Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 1 of 22 Winbond Electronics Corporation TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub- Chip FIPS 140-3 Non-Proprietary Security Policy Document Version RevA2 June 2025 Prepared by: www.jtsec.es TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 2 of 22 Table of Contents 1 General.......................................................................................................................................................................5 1.1 Overview .............................................................................................................................................................5 1.2 Security Levels.....................................................................................................................................................5 2 Cryptographic Module Specification .........................................................................................................................6 2.1 Description ..........................................................................................................................................................6 2.2 Tested and Vendor Affirmed Module Version and Identification .......................................................................7 2.3 Excluded Components.........................................................................................................................................7 2.4 Modes of Operation ............................................................................................................................................7 2.5 Algorithms ...........................................................................................................................................................8 2.6 Security Function Implementations ....................................................................................................................8 2.7 Algorithm Specific Information ...........................................................................................................................9 2.8 RBG and Entropy .................................................................................................................................................9 2.9 Key Generation....................................................................................................................................................9 2.10 Key Establishment .............................................................................................................................................9 2.11 Industry Protocols .............................................................................................................................................9 3 Cryptographic Module Interfaces............................................................................................................................10 3.1 Ports and Interfaces ..........................................................................................................................................10 4 Roles, Services, and Authentication ........................................................................................................................11 4.1 Authentication Methods ...................................................................................................................................11 4.2 Roles..................................................................................................................................................................11 4.3 Approved Services.............................................................................................................................................11 4.4 Non-Approved Services.....................................................................................................................................11 4.5 External Software/Firmware Loaded ................................................................................................................12 5 Software/Firmware Security ...................................................................................................................................13 5.1 Integrity Techniques..........................................................................................................................................13 5.2 Initiate on Demand............................................................................................................................................13 6 Operational Environment........................................................................................................................................14 6.1 Operational Environment Type and Requirements ..........................................................................................14 7 Physical Security.......................................................................................................................................................15 7.1 Mechanisms and Actions Required...................................................................................................................15 8 Non-Invasive Security ..............................................................................................................................................16 9 Sensitive Security Parameters Management ..........................................................................................................17 9.1 Storage Areas ....................................................................................................................................................17 9.2 SSP Input-Output Methods ...............................................................................................................................17 9.3 SSP Zeroization Methods...................................................................................................................................17 9.4 SSPs ...................................................................................................................................................................17 TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 3 of 22 10 Self-Tests ................................................................................................................................................................18 10.1 Pre-Operational Self-Tests ..............................................................................................................................18 10.2 Conditional Self-Tests......................................................................................................................................18 10.3 Periodic Self-Test Information.........................................................................................................................18 10.4 Error States......................................................................................................................................................18 11 Life-Cycle Assurance...............................................................................................................................................20 11.1 Installation, Initialization, and Startup Procedures.........................................................................................20 11.2 Administrator Guidance ..................................................................................................................................20 11.3 Non-Administrator Guidance ..........................................................................................................................20 11.4 Design and Rules .............................................................................................................................................20 11.5 End of Life........................................................................................................................................................21 12 Mitigation of Other Attacks...................................................................................................................................22 TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 4 of 22 List of Tables Table 1: Security Levels..................................................................................................................................................5 Table 2: Tested Module Identification – Hardware.......................................................................................................7 Table 3: Modes List and Description .............................................................................................................................8 Table 4: Approved Algorithms.......................................................................................................................................8 Table 5: Security Function Implementations.................................................................................................................8 Table 6: Ports and Interfaces.......................................................................................................................................10 Table 7: Roles...............................................................................................................................................................11 Table 8: Approved Services .........................................................................................................................................11 Table 9: Mechanisms and Actions Required................................................................................................................15 Table 10: SSP Zeroization Methods .............................................................................................................................17 Table 11: Conditional Self-Tests ..................................................................................................................................18 Table 12: Conditional Periodic Information.................................................................................................................18 Table 13: Error States ..................................................................................................................................................19 List of Figures Figure 1: Cryptographic Module (Block Diagram) .........................................................................................................6 Figure 2: TrustMe © secure flash memory (Front)........................................................................................................7 TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 5 of 22 1 General 1.1 Overview This document is the non-proprietary FIPS 140-3 Security Policy for the TrustMe © W77Q64/128/256/ 512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module, hereafter referred to as, “the module”. It contains the security rules under which the module must operate and describes how the module meets the requirements as specified in FIPS PUB 140-3 for an overall Security Level 1 cryptographic module. 1.2 Security Levels The table below describes the individual security areas of FIPS 140-3, as well as the Security Levels of those individual areas. Section Title Security Level 1 General 1 2 Cryptographic module specification 1 3 Cryptographic module interfaces 1 4 Roles, services, and authentication 1 5 Software/Firmware security N/A 6 Operational environment 1 7 Physical security 1 8 Non-invasive security N/A 9 Sensitive security parameter management 1 10 Self-tests 1 11 Life-cycle assurance 1 12 Mitigation of other attacks N/A Overall Level 1 Table 1: Security Levels The Module has an overall security level of 1. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 6 of 22 2 Cryptographic Module Specification 2.1 Description Purpose and Use: The module is defined as a purely hardware sub-chip cryptographic module (as stated in FIPS 140-3 IG 2.3.B) running on the single-chip TrustMe © secure flash memory. The cryptographic service provided by the module is the message digest calculation based on the SHA2-256 cryptographic algorithm. Module Type: Hardware Module Embodiment: Single Chip Module Characteristics: SubChip Cryptographic Boundary: The cryptographic boundary of the module is the sub-chip, as shown in the figure below, since it is the only part of the device with cryptographic operation capability. Figure 1: Cryptographic Module (Block Diagram) Tested Operational Environment’s Physical Perimeter (TOEPP): The TOEPP of the module is defined as the TrustMe © secure flash memory in which the module operates. It is composed of the following main components: • SRAM: Input/Output buffer serving as a user interface to the secure functions • Flash Array: Non-volatile flash memory cells • Matrix: Data transfer connectivity matrix • CTRL: Control Logic to control command flows and data transfer • Keys: Session control parameters • OSC: Internal Clock Oscillator • SPI IFC: SPI front-end TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 7 of 22 Figure 2: TrustMe © secure flash memory (Front) 2.2 Tested and Vendor Affirmed Module Version and Identification Tested Module Identification – Hardware: Model and/or Part Number Hardware Version Firmware Version Processors Features TrustMe © W77[Q/T]64/128/256/512/1024/2028Mb 0001 (1h) N/A N/A Table 2: Tested Module Identification – Hardware The sub-chip cryptographic module version consists of the four bits (HASH_VER) with the value “1” in hexadecimal (the penultimate value of the hardware version), which is the same for all TrustMe © secure flash memories listed in the table above. Tested Module Identification – Software, Firmware, Hybrid (Executable Code Sets): N/A for this module. Tested Module Identification – Hybrid Disjoint Hardware: N/A for this module. Tested Operational Environments - Software, Firmware, Hybrid: N/A for this module. Vendor-Affirmed Operational Environments - Software, Firmware, Hybrid: N/A for this module. 2.3 Excluded Components There are no components within the cryptographic boundary that are excluded from the FIPS 140-3 security requirements. 2.4 Modes of Operation Modes List and Description: The table below details the Modes of Operation supported by the module. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 8 of 22 Mode Name Description Type Status Indicator Approved Mode Operation mode where the module executes approved services Approved The status indicator is the one associated to the internal READY state, composed of the following signals: CMVP_DONE = 1; CMVP_PASS = 1; SHA_BUSY = 0; SSR_STATE = WORK value (01x) Table 3: Modes List and Description The module implements only one mode of operation, the Approved Mode, in which the approved services are available. No configuration is necessary for the module to operate and remain in the Approved Mode. After passing all self-tests on start-up, the module automatically transitions to the Approved Mode. 2.5 Algorithms Approved Algorithms: The table below lists all the Approved Algorithms supported by the module. Algorithm CAVP Cert Properties Reference SHA2-256 A6518 Message Length - Message Length: 0-768 Increment 1 FIPS 180-4 Table 4: Approved Algorithms Vendor-Affirmed Algorithms: The module does not support any Vendor-Affirmed Algorithms in the Approved Mode of operation. N/A for this module. Non-Approved, Allowed Algorithms: The module does not support any Non-Approved, Allowed Algorithms in the Approved Mode of operation. N/A for this module. Non-Approved, Allowed Algorithms with No Security Claimed: The module does not support any Non-Approved, Allowed Algorithms with No Security Claimed in the Approved Mode of operation. N/A for this module. Non-Approved, Not Allowed Algorithms: The module does not support any Non-Approved Algorithms that are not Allowed in the Approved Mode of operation. N/A for this module. 2.6 Security Function Implementations The table below lists the Security Function Implementations supported by the module. Name Type Description Properties Algorithms Message Digest SHA Compute a message digest SHA2-256: (A6518) Table 5: Security Function Implementations TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 9 of 22 2.7 Algorithm Specific Information There is no algorithm specific information. 2.8 RBG and Entropy N/A for this module. N/A for this module. 2.9 Key Generation The module does not implement any key generation methods. 2.10 Key Establishment The module does not implement any automated key establishment methods. 2.11 Industry Protocols The module does not implement any industry protocols. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 10 of 22 3 Cryptographic Module Interfaces 3.1 Ports and Interfaces The table below details the module Ports and Interfaces. Physical Port Logical Interface(s) Data That Passes Matrix-In- Data Data Input Data input (32b) Matrix-In- Addr Data Input Address of the input data word to write to (4b). It selects which 32b data-in word is accessed (out of 64B) Keys-Data- In Data Input Direct Data-input (128b) from KEYS function Matrix-Out- Addr Data Output Address of the output data to read from (3b) select which 32b data-out word is accessed (out of 32B) Matrix-Out- Data Data Output Data output (32b) from the SHA result Keys-Data- Out Data Output Direct Data-output (128b) to KEYS function (from Hash result) Reset Control Input Reset/Initialize the SHA module and internal states SHA-Start Control Input Start execution of SHA Iteration HASH-VER Status Output Indicates the module version CMVP- DONE Status Output If set, indicates the self-tests execution is complete CMVP-PASS Status Output If set, indicates the self-tests are passed with success SHA-BUSY Status Output If set, indicates that the SHA operation is being performed. Otherwise, the calculation is complete and module is idle N/A Power The entire device has a single power supply that provides the sub-chip cryptographic module with the expected power 1.8V relative to GND and a maximal current of 20mA Table 6: Ports and Interfaces TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 11 of 22 4 Roles, Services, and Authentication 4.1 Authentication Methods The module does not support authentication for roles. N/A for this module. 4.2 Roles The module supports two roles that an operator may assume: Crypto Officer (CO) role and User role. Roles are assumed implicitly based on the service accessed. The table below lists the Roles supported by the module. Name Type Operator Type Authentication Methods User Role User None Crypto Officer Role CO None Table 7: Roles 4.3 Approved Services The table below lists all Approved Services supported by the module. The abbreviations of the access rights to keys and SSPs have the following interpretation: G = Generate: The module generates or derives the SSP. R = Read: The SSP is read from the module (e.g., the SSP is output). W = Write: The SSP is updated, imported, or written to the module. E = Execute: The module uses the SSP in performing a cryptographic operation. Z = Zeroize: The module zeroizes the SSP. Name Description Indicator Inputs Outputs Security Functions SSP Access Module Initialization Secure initialization of the module N/A None None None Crypto Officer Message Digest SHA2-256 hash computation "Busy Bit" set to 1 Message Hash value Message Digest User Show Version Return the module version None None Module version None Crypto Officer Show Status Return the module status None None Module status None Crypto Officer On-Demand Self-test Initiate on- demand self- tests "Busy Bit" set to 1 CMVP_BIST command that is executed after a module Reset/Reboot Pass or Fail Message Digest Crypto Officer Zeroisation Zeroise all SSPs None Flush command None None Crypto Officer Table 8: Approved Services According to FIPS 140-3 IG 2.4.C, the module shall indicate when an approved cryptographic algorithm is being used, either by executing an approved security function or during the self-tests. Moreover, the FIPS 140-3 IG 2.4.C states that it is possible to define a static global indicator to provide this indication which in this case is the “Busy Bit” (SHA_BUSY). 4.4 Non-Approved Services The module does not support any Non-Approved Services. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 12 of 22 N/A for this module. 4.5 External Software/Firmware Loaded The module does not load external software or firmware. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 13 of 22 5 Software/Firmware Security 5.1 Integrity Techniques The module does not need to comply with this section because it is a purely hardware sub-chip cryptographic module defined into the TrustMe © secure flash memory. 5.2 Initiate on Demand As stated above, the module does not implement any integrity test that can be invoked on demand because it is a purely hardware sub-chip cryptographic module defined into the TrustMe © secure flash memory. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 14 of 22 6 Operational Environment 6.1 Operational Environment Type and Requirements Type of Operational Environment: Non-Modifiable TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 15 of 22 7 Physical Security 7.1 Mechanisms and Actions Required Mechanism Inspection Frequency Inspection Guidance Hard and opaque enclosure No actions are required to maintain the physical security of the module No actions are required to maintain the physical security of the module Table 9: Mechanisms and Actions Required The module is a sub-chip module implemented as part of a single-chip embodiment composed of production-grade components with a hard, opaque enclosure that is the TOEPP defined by the entire TrustMe © secure flash memory. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 16 of 22 8 Non-Invasive Security Currently, the ISO/IEC 19790:2012 non-invasive security area is not required by FIPS 140-3 (see NIST SP 800-140F). The requirements of this area do not apply to the module. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 17 of 22 9 Sensitive Security Parameters Management 9.1 Storage Areas The module does not store any SSP. N/A for this module. 9.2 SSP Input-Output Methods The module does not support SSP entry and output. N/A for this module. 9.3 SSP Zeroization Methods Although the module does not support SSP generation, SSP establishment, SSP entry and output, or SSP storage, the zeroization is implemented as required by the FIPS 140-3 standard to remove any information residues related to the message digest calculations by using the FLUSH command. Zeroization Method Description Rationale Operator Initiation FLUSH command FLUSH command is automatically executed by the module after completing the message digest operation. Remove any residual information related to the message digest calculation. Automatically done by the module. Table 10: SSP Zeroization Methods 9.4 SSPs The only cryptographic operation supported by the module is the computation of the message digest based on the SHA2-256 cryptographic algorithm, so the module does not use any SSP. N/A for this module. N/A for this module. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 18 of 22 10 Self-Tests This section specifies the pre-operational and conditional self-tests performed by the module. The pre-operational and conditional self-tests ensure that the module is not corrupted and that the cryptographic algorithms work as expected. 10.1 Pre-Operational Self-Tests Pre-operational Self-Tests are run upon the power-up/initialization of the module. The module transitions to the operational state only after the pre-operational self-tests are passed successfully. The design of the module ensures that all data output, via the data output interface, is inhibited whenever the module is in a pre-operational self-test condition. Because the module is purely hardware and contains neither software nor firmware, it implements the CAST as pre-operational self-tests. N/A for this module. 10.2 Conditional Self-Tests Conditional Self-Tests are run when an applicable security function or process is invoked. The Conditional Self-Tests are detailed in the table below. Algorithm or Test Test Properties Test Method Test Type Indicator Details Conditions SHA2-256 256-bit hash KAT CAST Successful initialization of the module Message digest Module Initialization Table 11: Conditional Self-Tests The module performs self-tests on all approved cryptographic algorithms supported in the Approved Mode of operation, using the tests shown in the table above. To ensure all conditional CASTs are performed before the first operational use of the associated algorithm, all CASTs are performed during the module’s initial power-up sequence. Services are not available, and data output (via the data output interface) is inhibited during self-tests. If any of these tests fail, the module transitions to the error state. 10.3 Periodic Self-Test Information All self-tests can be run on-demand, for periodic testing, by rebooting/resetting the module. N/A for this module. Algorithm or Test Test Method Test Type Period Periodic Method SHA2-256 KAT CAST On demand By rebooting/resetting the module Table 12: Conditional Periodic Information 10.4 Error States If any of the Pre-operational Self-Tests or Conditional Self-Tests fail, the module will output an error status and enter an error state, where all data output is inhibited. Upon entering an error state, an operator can attempt to clear the error state by resetting the module. The table below shows the different causes that lead to the Error States and the status indicators reported. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 19 of 22 Name Description Conditions Recovery Method Indicator Error The module's error state CAST Module reboot/reset Error Code (CMVP_DONE = 1, CMVP_PASS = 0, and SHA_BUSY = 0) Table 13: Error States TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 20 of 22 11 Life-Cycle Assurance 11.1 Installation, Initialization, and Startup Procedures No configuration of the module or installation steps are required by the operator. When the TrustMe © secure flash memory is powered on, the module also powers on and starts performing its power-up self-tests without any operator intervention. The module enters Approved Mode automatically if the power-up self-tests are completed successfully (the signals CMVP_DONE and CMVP_PASS will be set). If any of the self-tests fail during power-up, the module transitions to an Error state. The operator can verify that the module is in the Approved Mode of operation and that the FIPS-validated version is being used, by checking the module version and comparing it against the versioning information on the module certificate. The sub-chip cryptographic module version is contained into the HW_VER Register, which contains the TrustMe © secure flash memory hardware version, specified by using four bits in hexadecimal format (the penultimate value of the HW_VER Register): o SHA module version (HASH_VER): 0001 (1h) 11.2 Administrator Guidance None 11.3 Non-Administrator Guidance None 11.4 Design and Rules When the module is securely installed and initialized as detailed above, it initializes in Approved Mode which is the only mode of operation that complies with the following rules: 1. The module is initialized in the Approved Mode of operation automatically after the power-on self-tests are completed successfully. 2. Once the module is powered on, the power-on self-tests are executed automatically without any operator intervention. 3. All data output interfaces are inhibited during self-tests, zeroization, and error states. 4. The module does not support random number generation, SSP generation, SSP establishment, SSP entry and output, or SSP storage. 5. The module does not implement critical security functions to be tested during the self-test. 6. The module does not support a maintenance interface or maintenance role. 7. The module does not provide bypass capability. 8. The module does not implement authentication mechanisms. 9. The module is a purely hardware sub-chip that does not contain any software nor firmware, therefore, it executes the CAST during the pre-operational self-tests. 10. The module allows the CO to execute the self-test on-demand either by sending the CMVP_BIST command to the module or by rebooting/resetting the module. 11. If the module is in an error state, the cryptographic operativity will be disabled. 12. The normal operation of the module can be resumed from an error state by resetting the module. 13. The module does not implement non-invasive security measures. 14. The module does not implement mitigation of other attacks. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 21 of 22 11.5 End of Life The module does not require sanitization because it does not store any SSP and in addition, all the residues related to the message digest calculations are erased once the calculation is finished. TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip Cryptographic Module FIPS 140-3 Non-Proprietary Security Policy Winbond Electronics Corporation. 2025 This document may be reproduced and distributed only in its original entirety without revision. Page 22 of 22 12 Mitigation of Other Attacks The module does not offer mitigation of other attacks and therefore this section is not applicable.