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Reference: 2023-6-INF-4552- v1
Target: Limitada al expediente
Date: 23.05.2025
Created by: I003
Revised by: CALIDAD
Approved by: TECNICO
CERTIFICATION REPORT
Dossier # 2023-6
TOE SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA
Applicant 22099218J - Winbond Electronics Corporation
References
[EXT-8336] Certification Request
[EXT-9493] Evaluation Technical Report
Certification report of the product SpiFlash TrustME Secure Flash Memory
W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G version AA, as requested in [EXT-
8336] dated 08/02/2023, and evaluated by Applus Laboratories, as detailed in the Evaluation
Technical Report [EXT-9493] received on 05/03/2025.
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CONTENTS
EXECUTIVE SUMMARY...........................................................................................................................4
TOE SUMMARY...................................................................................................................................5
SECURITY ASSURANCE REQUIREMENTS ............................................................................................5
SECURITY FUNCTIONAL REQUIREMENTS...........................................................................................6
IDENTIFICATION.....................................................................................................................................6
SECURITY POLICIES.................................................................................................................................7
ASSUMPTIONS AND OPERATIONAL ENVIRONMENT .........................................................................7
CLARIFICATIONS ON NON-COVERED THREATS..................................................................................7
OPERATIONAL ENVIRONMENT FUNCTIONALITY ...............................................................................7
ARCHITECTURE.......................................................................................................................................8
LOGICAL ARCHITECTURE ....................................................................................................................8
PHYSICAL ARCHITECTURE...................................................................................................................8
DOCUMENTS..........................................................................................................................................9
PRODUCT TESTING.................................................................................................................................9
PENETRATION TESTING........................................................................................................................10
EVALUATED CONFIGURATION .............................................................................................................10
EVALUATION RESULTS .........................................................................................................................13
COMMENTS & RECOMMENDATIONS FROM THE EVALUATION TEAM...............................................13
CERTIFIER RECOMMENDATIONS .........................................................................................................13
GLOSSARY.............................................................................................................................................13
BIBLIOGRAPHY .....................................................................................................................................14
SECURITY TARGET / SECURITY TARGET LITE (IF APPLICABLE)..............................................................14
ETR FOR COMPOSITION IDENTIFICATION............................................................................................15
SITE TECHNICAL AUDIT REPORTS (STARs)............................................................................................15
STAR #1.............................................................................................................................................15
STAR #2.............................................................................................................................................15
STAR #3.............................................................................................................................................16
STAR #4.............................................................................................................................................16
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STAR #5.............................................................................................................................................16
RECOGNITION AGREEMENTS...............................................................................................................17
European Recognition of ITSEC/CC – Certificates (SOGIS-MRA)......................................................17
International Recognition of CC – Certificates (CCRA).....................................................................17
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EXECUTIVE SUMMARY
This document constitutes the Certification Report for the certification file of the product SpiFlash
TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G
version AA.
The Target of Evaluation is a Memory Flash IC.
Developer/manufacturer: Winbond Electronics Corporation
Sponsor: Winbond Electronics Corporation.
Certification Body: Centro Criptológico Nacional (CCN) del Centro Nacional de Inteligencia (CNI).
ITSEF: Nombre Laboratorio.
Protection Profile: None.
Evaluation Level: Common Criteria 3.1 R5 EAL5 + ALC_DVS.2 + AVA_VAN.5.
Evaluation end date: 11/04/2025
Expiration Date1: 20/05/2030
All the assurance components required by the evaluation level EAL5 (augmented with ALC_DVS.2 +
AVA_VAN.5) have been assigned a “PASS” verdict. Consequently, the laboratory Applus
Laboratories assigns the “PASS” VERDICT to the whole evaluation due all the evaluator actions are
satisfied for the EAL5 + ALC_DVS.2 + AVA_VAN.5, as defined by the Common Criteria 3.1 R5 and the
CEM 3.1 R5.
Considering the obtained evidences during the instruction of the certification request of the
product SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA, a positive resolution is proposed.
1
This date refers to the expiration date of the certificate recognition within the scope of the mutual recognition
arrangements signed by this Certification Body.
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TOE SUMMARY
The TOE is a memory flash IC designed to be embedded into highly critical hardware devices such as
smart card, secure element, USB token, secure micro SD, etc. These devices will embed secure
applications such as financial, telecommunication, identity (e-Government), etc and will be working
in a hostile environment. In particular, the TOE is dedicated to the secure storage of the code and
data of critical applications.
The security needs for the TOE consist in:
- Maintaining the integrity of the content of the memories and the confidentiality of the
content of protected memory areas as required by the critical HW products (e.g. Security IC)
the Memory Flash is built for.
- Providing a secure communication with the Host device that will embed the TOE in a secure
HW product such as Security IC.
SECURITY ASSURANCE REQUIREMENTS
The product was evaluated with all the evidence required to fulfil the evaluation level EAL5 and the
evidence required by the additional component ALC_DVS.2 + AVA_VAN.5 to the table, according to
Common Criteria v3.1 R5.
ASSURANCE CLASS ASSURANCE COMPONENT
ASE ASE_CCL.1
ASE_ECD.1
ASE_INT.1
ASE_OBJ.2
ASE_REQ.2
ASE_SPD.1
ASE.TSS.1
ADV ADV_ARC.1
ADV_FSP.5
ADV_IMP.1
ADV_INT.2
ADV_TDS.4
AGD AGD_OPE.1
AGD_PRE.1
ALC ALC_CMC.4
ALC_CMS.5
ALC_DEL.1
ALC_DVS.2
ALC_LCD.1
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ALC_TAT.2
ATE ATE_COV.2
ATE_DPT.3
ATE_FUN.1
ATE_IND.2
AVA AVA_VAN.5
SECURITY FUNCTIONAL REQUIREMENTS
The product security functionality satisfies the following functional requirements, according to the
Common Criteria v3.1 R5:
SECURITY FUNCTIONAL REQUIREMENTS
FRU_FLT.2
FPT_FLS.1/Detectors
FMT_LIM.1
FMT_LIM.2
FDP_SDC.1
FDP_SDI.2
FPT_PHP.3
FDP_ITT.1
FPT_ITT.1
FDP_IFC.1
FDP_UCT.1
FDP_UIT.1
FTP_TRP.1
FPT_FLS.1/Binding_Key
FDP_RIP.1
IDENTIFICATION
Product: SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA
Security Target: W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash
Memory Security Target (version I).
Protection Profile: None.
Evaluation Level: Common Criteria 3.1 R5 EAL5 + ALC_DVS.2 + AVA_VAN.5.
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SECURITY POLICIES
The use of the product SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA shall implement a set of security policies assuring the
fulfilment of different standards and security demands.
The detail of these policies is documented in the Security Target, section 3.4 (“Organisational
Security Policies”).
ASSUMPTIONS AND OPERATIONAL ENVIRONMENT
The following assumptions are constraints to the conditions used to assure the security properties
and functionalities compiled by the security target. These assumptions have been applied during
the evaluation in order to determine if the identified vulnerabilities can be exploited.
In order to assure the secure use of the TOE, it is necessary to start from these assumptions for its
operational environment. If this is not possible and any of them could not be assumed, it would not
be possible to assure the secure operation of the TOE.
The detail of these assumptions is documented in the Security Target, section 3.5 (“Assumptions”).
CLARIFICATIONS ON NON-COVERED THREATS
The following threats do not suppose a risk for the product SpiFlash TrustME Secure Flash Memory
W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G version AA, although the agents
implementing attacks have the attack potential according to the High of EAL5 + ALC_DVS.2 +
AVA_VAN.5 and always fulfilling the usage assumptions and the proper security policies
satisfaction.
For any other threat not included in this list, the evaluation results of the product security
properties and the associated certificate, do not guarantee any resistance.
The threats covered by the security properties of the TOE are those defined in the Security Target,
section 3.3 (“Threats”).
OPERATIONAL ENVIRONMENT FUNCTIONALITY
The product requires the cooperation from its operational environment to fulfil some of the
objectives of the defined security problem.
The security objectives declared for the TOE operational environment are those defined in the
Protection Profile and they are documented in the Security Target, section 4.2 (“Security Objectives
for the Operational Environment”).
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ARCHITECTURE
LOGICAL ARCHITECTURE
The main security features of the TOE are described as follows:
• Secure separation between Test mode and User mode. The confidentiality and the integrity
of the flash content are protected
• The confidentiality and the integrity of the transmitted data from/to the Host device are
protected by a secure channel;
• Integrity protection of the flash content by error detection codes
• Security sensors Active Shields against physical intrusive attacks
The logical interface of the TOE is made of Flash commands.
PHYSICAL ARCHITECTURE
The physical architecture is depicted in the following figure (the IC is identical for all the part
numbers).
The TOE consists of the following Hardware components
• Auxiliary array contains the flash specific data: the binding key (and its digest value), the
failure and session counters.
• Flash array stores the User data (i.e. the mass data including executable codes) and
translates SPI commands into Flash operations.
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• SFF (Secure Flash Front-end) which implements encrypted and authenticated interface for
Flash operation and supports Flash memories up to 4GB.
• Detectors of abnormal operating conditions.
The physical interface of the TOE with the external environment is the entire surface of the
Memory Flash module.
The electrical interface of the TOE with the external environment is made of the chip’s pads
including the data pins for SPI bus:
• Standard SPI: CLK, /CS, DI_IO0, DO_IO1
• Dual SPI: CLK, /CS, DI_IO0, DO_IO1
• Quad SPI: CLK, /CS, DI_IO0, DO_IO1, IO2, IO3
DOCUMENTS
The product includes the following documents that shall be distributed and made available
together to the users of the evaluated version.
• W75F40WxxBx AGD Preparative User Guide (version C).
• W75F40WxxCx AGD Preparative User Guide (version C).
• W75F40WxxBx AGD Operational User Guide (version B).
• W75F40WxxCx AGD Operational User Guide (version B).
• W75F40WxxCx/W75F40WxxBx Secure Flash Datasheet (version A5).
• SFI IP Functional Specification (version A2).
• W75F Pre-Binding Application Note (version B).
• HUID to pre-Binding Key mapping formula
PRODUCT TESTING
The developer has executed tests for all the security functions. All the tests have been performed
by the developer in its premises, with a satisfactory result.
During the evaluation process it has been verified each unit test checking that the security
functionality that covers has been identified and also that the kind of test is appropriate to the
function that is intended to test.
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All the tests have been developed using the testing scenario appropriate to the established
architecture in the security target. It has also been checked that the obtained results during the
tests fit or correspond to the previously estimated results.
To verify the results of the developer tests, the evaluator has applied sampling strategy and has
concluded that the information is complete and coherent enough to reproduce tests and identify
the functionality tested. Through the tests performed by the Laboratory, it is concluded that 100%
of the developer tests were covered.
In addition, the lab has devised a test for each of the security function of the product verifying that
the obtained results are consistent with the results obtained by the developer.
It has been checked that the obtained results conform to the expected results and in the cases
where a deviation in respect to the expected results was present, the evaluator has confirmed that
this variation neither represents any security problem nor a decrease in the functional capacity of
the product. Through the tests performed by the Laboratory it is concluded that 100% of the SFRs
and 100% of the TSFI groups defined in the Functional Specification are covered.
PENETRATION TESTING
Based on the list of potential vulnerabilities applicable to the TOE in is operational environment
[JIL-ATTPOT], the evaluation team has devised vulnerability analysis and attack scenarios for
penetration testing according to JIL supporting documents [JIL-ATTPOT] and [JIL-ARC]. Within these
activities all aspects of the security architecture which were not covered by functional testing have
been considered.
No attack scenario with the attack potential High according to Common Criteria v3.1 R5 has been
successful in the TOE’s operational environment as defined in the security target when all security
measures required by the developer are applied.
EVALUATED CONFIGURATION
The TOE is defined by its commercial name and version:
• Winbond SpiFlash® TrustME™ W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory version AA.
The acceptance procedure for the evaluated configuration of the TOE is described in section 2
“Acceptance procedure” of the preparative user guidance.
The identifiers used to mark the evaluated configuration of the TOE are:
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No Type Identifier Part Number Delivery
Method
Notes
Form of delivery: Known Good Die Device
1 HW IC Part number W75F40WWIB Via Courier 4Mb, 1.8V, Wafer Form, Industrial, No
Pre-bind, HW SFI
2 HW IC Part number W75F40WWJB Via Courier 4Mb, 1.8V, Wafer Form, Industrial Plus,
No Pre-bind, HW SFI
3 HW IC Part number W75F40WWWB Via Courier 4Mb, 1.8V, Wafer Form, Wireless, No
Pre-bind, HW SFI
4 HW IC Part number W75F40WWIC Via Courier 4Mb, 1.8V, Wafer Form, Industrial, Pre-
bind, HW SFI
5 HW IC Part number W75F40WWJC Via Courier 4Mb, 1.8V, Wafer Form, Industrial Plus,
Pre-bind, HW SFI
6 HW IC Part number W75F40WWWC Via Courier 4Mb, 1.8V, Wafer Form, Wireless, Pre-
bind, HW SFI
7 HW IC Part number W75F40WRIB Via Courier 4Mb, 1.8V, RDL Wafer Form, Industrial,
No Pre-bind, HW SFI
8 HW IC Part number W75F40WRJB Via Courier 4Mb, 1.8V, Wafer Form, Industrial Plus,
No Pre-bind, HW SFI
9 HW IC Part number W75F40WRWB Via Courier 4Mb, 1.8V, RDL Wafer Form, Wireless,
No Pre-bind, HW SFI
10 HW IC Part number W75F40WRIC Via Courier 4Mb, 1.8V, RDL Wafer Form, Industrial,
Pre-bind, HW SFI
11 HW IC Part number W75F40WRJC Via Courier 4Mb, 1.8V, RDL Wafer Form, Industrial
Plus, Pre-bind, HW SFI
12 HW IC Part number W75F40WRWC Via Courier 4Mb, 1.8V, RDL Wafer Form, Wireless,
Pre-bind, HW SFI
Form of delivery: Assembled Device
1 HW IC Part number W75F40WBYICG Via Courier 4Mb, 1.8V, WLCSP, Industrial, Pre-bind,
HW-SFI, Green package
2 HW IC Part number W75F40WQ3ICG Via Courier 4Mb, 1.8V, QFN32, Industrial, Pre-bind,
HW-SFI, Green package
3 HW IC Part number W75F40WBYIBG Via Courier 4Mb, 1.8V, WLCSP, Industrial, No Pre-
bind, HW-SFI, Green package
4 HW IC Part number W75F40WQ3IBG Via Courier 4Mb, 1.8V, QFN32, Industrial, No Pre-
bind, HW-SFI, Green package
5 HW IC Part number W75F40WBYWCG Via Courier 4Mb, 1.8V, WLCSP, Wireless, Pre-bind,
HW-SFI, Green package
6 HW IC Part number W75F40WQ3WCG Via Courier 4Mb, 1.8V, QFN32, Wireless, Pre-bind,
HW-SFI, Green package
7 HW IC Part number W75F40WBYWBG Via Courier 4Mb, 1.8V, WLCSP, Wireless, No Pre-
bind, HW-SFI, Green package
8 HW IC Part number W75F40WQ3WBG Via Courier 4Mb, 1.8V, QFN32, Wireless, No Pre-
bind, HW-SFI, Green package
9 HW IC Part number W75F40WBYJCG Via Courier 4Mb, 1.8V, WLCSP, Industrial plus, Pre-
bind, HW-SFI, Green package
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No Type Identifier Part Number Delivery
Method
Notes
10 HW IC Part number W75F40WQ3JCG Via Courier 4Mb, 1.8V, QFN32, Industrial plus, Pre-
bind, HW-SFI, Green package
11 HW IC Part number W75F40WBYJBG Via Courier 4Mb, 1.8V, WLCSP, Industrial plus, No
Pre-bind, HW-SFI, Green package
12 HW IC Part number W75F40WQ3JBG Via Courier 4Mb, 1.8V, QFN32, Industrial plus, No
Pre-bind, HW-SFI, Green package
Form of delivery: Associated IC Dedicated Documentation
No Type Identifier Version Delivery
Method
Full Name Hash Notes
1 PDF W75F40WxxBx
AGD Preparative
User Guide
C Encrypted
mail
W75F40WxxBx_A
GD_PRE_RevC_21
Nov23.pdf
db882c00381109c682
943d5e8529eda73ccb
b5f907e52863bdfa4f5
641b5966f
2 PDF W75F40WxxCx
AGD Preparative
User Guide
C Encrypted
mail
W75F40WxxCx_A
GD_PRE_RevC_21
Nov23.pdf
2fab87fc33a77b354c4
63ac8a90f76472594f1
63fe697d03e1473d73
8dba21e2
3 PDF W75F40WxxBx
AGD Operational
User Guide
B Encrypted
mail
W75F40WxxBx_A
GD_OPE_RevB_14
Jun23.pdf
e07c660c0ccfd1a9ee5
b4876441b1f0c501b7f
83039e7f1139d454a8
ac2adeb2
4 PDF W75F40WxxCx
AGD Operational
User Guide
B Encrypted
mail
W75F40WxxCx_A
GD_OPE_RevB_14
Jun23.pdf
6b830089fbda5db400
d3cdc05378979c5201
579b30018a5a830949
20df6eb6e2
5 PDF W75F40WxxCx/
W75F40WxxBx
Secure Flash
Datasheet
A5 Mail W75F40WxxBx_
W75F40WxxCx_D
atasheet_RevA5_
20Nov23.pdf
2bb12f23755aa36902
40c8e9817c070d4ca3
82188668eb095ba5a5
45d005c17e
For all
6 PDF SFI IP Functional
Specification
A2 Encrypted
mail
SFI3_FS_v3.22_Re
vA2_210728.pdf
85e21393db862cd3c7
b51fb4802bcf22ddb91
739d7276005aa7c719
797da7e34
For all
7 PDF W75F Pre-
Binding
Application Note
B Encrypted
mail
W75F Pre-Binding
AN RevB
11May23.pdf
4e2063aec42fd25940c
16dc497328b2847afc0
688034db1369d46a2f
b6de6601
8 PDF HUID to pre-
Binding Key
mapping formula
N/A Encrypted
mail
N/A N/A
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EVALUATION RESULTS
The product SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA has been evaluated against the Security Target
W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory Security
Target (version I).
All the assurance components required by the evaluation level EAL5 + ALC_DVS.2 + AVA_VAN.5
have been assigned a “PASS” verdict. Consequently, the laboratory Applus Laboratories assigns the
“PASS” VERDICT to the whole evaluation due all the evaluator actions are satisfied for the
evaluation level EAL5 + ALC_DVS.2 + AVA_VAN.5, as defined by the Common Criteria 3.1 R5 and the
CEM 3.1 R5.
COMMENTS & RECOMMENDATIONS FROM THE EVALUATION TEAM
Next, recommendations regarding the secure usage of the TOE are provided. These have been
collected along the evaluation process and are detailed to be considered when using the product.
The evaluation team makes the following security recommendations:
• To follow the security guidance’s of the TOE strictly.
• To keep the TOE under personal control and set all other security measures available from
the environment.
CERTIFIER RECOMMENDATIONS
Considering the obtained evidences during the instruction of the certification request of the
product SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA, a positive resolution is proposed.
GLOSSARY
CCN Centro Criptológico Nacional
CNI Centro Nacional de Inteligencia
EAL Evaluation Assurance Level
ETR Evaluation Technical Report
OC Organismo de Certificación
TOE Target Of Evaluation
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BIBLIOGRAPHY
The following standards and documents have been used for the evaluation of the product:
[CC_P1] Common Criteria for Information Technology Security Evaluation Part 1: Introduction and
general model, Version 3.1, R5 Final, April 2017.
[CC_P2] Common Criteria for Information Technology Security Evaluation Part 2: Security functional
components, Version 3.1, R5 Final, April 2017.
[CC_P3] Common Criteria for Information Technology Security Evaluation Part 3: Security assurance
components, Version 3.1, R5 Final, April 2017.
[CEM] Common Methodology for Information Technology Security Evaluation: Version 3.1, R5 Final,
April 2017.
[JIL-ATTPOT] Application of Attack Potential to Smartcards. Joint Interpretation Library. Version 3.2.
November 2022. Joint Interpretation Library.
[JIL-ARC] Security Architecture requirements (ADV_ARC) for Smart Cards and similar devices,
version 2.1. July 2021. Joint Interpretation Library.
[START] Joint Interpretation Library. Site Technical Audit Report Template. Version 1.0. February
2018.
[CCDB-2006-04-004] ST sanitising for publication. CCMC. April 2006.
[ST] W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory Security
Target (version I).
[ST Lite] W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory
Security Target (version I).
SECURITY TARGET / SECURITY TARGET LITE (IF APPLICABLE)
Along with this certification report, the complete security target of the evaluation is stored and
protected in the Certification Body premises. This document is identified as:
- W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory
Security Target (version I).
The public version of this document constitutes the ST Lite. The ST Lite has also been reviewed for
the needs of publication according to [CCDB-2006-04-004], and it is published along with this
certification report in the Certification Body and CCRA websites. The ST Lite identifier is:
- W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G Secure Flash Memory
Security Target (version I1).
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ETR FOR COMPOSITION IDENTIFICATION
The evaluation activities carried out in this certification dossier have been summarized in an
Evaluation Technical Report for composite evaluation (ETR_COMP). This ETR_COMP has been
validated by this Certification Body. The reference of the ETR_COMP is:
• Report name: ETR for composite evaluation. W75F40W[W/R][I/J/W][B/C] &
W75F40W[BY/Q3][I/J/W][C/B]G version AA.
• Report ID: CCEWIN007-EFC-M1.
• Version: M1.
• Issue Date: 04/03/2025.
• SHA256: 2a249e23348d3c74136e283b029f724da7a1fecb3da052b81f76f8e2f6245d52.
• Issuing ITSEF: Applus Laboratories.
SITE TECHNICAL AUDIT REPORTS (STARs)
The site visits carried out within this dossier have been summarized in five Site Technical Audit
Report (STAR). These STAR reports have been validated by this Certification Body according to
[START]. The reference of the STAR are:
STAR #1
• Report name: Site technical audit report (STAR). DTF Kitakami and DTF Kawasaki.
• Report ID: CCEWIN007-STAR-M0-DTF.
• Version: M0.
• Issue Date: 16/12/2024.
• Issuing ITSEF: Applus Laboratories.
• Site audit dates: 05-06/06/2023.
STAR #2
• Report name: Site technical audit report (STAR). KSC Kawasaki and KSC Mitaka.
• Report ID: CCEWIN007-STAR-M0-KSC.
• Version: M0.
• Issue Date: 16/12/2024.
• Issuing ITSEF: Applus Laboratories.
• Site audit dates: 07-08/06/2023.
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STAR #3
• Report name: Site technical audit report (STAR). Winbond America (WECA).
• Report ID: CCEWIN007-STAR-M0-WECA.
• Version: M0.
• Issue Date: 16/12/2024.
• Issuing ITSEF: Applus Laboratories.
• Site audit dates: 12/06/2023.
STAR #4
• Report name: Site technical audit report (STAR). Winbond Taichung (WECT) and Winbond
Jhubei (WEJB).
• Report ID: CCEWIN007-STAR-M0-WECT-WEJB.
• Version: M0.
• Issue Date: 16/12/2024.
• Issuing ITSEF: Applus Laboratories.
• Site audit dates: 08-11/05/2023.
STAR #5
• Report name: Site technical audit report (STAR). Winbond Israel (WTL)
• Report ID: CCEWIN007-STAR-M0-WTL.
• Version: M0.
• Issue Date: 16/12/2024.
• Issuing ITSEF: Applus Laboratories.
• Site audit dates: 14/05/2023.
These STAR reports constitute evaluation evidence, therefore according to article 25 of Presidential
Order PRE/2740/2007 which regulates the CCN Certification Body, written authorization must be
requested by Applus Laboratories to the Certification Body to share any information of this
certification dossier (including any of the STAR reports) with third parties.
It is expected that if the applicant Winbond Electronics Corporation is willing to share any of these
STAR reports with any third party, they may contact Applus Laboratories to perform an
authorization request to the CCN Certification Body to distribute this report.
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RECOGNITION AGREEMENTS
In order to avoid multiple certification of the same product in different countries a mutual
recognition of IT security certificates - as far as such certificates are based on ITSEC or CC - under
certain conditions was agreed.
European Recognition of ITSEC/CC – Certificates (SOGIS-MRA)
The SOGIS-Mutual Recognition Agreement (SOGIS-MRA) Version 3 became effective in April 2010. It
defines the recognition of certificates for IT-Products at a basic recognition level and, in addition, at
higher recognition levels for IT-Products related to certain SOGIS Technical Domains only.
The basic recognition level includes Common Criteria (CC) Evaluation Assurance Levels EAL 1 to EAL
4 and ITSEC Evaluation Assurance Levels E1 to E3 (basic). For "Smartcards and similar devices" a
SOGIS Technical Domain is in place. For "HW Devices with Security Boxes" a SOGIS Technical
Domains is in place, too. In addition, certificates issued for Protection Profiles based on Common
Criteria are part of the recognition agreement.
The new agreement has been signed by the national bodies of Austria, Finland, France, Germany,
Italy, The Netherlands, Norway, Spain, Sweden and the United Kingdom. The current list of
signatory nations and approved certification schemes, details on recognition, and the history of the
agreement can be seen on the website at https://www.sogis.eu.
The SOGIS-MRA logo printed on the certificate indicates that it is recognised under the terms of this
agreement by the nations listed above.
The certificate of this TOE is recognized under SOGIS-MRA for all assurance components selected.
International Recognition of CC – Certificates (CCRA)
The international arrangement on the mutual recognition of certificates based on the CC (Common
Criteria Recognition Arrangement, CCRA-2014) has been ratified on 08 September 2014. It covers
CC certificates based on collaborative Protection Profiles (cPP) (exact use), CC certificates based on
assurance components up to and including EAL 2 or the assurance family Flaw Remediation
(ALC_FLR) and CC certificates for Protection Profiles and for collaborative Protection Profiles (cPP).
The CCRA-2014 replaces the old CCRA signed in May 2000 (CCRA-2000). Certificates based on CCRA-
2000, issued before 08 September 2014 are still under recognition according to the rules of CCRA-
2000. For on 08 September 2014 ongoing certification procedures and for Assurance Continuity
(maintenance and re-certification) of old certificates a transition period on the recognition of
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certificates according to the rules of CCRA-2000 (i.e. assurance components up to and including EAL
4 or the assurance family Flaw Remediation (ALC_FLR)) is defined until 08 September 2017.
As of September 2014 the signatories of the new CCRA-2014 are government representatives from
the following nations: Australia, Austria, Canada, Czech Republic, Denmark, Finland, France,
Germany, Greece, Hungary, India, Israel, Italy, Japan, Malaysia, The Netherlands, New Zealand,
Norway, Pakistan, Republic of Korea, Singapore, Spain, Sweden, Turkey, United Kingdom, and the
United States.
The current list of signatory nations and approved certification schemes can be seen on the
website: http://www.commoncriteriaportal.org.
The Common Criteria Recognition Arrangement logo printed on the certificate indicates that this
certification is recognised under the terms of this agreement by the nations listed above.
The certificate of this TOE is recognized under CCRA for all assurance components up to EAL2 and
ALC_FLR.