASE_REQ.2: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_FUN.1: 1
  • AVA:
    • AVA_VAN.5: 9
pdf_data/report_keywords/cc_sfr
  • FDP:
    • FDP_IFC.1: 1
    • FDP_RIP.1: 1
    • FDP_SDI.2: 1
    • FDP_UIT.1: 1
  • FMT:
    • FMT_LIM.1: 1
  • FPT:
    • FPT_FLS: 2
    • FPT_ITT.1: 1
    • FPT_TRP.1: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP Semiconductors: 3
pdf_data/report_keywords/eval_facility
  • Riscure:
    • Riscure: 3
  • Applus:
    • Applus Laboratories: 5
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 3
pdf_data/report_keywords/side_channel_analysis
  • SCA:
    • side-channel: 1
  • other:
    • JHAS: 1
    • JIL: 1
  • FI:
    • fault injection: 2
  • other:
    • JIL: 1
pdf_data/report_metadata
  • /Author: 9308
  • /CreationDate: D:20201104180200+01'00'
  • /Creator: Microsoft® Word 2016
  • /ModDate: D:20201104180200+01'00'
  • /Producer: Microsoft® Word 2016
  • pdf_file_size_bytes: 1131696
  • pdf_hyperlinks: https://www.sogis.org/, http://www.commoncriteriaportal.org/
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 14
pdf_data/st_filename NSCIB-CC-2300128-01-ST lite.pdf 2018-19 ST_lite.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP-0084: 1
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL4: 5
  • EAL:
    • EAL5: 6
    • EAL5 augmented: 2
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.4: 1
    • ADV_IMP.1: 1
    • ADV_TDS.3: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.4: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 1
    • ALC_LCD.1: 1
    • ALC_TAT.1: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.1: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.3: 2
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 6
    • ADV_FSP.1: 3
    • ADV_FSP.2: 3
    • ADV_FSP.4: 1
    • ADV_FSP.5: 8
    • ADV_IMP.1: 9
    • ADV_INT.2: 1
    • ADV_TDS.1: 2
    • ADV_TDS.3: 4
    • ADV_TDS.4: 8
  • AGD:
    • AGD_OPE.1: 6
    • AGD_PRE.1: 6
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.1: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.1: 2
    • ALC_DVS.2: 9
    • ALC_LCD.1: 3
    • ALC_TAT.1: 2
    • ALC_TAT.2: 3
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 4
    • ASE_INT.1: 5
    • ASE_OBJ.2: 3
    • ASE_REQ.1: 2
    • ASE_REQ.2: 2
    • ASE_SPD.1: 2
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.1: 2
    • ATE_COV.2: 3
    • ATE_DPT.1: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 6
  • AVA:
    • AVA_VAN.5: 10
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_GEN.1: 8
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
    • FAU_STG.1: 8
    • FAU_STG.1.1: 1
    • FAU_STG.1.2: 1
    • FAU_STG.2: 7
    • FAU_STG.2.1: 1
    • FAU_STG.2.2: 1
    • FAU_STG.2.3: 1
  • FCS:
    • FCS_CKM.1: 6
    • FCS_CKM.4: 15
    • FCS_CKM.4.1: 1
    • FCS_COP.1: 21
    • FCS_COP.1.1: 2
    • FCS_RNG.1: 8
    • FCS_RNG.1.1: 3
    • FCS_RNG.1.2: 2
  • FDP:
    • FDP_ACC.1: 18
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 8
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_ETC: 5
    • FDP_ETC.1: 1
    • FDP_ETC.2: 1
    • FDP_ETC.3: 15
    • FDP_ETC.3.1: 2
    • FDP_ETC.3.2: 2
    • FDP_ETC.3.3: 2
    • FDP_IFC.1: 16
    • FDP_IFF.1: 2
    • FDP_ITC.1: 6
    • FDP_ITC.2: 14
    • FDP_ITC.2.1: 1
    • FDP_ITC.2.2: 1
    • FDP_ITC.2.3: 1
    • FDP_ITC.2.4: 1
    • FDP_ITC.2.5: 1
    • FDP_ITT.1: 7
    • FDP_ROL.1: 5
    • FDP_ROL.1.1: 1
    • FDP_ROL.1.2: 1
    • FDP_SDC.1: 5
    • FDP_SDC.1.1: 2
    • FDP_SDI.1: 1
    • FDP_SDI.2: 4
    • FDP_SDI.2.1: 2
    • FDP_SDI.2.2: 2
  • FIA:
    • FIA_UAU.1: 1
    • FIA_UAU.2: 5
    • FIA_UAU.2.1: 1
    • FIA_UAU.5: 6
    • FIA_UAU.5.1: 1
    • FIA_UAU.5.2: 1
    • FIA_UID.1: 5
    • FIA_UID.2: 7
    • FIA_UID.2.1: 1
  • FMT:
    • FMT_LIM.1: 5
    • FMT_LIM.2: 5
    • FMT_MSA.1: 8
    • FMT_MSA.1.1: 1
    • FMT_MSA.3: 8
    • FMT_MSA.3.1: 1
    • FMT_MSA.3.2: 1
    • FMT_MTD.1: 5
    • FMT_MTD.1.1: 1
    • FMT_SMF.1: 13
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 14
    • FMT_SMR.1.1: 1
    • FMT_SMR.1.2: 1
  • FPR:
    • FPR_UNL.1: 5
    • FPR_UNL.1.1: 1
  • FPT:
    • FPT_FLS.1: 7
    • FPT_ITT.1: 3
    • FPT_PHP.3: 7
    • FPT_RPL.1: 7
    • FPT_RPL.1.1: 1
    • FPT_RPL.1.2: 1
    • FPT_TDC.1: 8
    • FPT_TDC.1.1: 1
    • FPT_TDC.1.2: 1
  • FRU:
    • FRU_FLT.2: 6
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 12
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 4
  • FDP:
    • FDP_ACC.1: 3
    • FDP_ACF: 1
    • FDP_IFC.1: 27
    • FDP_IFC.1.1: 1
    • FDP_IFF.1: 4
    • FDP_ITT.1: 13
    • FDP_ITT.1.1: 1
    • FDP_RIP.1: 9
    • FDP_RIP.1.1: 1
    • FDP_SDC: 4
    • FDP_SDC.1: 16
    • FDP_SDC.1.1: 2
    • FDP_SDI: 1
    • FDP_SDI.2: 11
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
    • FDP_UCT.1: 8
    • FDP_UCT.1.1: 1
    • FDP_UIT.1: 8
    • FDP_UIT.1.1: 1
    • FDP_UIT.1.2: 1
  • FMT:
    • FMT_LIM: 5
    • FMT_LIM.1: 22
    • FMT_LIM.1.1: 2
    • FMT_LIM.2: 20
    • FMT_LIM.2.1: 2
  • FPT:
    • FPT_FLS: 22
    • FPT_FLS.1: 3
    • FPT_ITT.1: 12
    • FPT_ITT.1.1: 1
    • FPT_PHP.3: 14
    • FPT_PHP.3.1: 1
  • FRU:
    • FRU_FLT.2: 12
    • FRU_FLT.2.1: 1
  • FTP:
    • FTP_ITC.1: 2
    • FTP_TRP.1: 11
    • FTP_TRP.1.1: 1
    • FTP_TRP.1.2: 1
    • FTP_TRP.1.3: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.MAC: 7
    • O.RND: 3
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 23
    • NXP Semiconductors: 18
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 25
      • AES128: 1
  • constructions:
    • MAC:
      • CMAC: 6
pdf_data/st_keywords/crypto_scheme
  • MAC:
    • MAC: 35
  • MAC:
    • MAC: 2
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 11
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 2
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 6
    • fault injection: 1
    • malfunction: 2
  • SCA:
    • DPA: 1
    • Leak-Inherent: 6
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 2
    • side-channels: 1
  • other:
    • reverse engineering: 1
  • FI:
    • Fault Injection: 1
    • Malfunction: 20
    • fault injection: 2
    • malfunction: 3
    • physical tampering: 3
  • SCA:
    • Leak-Inherent: 18
    • Physical Probing: 2
    • physical probing: 5
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS20: 2
    • AIS31: 3
  • CC:
    • CCMB-2017-04-001: 2
    • CCMB-2017-04-002: 2
    • CCMB-2017-04-003: 2
    • CCMB-2017-04-004: 2
  • FIPS:
    • FIPS PUB 197: 2
  • CC:
    • CCMB-2017-04-001: 1
    • CCMB-2017-04-002: 1
    • CCMB-2017-04-003: 1
    • CCMB-2017-04-004: 1
  • ISO:
    • ISO/IEC 7816-3: 1
pdf_data/st_metadata
state/cert/convert_garbage False True
state/cert/pdf_hash Different Different
state/cert/txt_hash Different Different
state/report/pdf_hash Different Different
state/report/txt_hash Different Different
state/st/pdf_hash Different Different
state/st/txt_hash Different Different