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FM1280 V05
SERTIT-109 		P73N2M0B0.200
ANSSI-CC-2018/08
name FM1280 V05 P73N2M0B0.200
scheme NO FR
not_valid_after 02.07.2023 16.02.2023
not_valid_before 02.07.2018 16.02.2018
cert_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20C%20v%202.0.pdf
report_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/SERTIT-109%20Certification%20Report%20Fudan%20EAL5plus%20v2.0_rev.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/anssi-cc-2018_08fr.pdf
st_link https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/FM1280%20EAL5plus%20ST%20lite%20v2.0.pdf https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/ANSSI-cible-2018_08en.pdf
manufacturer Shanghai Fudan Microelectronics Group Co., Ltd. NXP Semiconductors
manufacturer_web https://eng.fmsh.com https://www.nxp.com/
security_level ALC_DVS.2, EAL5+, AVA_VAN.5 ADV_IMP.2, ALC_FLR.1, ALC_CMC.5, EAL5+, AVA_VAN.5, ATE_COV.3, ALC_TAT.3, ASE_TSS.2, ATE_FUN.2, ADV_TDS.5, ADV_INT.3, ALC_DVS.2
dgst 29eab60d2793d1a1 308fc228c8cdeea7
heuristics/cert_id SERTIT-109 ANSSI-CC-2018/08
heuristics/cert_lab [] SERMA
heuristics/extracted_sars ASE_INT.1, ALC_DVS.2, ALC_CMC.4, ASE_ECD.1, ADV_IMP.1, ATE_COV.2, ASE_TSS.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ADV_FSP.5, AGD_OPE.1, ADV_INT.2, AGD_PRE.1, ATE_FUN.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ALC_TAT.2, ADV_TDS.4, ASE_REQ.2, ATE_IND.2, ASE_CCL.1 ASE_INT.1, ALC_DVS.2, ADV_TDS.5, ASE_ECD.1, ALC_FLR.1, ASE_SPD.1, ALC_CMS.5, AVA_VAN.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.3, ATE_FUN.2, ADV_FSP.5, AGD_OPE.1, AGD_PRE.1, ATE_DPT.3, ADV_ARC.1, ASE_OBJ.2, ADV_IMP.2, ADV_CMC.5, ALC_CMC.5, ASE_TSS.2, ASE_REQ.2, ADV_INT.3, ALC_COV.3, ATE_IND.2, ASE_CCL.1, ATE_COV.3
heuristics/extracted_versions - 0.200
heuristics/report_references/directly_referenced_by {} ANSSI-CC-2018/60, ANSSI-CC-2018/52, ANSSI-CC-2018/19, NSCIB-CC-111441-CR
heuristics/report_references/indirectly_referenced_by {} NSCIB-CC-235750-CR, NSCIB-CC-2300149-01-CR, ANSSI-CC-2018/60, ANSSI-CC-2018/52, NSCIB-CC-111441-CR, ANSSI-CC-2018/55, ANSSI-CC-2018/19, ANSSI-CC-2019/62
heuristics/scheme_data
  • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
  • certification_date: 02.07.2018
  • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
  • enhanced:
    • category: ICs, Smart Cards and Smart Card-Related Devices and Systems
    • cert_id: SERTIT-109
    • certification_date: 02.07.2018
    • description: The TOE is a Dual Interface Smart Card Chip with IC Dedicated Software. It provides TDES, RSA, AES, ECC,True Random Number Generator and other security features. It can be widely and easily applied in various security fields such as banking and financial market, social security card, transport card, small-amount payment and security identification, etc. The TOE supports the following communication interfaces: - ISO/IEC 14443 TYPE A contactless interface - ISO/IEC 7816 contact interface - GPIO - SPI - I2C - UART
    • developer: Shanghai Fudan Microelectronics Group Co., Ltd.
    • documents: frozendict({'cert': [frozendict({'href': 'https://sertit.no/getfile.php/135331-1607953855/SERTIT/Sertifikater/2018/109/SERTIT-109%20C%20v%202.0.pdf'})], 'target': [frozendict({'href': 'https://sertit.no/getfile.php/135325-1607953847/SERTIT/Sertifikater/2018/109/FM1280%20EAL5%2B%20ST%20lite.pdf'})], 'report': [frozendict({'href': 'https://sertit.no/getfile.php/135328-1607953852/SERTIT/Sertifikater/2018/109/SERTIT-109%20Certification%20Report%20Fudan%20EAL5%2B%20v2.0_rev.pdf'})], 'maintenance': [frozendict({'href': 'https://sertit.no/getfile.php/135322-1607953843/SERTIT/Sertifikater/2018/109/SERTIT-109%20MR%20Maintenance%20Report%20v1.0-.pdf'})]})
    • evaluation_facility: Brightsight B.V.
    • expiration_date: 02.07.2023
    • level: EAL 5, ALC_DVS.2, ATE_DPT.2, AVA_VAN.5
    • mutual_recognition: CCRA, SOG-IS
    • product: V05
    • protection_profile: Security IC Platform Protection Profile with Augmentation Packages Version 1.0, BSI-CC-PP-0084-2014
    • sponsor: Shanghai Fudan Microelectronics Group Co., Ltd.
  • product: FM1280
  • url: https://sertit.no/certified-products/product-archive/fm1280
heuristics/st_references/directly_referenced_by {} NSCIB-CC-111441-CR
heuristics/st_references/indirectly_referenced_by {} NSCIB-CC-111441-CR
heuristics/protection_profiles cf0f01bcd7be3e9c {}
maintenance_updates
protection_profile_links https://www.commoncriteriaportal.org/nfs/ccpfiles/files/ppfiles/pp0084b_pdf.pdf {}
pdf_data/cert_filename SERTIT-109 C v 2.0.pdf
pdf_data/cert_keywords/cc_cert_id
  • NO:
    • SERTIT-109: 2
pdf_data/cert_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 1
pdf_data/cert_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 4: 1
pdf_data/cert_keywords/cc_sar
  • ALC:
    • ALC_FLR: 1
pdf_data/cert_keywords/cc_sfr
pdf_data/cert_keywords/cc_claims
pdf_data/cert_keywords/vendor
pdf_data/cert_keywords/eval_facility
  • BrightSight:
    • Brightsight: 1
pdf_data/cert_keywords/symmetric_crypto
pdf_data/cert_keywords/asymmetric_crypto
pdf_data/cert_keywords/pq_crypto
pdf_data/cert_keywords/hash_function
pdf_data/cert_keywords/crypto_scheme
pdf_data/cert_keywords/crypto_protocol
pdf_data/cert_keywords/randomness
pdf_data/cert_keywords/cipher_mode
pdf_data/cert_keywords/ecc_curve
pdf_data/cert_keywords/crypto_engine
pdf_data/cert_keywords/tls_cipher_suite
pdf_data/cert_keywords/crypto_library
pdf_data/cert_keywords/vulnerability
pdf_data/cert_keywords/side_channel_analysis
pdf_data/cert_keywords/technical_report_id
pdf_data/cert_keywords/device_model
pdf_data/cert_keywords/tee_name
pdf_data/cert_keywords/os_name
pdf_data/cert_keywords/cplc_data
pdf_data/cert_keywords/ic_data_group
pdf_data/cert_keywords/standard_id
pdf_data/cert_keywords/javacard_version
pdf_data/cert_keywords/javacard_api_const
pdf_data/cert_keywords/javacard_packages
pdf_data/cert_keywords/certification_process
pdf_data/cert_metadata
  • pdf_file_size_bytes: 2830569
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 1
pdf_data/report_filename SERTIT-109 Certification Report Fudan EAL5plus v2.0_rev.pdf anssi-cc-2018_08fr.pdf
pdf_data/report_frontpage
  • FR:
  • FR:
    • cc_security_level: EAL 5 augmenté ADV_IMP.2, ADV_INT.3, ADV_TDS.5, ALC_CMC.5, ALC_DVS.2, ALC_FLR.1, ALC_TAT.3, ATE_COV.3, ATE_FUN.2, AVA_VAN.5, ASE_TSS.2
    • cc_version: Critères Communs version 3.1 révision 4
    • cert_id: ANSSI-CC-2018/08
    • cert_item: P73N2M0B0.200
    • cert_item_version: B0.200
    • cert_lab: Serma Safety & Security 14 rue Galilée, CS 10055, 33615 Pessac Cedex, France
    • developer: NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne Commanditaire NXP Semiconductors Troplowitzstrasse 20, 22529 Hamburg, Allemagne
    • match_rules: ['Référence du rapport de certification(.+)Nom du produit(.+)Référence/version du produit(.+)Conformité à un profil de protection(.+)Critères d’évaluation et version(.+)Niveau d’évaluation(.+)Développeur (.+)Centre d’évaluation(.+)Accords de reconnaissance applicables']
    • ref_protection_profiles: Security IC Platform Protection Profile with Augmentation Packages, version 1.0, certifié BSI-CC-PP-0084-2014 le 19 février 2014
pdf_data/report_keywords/cc_cert_id
  • NO:
    • SERTIT-109: 20
  • FR:
    • ANSSI-CC-2018/08: 16
pdf_data/report_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP-0084-2014: 23
  • BSI:
    • BSI-CC-PP-0084-2014: 1
    • BSI-PP-0084-2014: 1
pdf_data/report_keywords/cc_security_level
  • EAL:
    • EAL 2: 1
    • EAL 5: 22
    • EAL 5 augmented: 1
    • EAL1: 1
    • EAL4: 1
    • EAL5: 1
    • EAL5+: 1
    • EAL7: 1
  • EAL:
    • EAL 1: 1
    • EAL 3: 1
    • EAL 5: 3
    • EAL 7: 1
    • EAL2: 2
    • EAL7: 1
  • ITSEC:
    • ITSEC E6 Elevé: 1
pdf_data/report_keywords/cc_sar
  • ADV:
    • ADV_ARC: 1
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 5
    • ALC_FLR: 1
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV: 1
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 5
  • ADV:
    • ADV_ARC: 1
    • ADV_FSP: 1
    • ADV_IMP: 1
    • ADV_IMP.2: 2
    • ADV_INT: 1
    • ADV_INT.3: 2
    • ADV_SPM: 1
    • ADV_TDS: 1
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE: 1
    • AGD_PRE: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.5: 2
    • ALC_CMS: 1
    • ALC_DEL: 1
    • ALC_DVS: 1
    • ALC_DVS.2: 1
    • ALC_FLR: 2
    • ALC_FLR.1: 2
    • ALC_LCD: 1
    • ALC_TAT: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL: 1
    • ASE_ECD: 1
    • ASE_INT: 1
    • ASE_OBJ: 1
    • ASE_REQ: 1
    • ASE_SPD: 1
    • ASE_TSS: 1
    • ASE_TSS.2: 2
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT: 1
    • ATE_FUN: 1
    • ATE_FUN.2: 2
    • ATE_IND: 1
  • AVA:
    • AVA_VAN: 2
    • AVA_VAN.5: 3
pdf_data/report_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 4
  • FCS:
    • FCS_COP.1: 8
    • FCS_RNG.1: 4
  • FDP:
    • FDP_ACC.1: 1
    • FDP_ACF.1: 1
    • FDP_IFC.1: 1
    • FDP_ITT.1: 1
    • FDP_SDC.1: 4
    • FDP_SDI.2: 3
  • FMT:
    • FMT_LIM.1: 2
    • FMT_LIM.2: 2
  • FPT:
    • FPT_FLS.1: 1
    • FPT_ITT.1: 1
    • FPT_PHP.3: 1
  • FRU:
    • FRU_FLT.2: 1
pdf_data/report_keywords/vendor
  • NXP:
    • NXP: 24
    • NXP Semiconductors: 2
  • Philips:
    • Philips: 1
pdf_data/report_keywords/eval_facility
  • BrightSight:
    • Brightsight: 2
  • Serma:
    • SERMA: 2
    • Serma Safety & Security: 1
pdf_data/report_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 5
  • DES:
    • 3DES:
      • TDES: 5
    • DES:
      • DES: 3
  • DES:
    • DES:
      • DES: 1
pdf_data/report_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 3
pdf_data/report_keywords/randomness
  • RNG:
    • RNG: 1
pdf_data/report_keywords/side_channel_analysis
  • FI:
    • Fault Injection: 1
  • SCA:
    • DPA: 1
    • SPA: 1
  • other:
    • JIL: 2
pdf_data/report_keywords/standard_id
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • ISO:
    • ISO/IEC 14443: 2
    • ISO/IEC 15408: 8
    • ISO/IEC 7816: 2
  • BSI:
    • AIS 31: 1
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
pdf_data/report_metadata
  • /Author: Ulrich Isachsen
  • /CreationDate: D:20190319130354+01'00'
  • /Creator: Microsoft® Word 2013
  • /Keywords: ugradert
  • /ModDate: D:20190319130354+01'00'
  • /Producer: Microsoft® Word 2013
  • /Title: tittel
  • pdf_file_size_bytes: 423796
  • pdf_hyperlinks: {}
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 20
  • /Category:
  • /Comments: NXP Semiconductors
  • /Company: SGDSN/ANSSI
  • /CreationDate: D:20180221170250+01'00'
  • /Creator: Acrobat PDFMaker 11 pour Word
  • /Keywords: ANSSI-CC-CER-F-07.026
  • /ModDate: D:20180223104827+01'00'
  • /Producer: Adobe PDF Library 11.0
  • /SourceModified: D:20180221160246
  • /Subject:
  • /Title:
  • pdf_file_size_bytes: 248919
  • pdf_hyperlinks: http://www.ssi.gouv.fr/, mailto:[email protected]
  • pdf_is_encrypted: False
  • pdf_number_of_pages: 15
pdf_data/st_filename FM1280 EAL5plus ST lite v2.0.pdf ANSSI-cible-2018_08en.pdf
pdf_data/st_keywords/cc_protection_profile_id
  • BSI:
    • BSI-CC-PP- 0084-2014: 1
    • BSI-CC-PP-0084-2014: 1
  • BSI:
    • BSI-PP-0084-2014: 2
pdf_data/st_keywords/cc_security_level
  • EAL:
    • EAL5: 2
    • EAL5 augmented: 2
    • EAL5+: 1
  • EAL:
    • EAL4: 4
    • EAL4 augmented: 2
    • EAL5: 5
    • EAL5 augmented: 1
    • EAL5+: 1
pdf_data/st_keywords/cc_sar
  • ADV:
    • ADV_ARC.1: 1
    • ADV_FSP.5: 1
    • ADV_IMP.1: 1
    • ADV_INT.2: 1
    • ADV_TDS.4: 1
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC.4: 1
    • ALC_CMS.5: 1
    • ALC_DEL.1: 1
    • ALC_DVS.2: 3
    • ALC_LCD.1: 1
    • ALC_TAT.2: 1
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.1: 1
  • ATE:
    • ATE_COV.2: 1
    • ATE_DPT.3: 1
    • ATE_FUN.1: 1
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 3
  • ADV:
    • ADV_ARC.1: 1
    • ADV_CMC.5: 2
    • ADV_FSP: 1
    • ADV_FSP.4: 2
    • ADV_FSP.5: 3
    • ADV_IMP: 1
    • ADV_IMP.1: 3
    • ADV_IMP.2: 5
    • ADV_INT.3: 2
    • ADV_TDS.5: 2
  • AGD:
    • AGD_OPE.1: 1
    • AGD_PRE.1: 1
  • ALC:
    • ALC_CMC: 1
    • ALC_CMC.4: 4
    • ALC_CMC.5: 4
    • ALC_CMS: 1
    • ALC_CMS.4: 2
    • ALC_CMS.5: 3
    • ALC_COV.2: 2
    • ALC_COV.3: 2
    • ALC_DEL.1: 1
    • ALC_DVS.2: 4
    • ALC_FLR.1: 4
    • ALC_LCD.1: 1
    • ALC_TAT.3: 2
  • ASE:
    • ASE_CCL.1: 1
    • ASE_ECD.1: 1
    • ASE_INT.1: 1
    • ASE_OBJ.2: 1
    • ASE_REQ.2: 1
    • ASE_SPD.1: 1
    • ASE_TSS.2: 4
  • ATE:
    • ATE_COV: 1
    • ATE_COV.3: 2
    • ATE_DPT.3: 1
    • ATE_FUN.2: 2
    • ATE_IND.2: 1
  • AVA:
    • AVA_VAN.5: 4
pdf_data/st_keywords/cc_sfr
  • FAU:
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM.1: 9
    • FCS_CKM.4: 9
    • FCS_COP.1: 28
    • FCS_COP.1.1: 4
    • FCS_RNG.1: 6
    • FCS_RNG.1.1: 1
    • FCS_RNG.1.2: 1
  • FDP:
    • FDP_ACC.1: 8
    • FDP_ACC.1.1: 1
    • FDP_ACF.1: 7
    • FDP_ACF.1.1: 1
    • FDP_ACF.1.2: 1
    • FDP_ACF.1.3: 1
    • FDP_ACF.1.4: 1
    • FDP_IFC.1: 4
    • FDP_ITC.1: 13
    • FDP_ITC.2: 5
    • FDP_ITT.1: 6
    • FDP_SDC.1: 7
    • FDP_SDC.1.1: 1
    • FDP_SDI.1: 1
    • FDP_SDI.2: 6
    • FDP_SDI.2.1: 1
    • FDP_SDI.2.2: 1
  • FMT:
    • FMT_LIM.1: 3
    • FMT_LIM.2: 2
    • FMT_MSA.3: 3
  • FPT:
    • FPT_FLS.1: 6
    • FPT_ITT.1: 6
    • FPT_PHP.3: 5
  • FRU:
    • FRU_FLT.2: 6
  • FAU:
    • FAU_SAS: 1
    • FAU_SAS.1: 6
    • FAU_SAS.1.1: 1
  • FCS:
    • FCS_CKM: 13
    • FCS_CKM.1: 13
    • FCS_CKM.4: 14
    • FCS_COP: 31
    • FCS_COP.1: 8
    • FCS_RNG: 5
    • FCS_RNG.1: 5
    • FCS_SDI.2: 1
  • FDP:
    • FDP_ACC: 12
    • FDP_ACC.1: 14
    • FDP_ACF: 12
    • FDP_ACF.1: 10
    • FDP_IFC.1: 13
    • FDP_ITC.1: 13
    • FDP_ITC.2: 13
    • FDP_ITT.1: 8
    • FDP_MSA: 8
    • FDP_SDC: 1
    • FDP_SDC.1: 7
    • FDP_SDI: 13
    • FDP_SDI.1: 2
    • FDP_SDI.1.1: 1
    • FDP_SDI.2: 6
    • FDP_SMF.1: 4
  • FMT:
    • FMT_LIM: 1
    • FMT_LIM.1: 5
    • FMT_LIM.2: 4
    • FMT_MAS.1: 1
    • FMT_MSA: 20
    • FMT_MSA.1: 9
    • FMT_MSA.3: 12
    • FMT_SMF.1: 12
    • FMT_SMF.1.1: 1
    • FMT_SMR.1: 9
  • FPT:
    • FPT_FLS.1: 10
    • FPT_ITT.1: 8
    • FPT_PHP.3: 8
  • FRU:
    • FRU_FLT.2: 10
  • FTP:
    • FTP_FLS.1: 1
pdf_data/st_keywords/cc_claims
  • O:
    • O.AES: 5
    • O.ECC: 5
    • O.MEM_ACCCESS: 1
    • O.MEM_ACCESS: 4
    • O.RND: 3
    • O.RSA: 5
    • O.TDES: 6
  • T:
    • T.RND: 2
  • O:
    • O.AES: 7
    • O.CRC: 8
    • O.FLASH-: 1
    • O.FLASH-INTEGRITY: 6
    • O.GCM-SUPPORT: 8
    • O.MEM-ACCESS: 8
    • O.RND: 3
    • O.SFR-ACCESS: 8
    • O.TDES: 7
  • T:
    • T.RND: 2
pdf_data/st_keywords/vendor
  • NXP:
    • NXP: 49
    • NXP Semiconductors: 29
    • NXP Semiconductors N.V: 58
pdf_data/st_keywords/symmetric_crypto
  • AES_competition:
    • AES:
      • AES: 29
  • DES:
    • 3DES:
      • 3DES: 1
      • TDEA: 1
      • TDES: 16
      • Triple-DES: 7
    • DES:
      • DES: 13
  • AES_competition:
    • AES:
      • AES: 37
  • DES:
    • 3DES:
      • TDEA: 2
      • TDES: 17
      • Triple-DES: 9
    • DES:
      • DES: 9
  • miscellaneous:
    • SEED:
      • SEED: 1
pdf_data/st_keywords/asymmetric_crypto
  • ECC:
    • ECC:
      • ECC: 30
    • ECDH:
      • ECDH: 3
    • ECDSA:
      • ECDSA: 4
  • ECC:
    • ECC:
      • ECC: 1
pdf_data/st_keywords/crypto_scheme
  • KA:
    • Key Agreement: 1
pdf_data/st_keywords/randomness
  • RNG:
    • RND: 5
    • RNG: 8
  • TRNG:
    • TRNG: 1
  • RNG:
    • RND: 5
    • RNG: 12
pdf_data/st_keywords/cipher_mode
  • CBC:
    • CBC: 5
  • ECB:
    • ECB: 5
  • CBC:
    • CBC: 6
  • CFB:
    • CFB: 5
  • CTR:
    • CTR: 5
  • ECB:
    • ECB: 2
  • GCM:
    • GCM: 21
  • OFB:
    • OFB: 5
pdf_data/st_keywords/side_channel_analysis
  • FI:
    • Malfunction: 5
    • fault injection: 1
    • malfunction: 4
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
  • FI:
    • Malfunction: 6
    • malfunction: 1
  • SCA:
    • Leak-Inherent: 5
    • Physical Probing: 2
    • physical probing: 2
    • side channel: 2
pdf_data/st_keywords/standard_id
  • BSI:
    • AIS31: 2
  • CC:
    • CCMB-2012-09-001: 1
    • CCMB-2012-09-002: 1
    • CCMB-2012-09-003: 1
    • CCMB-2012-09-004: 1
  • FIPS:
    • FIPS 197: 3
  • ISO:
    • ISO/IEC 14443: 4
    • ISO/IEC 7816: 4
  • NIST:
    • NIST SP 800-38A: 1
    • NIST SP 800-67: 1
  • PKCS:
    • PKCS#1: 3
  • BSI:
    • AIS31: 1
  • CC:
    • CCMB-2012-09-001: 2
    • CCMB-2012-09-002: 2
    • CCMB-2012-09-003: 2
    • CCMB-2012-09-004: 2
  • FIPS:
    • FIPS 140-2: 1
  • ISO:
    • ISO/IEC 7816: 6
  • NIST:
    • NIST SP 800-38A: 4
    • NIST SP 800-38D: 2
    • NIST SP 800-67: 2
pdf_data/st_keywords/certification_process
  • OutOfScope:
    • allows NXP to develop sales products composed of P73N2M0B0.200 and Services Software, which are out of scope of this Security Target. NXP Semiconductors P73N2M0B0.200 Security Target Lite P73N2M0B0.200 All: 1
    • out of scope: 1
pdf_data/st_metadata
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