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S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2
CSV information ?
Status | archived |
---|---|
Valid from | 04.11.2009 |
Valid until | 01.09.2019 |
Scheme | 🇩🇪 DE |
Manufacturer | Samsung Electronics Co., Ltd. |
Category | ICs, Smart Cards and Smart Card-Related Devices and Systems |
Security level | EAL5+ |
Maintenance updates | S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 7 (03.03.2010) Certification report Security target |
S3CC9PW 16-bit RISC Microcontroller for Smart Card, Revision 0 (05.01.2010) Certification report Security target |
Heuristics summary ?
Certificate ID: BSI-DSZ-CC-0547-2009
Certificate ?
Certification report ?
Extracted keywords
Symmetric Algorithms
AES, DES, Triple-DESRandomness
TRNG, RNGEngines
TORNADOBlock cipher modes
ECB, CBCCPLC
IC Fabricator, IC VersionVendor
SamsungSecurity level
EAL 5, EAL 4, EAL 1, EAL 7, EAL4, EAL5+, EAL1, EAL3, EAL5, EAL7, EAL2, EAL6, EAL 5 augmentedSecurity Assurance Requirements (SAR)
ADV_ARC.1, ADV_FSP.1, ADV_FSP.2, ADV_FSP.3, ADV_FSP.4, ADV_FSP.5, ADV_FSP.6, ADV_IMP.1, ADV_IMP.2, ADV_INT.1, ADV_INT.2, ADV_INT.3, ADV_SPM.1, ADV_TDS.1, ADV_TDS.2, ADV_TDS.3, ADV_TDS.4, ADV_TDS.5, ADV_TDS.6, ADV_ARC, ADV_FSP, ADV_IMP, ADV_INT, ADV_SPM, ADV_TDS, AGD_OPE.1, AGD_PRE.1, AGD_OPE, AGD_PRE, ALC_DVS.2, ALC_CMC, ALC_CMC.1, ALC_CMC.2, ALC_CMC.3, ALC_CMC.4, ALC_CMC.5, ALC_CMS.1, ALC_CMS.2, ALC_CMS.3, ALC_CMS.4, ALC_CMS.5, ALC_DEL.1, ALC_DVS.1, ALC_FLR.1, ALC_FLR.2, ALC_FLR.3, ALC_LCD.1, ALC_LCD.2, ALC_TAT.1, ALC_TAT.2, ALC_TAT.3, ALC_CMS, ALC_DEL, ALC_DVS, ALC_FLR, ALC_TAT, ATE_COV.1, ATE_COV.2, ATE_COV.3, ATE_DPT.1, ATE_DPT.2, ATE_DPT.3, ATE_DPT.4, ATE_FUN.1, ATE_FUN.2, ATE_IND.1, ATE_IND.2, ATE_IND.3, ATE_COV, ATE_DPT, ATE_FUN, ATE_IND, AVA_VAN.5, AVA_VAN.1, AVA_VAN.2, AVA_VAN.3, AVA_VAN.4, AVA_VAN, APE_INT.1, APE_CCL.1, APE_SPD.1, APE_OBJ.1, APE_OBJ.2, APE_ECD.1, APE_REQ.1, APE_REQ.2, ASE_INT.1, ASE_CCL.1, ASE_SPD.1, ASE_OBJ.1, ASE_OBJ.2, ASE_ECD.1, ASE_REQ.1, ASE_REQ.2, ASE_TSS.1, ASE_TSS.2, ASE_CCL, ASE_ECD, ASE_INT, ASE_OBJ, ASE_SPD, ASE_TSSSecurity Functional Requirements (SFR)
FCS_COP.1Protection profiles
BSI-CC-PP-0035-2007, BSI-CC-PP-0035Certificates
BSI-DSZ-CC-0547-2009Evaluation facilities
TĂśV Informationstechnik, TĂśViTCertification process
Microcontroller for Smart Cards, Version 2.2 from 2009-04-22 Project Chippewa, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15.06.2007, registered and certified by, TECHNICAL REPORT-SUMMARY (ETR SUMMARY) for the product S3CC9PF, Version 1 from 2009-09-04, TÜViT (confidential document) [10] ETR FOR COMPOSITE EVALUATION (ETR-COMP) according to AIS 36 for the Product S3CC9PF, Version, from 2009-09-04, Version 1 from 2009-09-04, TÜViT (confidential document) 8 specifically • AIS 20, Version 1, 2. December 1999, Funktionalitätsklassen und, Definition (Class ALC_CMC.4/CMS.5) – Project Chippewa, Version 1.5, 2009-05-15,Samsung Electronics(confidential document) [12] User’s manual S3CC9PF Family (S3CC9PF/AF/PW) 16-Bit CMOS Microcontroller for Smart CardSide-channel analysis
physical probing, side-channel, DPA, physical tampering, JILCertification process
Microcontroller for Smart Cards, Version 2.2 from 2009-04-22 Project Chippewa, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15.06.2007, registered and certified by, TECHNICAL REPORT-SUMMARY (ETR SUMMARY) for the product S3CC9PF, Version 1 from 2009-09-04, TÜViT (confidential document) [10] ETR FOR COMPOSITE EVALUATION (ETR-COMP) according to AIS 36 for the Product S3CC9PF, Version, from 2009-09-04, Version 1 from 2009-09-04, TÜViT (confidential document) 8 specifically • AIS 20, Version 1, 2. December 1999, Funktionalitätsklassen und, Definition (Class ALC_CMC.4/CMS.5) – Project Chippewa, Version 1.5, 2009-05-15,Samsung Electronics(confidential document) [12] User’s manual S3CC9PF Family (S3CC9PF/AF/PW) 16-Bit CMOS Microcontroller for Smart CardStandards
AIS20, AIS31, AIS 34, AIS 20, AIS 25, AIS 26, AIS 35, AIS 36, AIS 31, AIS 32, AIS 38Technical reports
BSI TR-02102, BSI 7125, BSI 7148, BSI 7149File metadata
Title | Certification Report BSI-DSZ-CC-0547-2009 |
---|---|
Subject | Common Criteria Certification |
Keywords | S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2, Samsung Electronics Co., Ltd, Certification, Common Crtieria |
Author | Bundesamt fĂĽr Sicherheit in der Informationstechnik |
Creation date | D:20091117115143+01'00' |
Modification date | D:20091118125353+01'00' |
Pages | 38 |
Creator | Writer |
Producer | StarOffice 9 |
Frontpage
Certificate ID | BSI-DSZ-CC-0547-2009 |
---|---|
Certified item | S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2 |
Certification lab | BSI |
Developer | Samsung Electronics Co., Ltd |
References
Incoming- BSI-DSZ-CC-0639-2010 - archived - Samsung S3CT9KW 16-bit RISC Microcontroller for Smart Card, Revision 0 with optional secure RSA/ECC V1.0 Library including specific IC Dedicated Software
Security target ?
Extracted keywords
Symmetric Algorithms
AES, DES, T-DES, 3DES, Triple-DESRandomness
TRNG, RNDEngines
TORNADOBlock cipher modes
ECBVendor
SamsungSecurity level
EAL5, EAL 4, EAL 5, EAL5 augmented, EAL 4 augmented, EAL 5 augmentedClaims
O.RND, T.RNDSecurity Assurance Requirements (SAR)
ADV_ARC, ADV_FSP, ADV_IMP, ADV_ARC.1, ADV_FSP.5, ADV_IMP.1, ADV_INT.2, ADV_TDS.4, ADV_FSP.2, ADV_TDS.3, ADV_FSP.4, AGD_OPE, AGD_PRE, AGD_OPE.1, AGD_PRE.1, ALC_DVS.2, ALC_DEL, ALC_DVS, ALC_CMS, ALC_CMC, ALC_CMC.4, ALC_CMS.5, ALC_DEL.1, ALC_LCD.1, ALC_TAT.2, ALC_DVS.1, ALC_CMS.4, ATE_COV, ATE_COV.2, ATE_DPT.3, ATE_FUN.1, ATE_IND.2, AVA_VAN.5, AVA_VAN, ASE_CCL.1, ASE_ECD.1, ASE_INT.1, ASE_OBJ.2, ASE_REQ.2, ASE_SPD.1, ASE_TSS.1Security Functional Requirements (SFR)
FAU_SAS, FAU_GEN, FAU_SAS.1, FAU_SAS.1.1, FAU_GEN.1, FCS_RNG, FCS_RNG.1, FCS_RNG.1.1, FCS_RNG.1.2, FCS_COP.1, FCS_COP, FCS_CKM.1, FCS_CKM.4, FCS_CKM.1.1, FCS_CKM.2, FCS_CKM, FDP_ACF, FDP_ITT.1, FDP_ITT.1.1, FDP_ACC.1, FDP_IFC.1, FDP_IFC.1.1, FDP_IFF.1, FDP_ACF.1, FDP_ACC.1.1, FDP_ACF.1.1, FDP_ACF.1.2, FDP_ACF.1.3, FDP_ACF.1.4, FDP_ITC.1, FDP_ITC.2, FDP_SDI.1, FDP_ACC, FDP_IFC, FDP_ITT, FMT_LIM, FMT_LIM.1, FMT_LIM.2, FMT_LIM.1.1, FMT_LIM.2.1, FMT_MSA.3, FMT_MSA.1, FMT_MSA.3.1, FMT_MSA.3.2, FMT_SMR.1, FMT_MSA.1.1, FMT_SMF.1, FMT_SMF.1.1, FMT_MSA, FMT_SMF, FPT_FLS.1, FPT_FLS.1.1, FPT_PHP.3, FPT_PHP.3.1, FPT_PHP, FPT_ITT.1, FPT_ITT.1.1, FPT_FLS, FPT_ITT, FRU_FLT.2, FRU_FLT.1, FRU_FLTProtection profiles
BSI-PP-0035Side-channel analysis
Leak-Inherent, Physical Probing, physical probing, Physical probing, side-channel, SPA, DPA, timing attacks, physical tampering, Malfunction, malfunction, DFA, reverse engineeringStandards
FIPS 197, AIS20, AIS31, AIS 20, AIS 31File metadata
Title | Security Target Lite of S3CC9PF 16-bit RISC Microcontroller For Smart Cards |
---|---|
Subject | S3CC9PF Common Criteria(version 3.1) EAL5+ Evaluation |
Keywords | Security Target of S3CC9PF 16-bit RISC Microcontroller For Smart Cards, CC EAL5+, Samsung Electroncis, SmartCard IC, Common Criteria version 3.1 |
Author | KyungSuk YI (Bryant) |
Creation date | D:20090901195327+09'00' |
Modification date | D:20090904171734+09'00' |
Pages | 64 |
Creator | PScript5.dll Version 5.2.2 |
Producer | Acrobat Distiller 6.0.1 (Windows) |
Heuristics ?
Certificate ID: BSI-DSZ-CC-0547-2009
Extracted SARs
ASE_CCL.1, AGD_PRE.1, ATE_COV.2, ASE_REQ.2, APE_INT.1, ASE_TSS.1, ALC_FLR.3, ATE_IND.2, ASE_ECD.1, ALC_TAT.2, ASE_SPD.1, AVA_VAN.5, ALC_CMC.4, APE_ECD.1, ALC_DEL.1, APE_CCL.1, ALC_DVS.2, ADV_INT.2, ADV_SPM.1, ALC_LCD.1, ASE_INT.1, ATE_FUN.1, APE_SPD.1, ASE_OBJ.2, ADV_IMP.1, APE_OBJ.2, ADV_FSP.5, ATE_DPT.3, ALC_CMS.5, APE_REQ.2, ADV_TDS.4, ADV_ARC.1, AGD_OPE.1References ?
Updates ?
-
23.07.2024 The certificate was first processed.
New certificate
A new Common Criteria certificate with the product name S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2 was processed.
Raw data
{
"_type": "sec_certs.sample.cc.CCCertificate",
"category": "ICs, Smart Cards and Smart Card-Related Devices and Systems",
"cert_link": null,
"dgst": "37da977e92a14021",
"heuristics": {
"_type": "sec_certs.sample.cc.CCCertificate.Heuristics",
"annotated_references": null,
"cert_id": "BSI-DSZ-CC-0547-2009",
"cert_lab": [
"BSI"
],
"cpe_matches": null,
"direct_transitive_cves": null,
"extracted_sars": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DVS",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMS",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_FSP",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_TAT",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_IND",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_IMP",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_CCL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_PRE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AVA_VAN",
"level": 5
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_DEL",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_TSS",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_OBJ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_CMC",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "AGD_OPE",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_OBJ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_TDS",
"level": 4
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_ARC",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_FLR",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_SPD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_DPT",
"level": 3
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_INT",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ASE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ALC_LCD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_COV",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_SPM",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_ECD",
"level": 1
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ADV_INT",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "APE_REQ",
"level": 2
},
{
"_type": "sec_certs.sample.sar.SAR",
"family": "ATE_FUN",
"level": 1
}
]
},
"extracted_versions": {
"_type": "Set",
"elements": [
"16",
"2"
]
},
"indirect_transitive_cves": null,
"related_cves": null,
"report_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": {
"_type": "Set",
"elements": [
"BSI-DSZ-CC-0639-2010"
]
},
"directly_referencing": null,
"indirectly_referenced_by": {
"_type": "Set",
"elements": [
"ANSSI-CC-2012/72",
"KECS-ISIS-0435-2013",
"ANSSI-CC-2012/70",
"BSI-DSZ-CC-0894-2014",
"BSI-DSZ-CC-0802-2012",
"KECS-ISIS-0490-2014",
"KECS-ISIS-0513-2014",
"KECS-ISIS-0394-2012",
"BSI-DSZ-CC-0801-2012",
"BSI-DSZ-CC-0639-2010",
"KECS-ISIS-0468-2013",
"KECS-ISIS-0675-2015",
"BSI-DSZ-CC-0719-V2-2016",
"BSI-DSZ-CC-0882-2013",
"BSI-DSZ-CC-0720-V2-2016",
"BSI-DSZ-CC-0895-2014",
"BSI-DSZ-CC-0720-2011",
"BSI-DSZ-CC-0719-2011",
"KECS-ISIS-0533-2014",
"BSI-DSZ-CC-0882-V2-2019",
"KECS-ISIS-0456-2013"
]
},
"indirectly_referencing": null
},
"scheme_data": null,
"st_references": {
"_type": "sec_certs.sample.certificate.References",
"directly_referenced_by": null,
"directly_referencing": null,
"indirectly_referenced_by": null,
"indirectly_referencing": null
},
"verified_cpe_matches": null
},
"maintenance_updates": {
"_type": "Set",
"elements": [
{
"_type": "sec_certs.sample.cc.CCCertificate.MaintenanceReport",
"maintenance_date": "2010-03-03",
"maintenance_report_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0547_ma2a_pdf.pdf",
"maintenance_st_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0547_ma2b_pdf.pdf",
"maintenance_title": "S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 7"
},
{
"_type": "sec_certs.sample.cc.CCCertificate.MaintenanceReport",
"maintenance_date": "2010-01-05",
"maintenance_report_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0547_ma1a_pdf.pdf",
"maintenance_st_link": "https://www.commoncriteriaportal.org/nfs/ccpfiles/files/epfiles/0547_ma1b_pdf.pdf",
"maintenance_title": "S3CC9PW 16-bit RISC Microcontroller for Smart Card, Revision 0"
}
]
},
"manufacturer": "Samsung Electronics Co., Ltd.",
"manufacturer_web": "https://www.samsung.com",
"name": "S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2",
"not_valid_after": "2019-09-01",
"not_valid_before": "2009-11-04",
"pdf_data": {
"_type": "sec_certs.sample.cc.CCCertificate.PdfData",
"cert_filename": null,
"cert_frontpage": null,
"cert_keywords": null,
"cert_metadata": null,
"report_filename": "0547a_pdf.pdf",
"report_frontpage": {
"DE": {
"cert_id": "BSI-DSZ-CC-0547-2009",
"cert_item": "S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2",
"cert_lab": "BSI",
"developer": "Samsung Electronics Co., Ltd",
"match_rules": [
"(BSI-DSZ-CC-.+?) (?:for|For) (.+?) from (.*)"
]
}
},
"report_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {
"DE": {
"BSI-DSZ-CC-0547-2009": 19
}
},
"cc_claims": {},
"cc_protection_profile_id": {
"BSI": {
"BSI-CC-PP-0035": 1,
"BSI-CC-PP-0035-2007": 3
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_ARC.1": 1,
"ADV_FSP": 1,
"ADV_FSP.1": 1,
"ADV_FSP.2": 1,
"ADV_FSP.3": 1,
"ADV_FSP.4": 1,
"ADV_FSP.5": 1,
"ADV_FSP.6": 1,
"ADV_IMP": 1,
"ADV_IMP.1": 1,
"ADV_IMP.2": 1,
"ADV_INT": 1,
"ADV_INT.1": 1,
"ADV_INT.2": 1,
"ADV_INT.3": 1,
"ADV_SPM": 1,
"ADV_SPM.1": 1,
"ADV_TDS": 1,
"ADV_TDS.1": 1,
"ADV_TDS.2": 1,
"ADV_TDS.3": 1,
"ADV_TDS.4": 1,
"ADV_TDS.5": 1,
"ADV_TDS.6": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_OPE.1": 1,
"AGD_PRE": 1,
"AGD_PRE.1": 1
},
"ALC": {
"ALC_CMC": 2,
"ALC_CMC.1": 1,
"ALC_CMC.2": 1,
"ALC_CMC.3": 1,
"ALC_CMC.4": 2,
"ALC_CMC.5": 1,
"ALC_CMS": 1,
"ALC_CMS.1": 1,
"ALC_CMS.2": 1,
"ALC_CMS.3": 1,
"ALC_CMS.4": 1,
"ALC_CMS.5": 2,
"ALC_DEL": 1,
"ALC_DEL.1": 2,
"ALC_DVS": 1,
"ALC_DVS.1": 2,
"ALC_DVS.2": 6,
"ALC_FLR": 1,
"ALC_FLR.1": 1,
"ALC_FLR.2": 1,
"ALC_FLR.3": 1,
"ALC_LCD.1": 2,
"ALC_LCD.2": 1,
"ALC_TAT": 1,
"ALC_TAT.1": 1,
"ALC_TAT.2": 2,
"ALC_TAT.3": 1
},
"APE": {
"APE_CCL.1": 1,
"APE_ECD.1": 1,
"APE_INT.1": 1,
"APE_OBJ.1": 1,
"APE_OBJ.2": 1,
"APE_REQ.1": 1,
"APE_REQ.2": 1,
"APE_SPD.1": 1
},
"ASE": {
"ASE_CCL": 1,
"ASE_CCL.1": 1,
"ASE_ECD": 1,
"ASE_ECD.1": 1,
"ASE_INT": 1,
"ASE_INT.1": 1,
"ASE_OBJ": 1,
"ASE_OBJ.1": 1,
"ASE_OBJ.2": 1,
"ASE_REQ.1": 1,
"ASE_REQ.2": 1,
"ASE_SPD": 1,
"ASE_SPD.1": 1,
"ASE_TSS": 1,
"ASE_TSS.1": 1,
"ASE_TSS.2": 1
},
"ATE": {
"ATE_COV": 1,
"ATE_COV.1": 1,
"ATE_COV.2": 1,
"ATE_COV.3": 1,
"ATE_DPT": 1,
"ATE_DPT.1": 1,
"ATE_DPT.2": 1,
"ATE_DPT.3": 1,
"ATE_DPT.4": 1,
"ATE_FUN": 1,
"ATE_FUN.1": 1,
"ATE_FUN.2": 1,
"ATE_IND": 1,
"ATE_IND.1": 1,
"ATE_IND.2": 1,
"ATE_IND.3": 1
},
"AVA": {
"AVA_VAN": 2,
"AVA_VAN.1": 1,
"AVA_VAN.2": 1,
"AVA_VAN.3": 1,
"AVA_VAN.4": 1,
"AVA_VAN.5": 6
}
},
"cc_security_level": {
"EAL": {
"EAL 1": 1,
"EAL 4": 5,
"EAL 5": 4,
"EAL 5 augmented": 3,
"EAL 7": 1,
"EAL1": 6,
"EAL2": 3,
"EAL3": 4,
"EAL4": 5,
"EAL5": 6,
"EAL5+": 1,
"EAL6": 3,
"EAL7": 4
}
},
"cc_sfr": {
"FCS": {
"FCS_COP.1": 1
}
},
"certification_process": {
"ConfidentialDocument": {
"Definition (Class ALC_CMC.4/CMS.5) \u2013 Project Chippewa, Version 1.5, 2009-05-15,Samsung Electronics(confidential document) [12] User\u2019s manual S3CC9PF Family (S3CC9PF/AF/PW) 16-Bit CMOS Microcontroller for Smart Card": 1,
"Microcontroller for Smart Cards, Version 2.2 from 2009-04-22 Project Chippewa, Samsung Electronics (confidential document) [7] Security IC Platform Protection Profile, Version 1.0, 15.06.2007, registered and certified by": 1,
"TECHNICAL REPORT-SUMMARY (ETR SUMMARY) for the product S3CC9PF, Version 1 from 2009-09-04, T\u00dcViT (confidential document) [10] ETR FOR COMPOSITE EVALUATION (ETR-COMP) according to AIS 36 for the Product S3CC9PF, Version": 1,
"from 2009-09-04, Version 1 from 2009-09-04, T\u00dcViT (confidential document) 8 specifically \u2022 AIS 20, Version 1, 2. December 1999, Funktionalit\u00e4tsklassen und": 1
}
},
"cipher_mode": {
"CBC": {
"CBC": 1
},
"ECB": {
"ECB": 1
}
},
"cplc_data": {
"ICFab": {
"IC Fabricator": 1
},
"ICVersion": {
"IC Version": 1
}
},
"crypto_engine": {
"TORNADO": {
"TORNADO": 1
}
},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {
"TUV": {
"T\u00dcV Informationstechnik": 2,
"T\u00dcViT": 2
}
},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {
"RNG": {
"RNG": 1
},
"TRNG": {
"TRNG": 7
}
},
"side_channel_analysis": {
"FI": {
"physical tampering": 1
},
"SCA": {
"DPA": 1,
"physical probing": 1,
"side-channel": 1
},
"other": {
"JIL": 4
}
},
"standard_id": {
"BSI": {
"AIS 20": 2,
"AIS 25": 2,
"AIS 26": 2,
"AIS 31": 1,
"AIS 32": 1,
"AIS 34": 2,
"AIS 35": 2,
"AIS 36": 2,
"AIS 38": 1,
"AIS20": 1,
"AIS31": 4
}
},
"symmetric_crypto": {
"AES_competition": {
"AES": {
"AES": 4
}
},
"DES": {
"3DES": {
"Triple-DES": 4
},
"DES": {
"DES": 6
}
}
},
"technical_report_id": {
"BSI": {
"BSI 7125": 2,
"BSI 7148": 1,
"BSI 7149": 1,
"BSI TR-02102": 1
}
},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {
"Samsung": {
"Samsung": 16
}
},
"vulnerability": {}
},
"report_metadata": {
"/Author": "Bundesamt f\u00fcr Sicherheit in der Informationstechnik",
"/CreationDate": "D:20091117115143+01\u002700\u0027",
"/Creator": "Writer",
"/Keywords": "S3CC9PF 16-bit RISC Microcontroller for Smart Card, Revision 2, Samsung Electronics Co., Ltd, Certification, Common Crtieria",
"/ModDate": "D:20091118125353+01\u002700\u0027",
"/Producer": "StarOffice 9",
"/Subject": "Common Criteria Certification",
"/Title": "Certification Report BSI-DSZ-CC-0547-2009",
"pdf_file_size_bytes": 797259,
"pdf_hyperlinks": {
"_type": "Set",
"elements": [
"http://www.bsi.bund.de/"
]
},
"pdf_is_encrypted": false,
"pdf_number_of_pages": 38
},
"st_filename": "0547b_pdf.pdf",
"st_frontpage": null,
"st_keywords": {
"asymmetric_crypto": {},
"cc_cert_id": {},
"cc_claims": {
"O": {
"O.RND": 5
},
"T": {
"T.RND": 5
}
},
"cc_protection_profile_id": {
"BSI": {
"BSI-PP-0035": 5
}
},
"cc_sar": {
"ADV": {
"ADV_ARC": 1,
"ADV_ARC.1": 7,
"ADV_FSP": 2,
"ADV_FSP.2": 1,
"ADV_FSP.4": 1,
"ADV_FSP.5": 3,
"ADV_IMP": 1,
"ADV_IMP.1": 2,
"ADV_INT.2": 1,
"ADV_TDS.3": 1,
"ADV_TDS.4": 1
},
"AGD": {
"AGD_OPE": 1,
"AGD_OPE.1": 2,
"AGD_PRE": 1,
"AGD_PRE.1": 2
},
"ALC": {
"ALC_CMC": 1,
"ALC_CMC.4": 1,
"ALC_CMS": 2,
"ALC_CMS.4": 1,
"ALC_CMS.5": 3,
"ALC_DEL": 1,
"ALC_DEL.1": 1,
"ALC_DVS": 1,
"ALC_DVS.1": 1,
"ALC_DVS.2": 7,
"ALC_LCD.1": 1,
"ALC_TAT.2": 1
},
"ASE": {
"ASE_CCL.1": 1,
"ASE_ECD.1": 1,
"ASE_INT.1": 1,
"ASE_OBJ.2": 1,
"ASE_REQ.2": 1,
"ASE_SPD.1": 1,
"ASE_TSS.1": 1
},
"ATE": {
"ATE_COV": 1,
"ATE_COV.2": 1,
"ATE_DPT.3": 1,
"ATE_FUN.1": 1,
"ATE_IND.2": 1
},
"AVA": {
"AVA_VAN": 2,
"AVA_VAN.5": 13
}
},
"cc_security_level": {
"EAL": {
"EAL 4": 1,
"EAL 4 augmented": 1,
"EAL 5": 2,
"EAL 5 augmented": 2,
"EAL5": 6,
"EAL5 augmented": 1
}
},
"cc_sfr": {
"FAU": {
"FAU_GEN": 2,
"FAU_GEN.1": 1,
"FAU_SAS": 8,
"FAU_SAS.1": 12,
"FAU_SAS.1.1": 2
},
"FCS": {
"FCS_CKM": 1,
"FCS_CKM.1": 16,
"FCS_CKM.1.1": 1,
"FCS_CKM.2": 2,
"FCS_CKM.4": 7,
"FCS_COP": 10,
"FCS_COP.1": 15,
"FCS_RNG": 11,
"FCS_RNG.1": 19,
"FCS_RNG.1.1": 2,
"FCS_RNG.1.2": 2
},
"FDP": {
"FDP_ACC": 1,
"FDP_ACC.1": 13,
"FDP_ACC.1.1": 1,
"FDP_ACF": 2,
"FDP_ACF.1": 9,
"FDP_ACF.1.1": 1,
"FDP_ACF.1.2": 1,
"FDP_ACF.1.3": 1,
"FDP_ACF.1.4": 1,
"FDP_IFC": 1,
"FDP_IFC.1": 18,
"FDP_IFC.1.1": 1,
"FDP_IFF.1": 3,
"FDP_ITC.1": 6,
"FDP_ITC.2": 6,
"FDP_ITT": 1,
"FDP_ITT.1": 17,
"FDP_ITT.1.1": 1,
"FDP_SDI.1": 1
},
"FMT": {
"FMT_LIM": 8,
"FMT_LIM.1": 24,
"FMT_LIM.1.1": 2,
"FMT_LIM.2": 28,
"FMT_LIM.2.1": 2,
"FMT_MSA": 2,
"FMT_MSA.1": 9,
"FMT_MSA.1.1": 1,
"FMT_MSA.3": 10,
"FMT_MSA.3.1": 1,
"FMT_MSA.3.2": 1,
"FMT_SMF": 1,
"FMT_SMF.1": 6,
"FMT_SMF.1.1": 1,
"FMT_SMR.1": 6
},
"FPT": {
"FPT_FLS": 1,
"FPT_FLS.1": 21,
"FPT_FLS.1.1": 1,
"FPT_ITT": 1,
"FPT_ITT.1": 15,
"FPT_ITT.1.1": 1,
"FPT_PHP": 3,
"FPT_PHP.3": 20,
"FPT_PHP.3.1": 1
},
"FRU": {
"FRU_FLT": 1,
"FRU_FLT.1": 1,
"FRU_FLT.2": 17
}
},
"certification_process": {},
"cipher_mode": {
"ECB": {
"ECB": 3
}
},
"cplc_data": {},
"crypto_engine": {
"TORNADO": {
"TORNADO": 8
}
},
"crypto_library": {},
"crypto_protocol": {},
"crypto_scheme": {},
"device_model": {},
"ecc_curve": {},
"eval_facility": {},
"hash_function": {},
"ic_data_group": {},
"javacard_api_const": {},
"javacard_packages": {},
"javacard_version": {},
"os_name": {},
"pq_crypto": {},
"randomness": {
"RNG": {
"RND": 10
},
"TRNG": {
"TRNG": 14
}
},
"side_channel_analysis": {
"FI": {
"DFA": 1,
"Malfunction": 24,
"malfunction": 11,
"physical tampering": 2
},
"SCA": {
"DPA": 6,
"Leak-Inherent": 21,
"Physical Probing": 4,
"Physical probing": 2,
"SPA": 4,
"physical probing": 9,
"side-channel": 3,
"timing attacks": 1
},
"other": {
"reverse engineering": 5
}
},
"standard_id": {
"BSI": {
"AIS 20": 1,
"AIS 31": 2,
"AIS20": 3,
"AIS31": 2
},
"FIPS": {
"FIPS 197": 1
}
},
"symmetric_crypto": {
"AES_competition": {
"AES": {
"AES": 14
}
},
"DES": {
"3DES": {
"3DES": 6,
"T-DES": 1,
"Triple-DES": 1
},
"DES": {
"DES": 9
}
}
},
"technical_report_id": {},
"tee_name": {},
"tls_cipher_suite": {},
"vendor": {
"Samsung": {
"Samsung": 1
}
},
"vulnerability": {}
},
"st_metadata": {
"/Author": "KyungSuk YI (Bryant)",
"/CreationDate": "D:20090901195327+09\u002700\u0027",
"/Creator": "PScript5.dll Version 5.2.2",
"/Keywords": "Security Target of S3CC9PF 16-bit RISC Microcontroller For Smart Cards, CC EAL5+, Samsung Electroncis, SmartCard IC, Common Criteria version 3.1 ",
"/ModDate": "D:20090904171734+09\u002700\u0027",
"/Producer": "Acrobat Distiller 6.0.1 (Windows)",
"/Subject": "S3CC9PF Common Criteria(version 3.1) EAL5+ Evaluation",
"/Title": "Security Target Lite of S3CC9PF 16-bit RISC Microcontroller For Smart Cards",
"pdf_file_size_bytes": 843064,
"pdf_hyperlinks": {
"_type": "Set",
"elements": []
},
"pdf_is_encrypted": true,
"pdf_number_of_pages": 64
}
},
"protection_profiles": {
"_type": "Set",
"elements": []
},
"report_link": "https://www.commoncriteriaportal.org/files/epfiles/0547a_pdf.pdf",
"scheme": "DE",
"security_level": {
"_type": "Set",
"elements": [
"EAL5+"
]
},
"st_link": "https://www.commoncriteriaportal.org/files/epfiles/0547b_pdf.pdf",
"state": {
"_type": "sec_certs.sample.cc.CCCertificate.InternalState",
"cert": {
"_type": "sec_certs.sample.cc.CCCertificate.DocumentState",
"convert_garbage": false,
"convert_ok": false,
"download_ok": false,
"extract_ok": false,
"pdf_hash": null,
"txt_hash": null
},
"report": {
"_type": "sec_certs.sample.cc.CCCertificate.DocumentState",
"convert_garbage": false,
"convert_ok": true,
"download_ok": true,
"extract_ok": true,
"pdf_hash": "7c8f64905ca29c9fb8faee806cb7ea101fb294c8e8d9e643fd33f8d87bdfff77",
"txt_hash": "73e14c5cb82afca9ade7d5147611434cbb93697eb702cf827f2ee1462dce4717"
},
"st": {
"_type": "sec_certs.sample.cc.CCCertificate.DocumentState",
"convert_garbage": false,
"convert_ok": true,
"download_ok": true,
"extract_ok": true,
"pdf_hash": "0313eb0d321831f6f4cdd029ad581ef8392f4d2c32ee0f06f2fdfce1e8d2f608",
"txt_hash": "fb4c24dba0bb08bfe8a9a350b957787753fb8b02ce28eca3ffdd79f6d9c39eda"
}
},
"status": "archived"
}